Patents for C23C 18 - Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating (16,252)
07/2001
07/24/2001US6265020 Applying solution to printed circuit; inversion
07/24/2001US6264806 Plating fluid replenishment system and method
07/24/2001US6263904 Corrosion resistant gas cylinder and gas delivery system
07/19/2001WO2001051276A2 Fabrication of metallic microstructures via exposure of photosensitive composition
07/19/2001DE10001565A1 Method for production of a photo-active surface layer where heat-treatment is in short busts so that sub-surface layers are unaffected by the heat, thus broadening the range of materials the surface layers can be used with
07/19/2001CA2396570A1 Fabrication of metallic microstructures via exposure of photosensitive composition
07/18/2001EP1117283A1 Printed wiring board and its manufacturing method
07/18/2001EP1115503A1 Electroless metal deposition of electronic components in an enclosable vessel
07/18/2001CN1303955A Environment-protecting type metal alloy plating solution
07/18/2001CN1303954A Solution for forming strong dielectric film and process for forming strong dielectric film
07/17/2001US6261954 Method to deposit a copper layer
07/17/2001US6261697 Oxidation surface treatment; plating
07/17/2001US6261671 Curing heat resistant resin
07/17/2001US6261644 Process for the electroless deposition of copper coatings on iron and iron alloy surfaces
07/17/2001US6261637 Use of palladium immersion deposition to selectively initiate electroless plating on Ti and W alloys for wafer fabrication
07/17/2001US6261466 Composition for circuit board manufacture
07/17/2001US6261435 Plating pretreatment method comprising vibrationally stirring treatment bath, aerating treatment bath, swinging plating target, and applying vibration to plating target simultaneously in single tank at a time
07/12/2001WO2001049898A1 Method for metal plating, pre-treating agent, and semiconductor wafer and semiconductor device using the same
07/12/2001WO2001049897A2 Method for characterization and quality control of porous media
07/12/2001CA2394221A1 Method for characterization and quality control of porous media
07/11/2001EP1114882A2 Apparatus and method for depositing an electroless solution
07/11/2001EP1113987A1 Process for preparing silica or silica-based thick vitreous films according to the sol-gel technique and thick films thereby obtained
07/11/2001EP1113886A1 Silver film incorporating protective insoluble metallic salt precipitate
07/11/2001EP1113885A1 Printing of electronic circuits and components
07/11/2001CN1303447A Method and device for electrodialytic regeneration of electroless metal deposition bath
07/10/2001US6258415 Immersion in zincate solution; electroless nickel plating;electrodeposition iron
07/10/2001US6258411 Pregrounding; overcaoting nickel alloy with fluorine
07/10/2001US6258223 In-situ electroless copper seed layer enhancement in an electroplating system
07/10/2001US6258157 Beta-diketonates
07/10/2001US6257732 Using mixture of hydrochloric acid, stannous chloride and palladium chloride solution
07/05/2001WO2001048800A1 Semiconductor wafer processing apparatus and processing method
07/05/2001WO2001048762A1 Ceramic capacitor electrode-forming paste
07/05/2001WO2001048274A1 Apparatus for plating substrate, method for plating substrate, electrolytic processing method, and apparatus thereof
07/05/2001US20010006722 Substrate having repaired metallic pattern and method and device for repairing metallic pattern on substrate
07/04/2001EP1112392A1 Method for printing a catalyst on substrates for electroless deposition
07/04/2001EP1112390A2 Fluxing process for galvanization of steel
07/04/2001CN1302235A Low etch alkaline zincate composition and process for zincating aluminum
07/04/2001CN1301882A Silver mirror reduction preparation
07/04/2001CN1301881A Chemical nickel-plating solution and its preparation and using method
06/2001
06/28/2001WO2001046494A1 Electroless plating solution and method of forming wiring with the same
06/28/2001WO2000003072A9 Method and apparatus for copper plating using electroless plating and electroplating
06/27/2001EP1111090A2 Method for partially plating on a base
06/27/2001EP1111089A1 Method of sealing a porous layer onto the surface of an object, in particular for sealing a thermally sprayed layer
06/27/2001EP1111088A2 Solution and method for forming a ferroelectric film
06/27/2001EP1110600A2 Reaction vessel for use with supercritical water and method for manufacturing the same
06/27/2001EP1109627A1 Manufacturing process for noncontinuous galvanization with zinc-aluminum alloys over metallic manufactured products
06/27/2001CN1300877A Local electroplating method for substrate
06/26/2001US6252175 Electronic assembly comprising a substrate and a plurality of springable interconnection elements secured to terminals of the substrate
06/26/2001US6251803 Method for forming a titanium dioxide layer
06/26/2001US6251528 Method to plate C4 to copper stud
06/26/2001US6251482 Forming a silver coating on a vitreous substrate
06/26/2001US6251252 Metalization of non-hermetic optical fibers
06/26/2001US6251249 Precious metal deposition composition and process
06/21/2001DE19957067A1 Monitoring current-less metal deposition involves measuring current between active test substrate in metallization solution and counter electrode
06/20/2001EP1109434A2 Transparent electromagnetic radiation shield material and method of producing the same
06/20/2001EP1108802A1 Stainless steel material with excellent antibacterial property and process for producing the same
06/20/2001EP0839167B1 Titanium-containing nacreous pigments
06/20/2001EP0616723B1 Process for fabricating layered superlattice materials
06/19/2001US6248658 Method of forming submicron-dimensioned metal patterns
06/19/2001US6247799 Ferroelectric element, process for producing the same, and ink jet head
06/17/2001CA2328028A1 Transparent electromagnetic radiation shield material and method of producing the same
06/14/2001US20010003631 Method for sealing a porous layer at the surface of a body, in particular for the sealing of a thermal spray layer
06/13/2001EP1107332A2 Photoelectric conversion device
06/13/2001EP1106712A1 Method and apparatus of producing thin film of metal or metal compound
06/13/2001EP1106645A2 Silver-plated laminated body and method of manufacturing same
06/13/2001CA2325218A1 Method for sealing a porous layer at the surface of a body, in particular for the sealing of a thermal spray layer
06/12/2001US6246247 Probe card assembly and kit, and methods of using same
06/12/2001US6245389 Using plating solution of nickel hypophosphite
06/07/2001WO2001041204A1 Method and apparatus for forming thin film of metal
06/07/2001WO2001040545A1 Patterned hydrophilic-oleophilic metal oxide coating and method of forming
06/07/2001WO2001040536A1 Polycrystalline thin film and method for preparation thereof, and superconducting oxide and method for preparation thereof
06/07/2001US20010002624 Tip structures.
06/06/2001EP0616726B1 Layered superlattice material applications
06/05/2001US6242803 Semiconductor devices with integral contact structures
05/2001
05/31/2001WO2001038940A2 Method for surface patterning using a focused laser
05/31/2001WO2001038604A1 Accelerator solution for direct plating and method for direct plating
05/31/2001WO2001038603A2 Metallizing method for dielectrics
05/31/2001WO2001038086A1 Member having metallic layer, its manufacturing method, and its application
05/31/2001DE19957130A1 Metallizing dielectric materials comprises applying a photosensitive dielectric to a substrate, irradiating the dielectric through a mask, growing a metal, subjecting to high temperatures and chemically metallizing
05/30/2001EP1103634A1 Method for contact plated copper deposition
05/30/2001EP1103633A1 Method for copper plating deposition
05/30/2001EP1103070A1 Low temperature process for fabricating layered superlattice materials and making electronic devices including same
05/30/2001EP1103069A1 Misted precursor deposition apparatus and method with improved mist and mist flow
05/30/2001EP1102872A1 Novel organocuprous precursors for chemical vapor deposition of a copper film
05/30/2001EP0883699B1 Method and devices for the electrolytic formation of a deposit on an assembly of selected electrodes
05/30/2001CN1297578A Process for formation of silicon oxide films
05/30/2001CN1297576A Method for forming silicon film and ink composition for ink jet
05/30/2001CN1297490A Method for coating surfaces of copper or of copper alloy with tin or tin alloy layer
05/30/2001CN1297471A Coating composition
05/30/2001CN1066479C Chemical reducing solution for copper oxide
05/29/2001US6238965 Method for forming a titanium dioxide layer
05/29/2001US6238749 Method of providing a metal pattern on an electrically insulating substrate in an electroless process
05/29/2001US6238734 Liquid precursor mixtures for deposition of multicomponent metal containing materials
05/23/2001EP1101072A1 A method for preventing water accumulation and ice formation on the evaporators and condensers of refrigerators
05/23/2001EP1100638A1 Casting steel strip
05/23/2001EP0730500B1 Ammonia-free deposition of copper by disproportionation
05/23/2001CN1296375A Method for filling through hole
05/23/2001CN1296086A Economic type special surface alloy catalyzing liquid
05/22/2001US6235402 Multilayer
05/22/2001US6235401 Overcoating with titanium dioxide; drying; roasting