| Patents for C23C 18 - Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating (16,252) |
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| 04/02/2002 | US6363610 Gas turbine rotor bimetallic ring seal and method therefor |
| 03/28/2002 | WO2001069640A3 Method for applying metallic strip conductors acting as electrodes on a channel plate made of glass for large-surface flat screens |
| 03/28/2002 | US20020036847 Method for forming a metallic mirror surface on an underlay |
| 03/28/2002 | US20020036143 Method of electroless plating and electroless plating apparatus |
| 03/28/2002 | DE10134961A1 Coating substrate surface with metal or alloy using electrolyte solution, e.g. for galvanizing wafer, involves applying stabilizer to substrate surface to maintain metal or alloy in electrolyte solution |
| 03/28/2002 | DE10042228A1 Verfahren zur Beschichtung einer Vielzahl gleicher Grundkörper und Verwendung des Verfahrens A process for coating a plurality of identical basic body and use of the method |
| 03/27/2002 | EP1191127A1 Process for selective metallization of dielectric materials |
| 03/27/2002 | EP0770265B1 Method of forming doped bst layers and integrated circuit capacitors comprising magnesium doped bst layers |
| 03/27/2002 | EP0769206B1 Thin films of abo3 with excess a-site and b-site modifiers and method of fabricating integrated circuits with same |
| 03/27/2002 | CN1341775A Metal surface treatment liquor and its application method |
| 03/26/2002 | US6362503 Low temperature process for fabricating layered superlattice materials and making electronic devices including same |
| 03/26/2002 | US6362121 Substrate with a photocatalytic coating based on titanium dioxide and organic dispersions based on titanium dioxide |
| 03/26/2002 | US6362099 Providing a barrier layer having a first surface that is substantially unoxidized; depositing a first copper layer onto the first surface of the barrier layer, wherein the first copper layer is deposited from a precursor |
| 03/26/2002 | US6362090 Plating copper on a copper pad via electroless plating to form a copper plated layer; plating nickel on said copper plated layer via electroless plating to form a nickel plated layer |
| 03/26/2002 | US6361824 Immersing substrate to be coated vertically within beaker containing mixture of silver amine complex with reducing solution, depositing coating; x-ray imaging screens |
| 03/26/2002 | US6361823 Process for whisker-free aqueous electroless tin plating |
| 03/26/2002 | CA2065605C Formulation for the activation of substrate surfaces for currentless metallisation thereof |
| 03/21/2002 | WO2002023962A2 Method for the formation of a pattern on an insulating substrate |
| 03/21/2002 | WO2002022909A1 Electroless gold plating solution and method for electroless gold plating |
| 03/21/2002 | WO2001081671B1 Methods and fabrics for combating nosocomial infections |
| 03/21/2002 | US20020034885 Coating film and method of producing the same |
| 03/21/2002 | US20020033340 Method and apparatus for conditioning electrochemical baths in plating technology |
| 03/21/2002 | DE10017887C1 Selective, metal-based activation of substrates for wet-chemical, electroless plating, especially on circuit board for microelectronic device, uses vesicles to transport activator metal or precursor to selected area |
| 03/21/2002 | DE10015214C1 Verfahren zur Metallisierung eines Isolators und/oder eines Dielektrikums A process for the metallization of an insulator and / or a dielectric |
| 03/20/2002 | EP0665981B1 Process for fabricating layered superlattice materials and electronic devices including same |
| 03/20/2002 | CN1341277A Apparatus for plating semiconductor substrate, method for plating semiconductor substrate |
| 03/20/2002 | CN1341166A Semiconductor wafer electroplating and electrolyzing apparatus and method |
| 03/19/2002 | US6359035 For producing multilayer printed wiring boards, does not cause dust explosion, dielectrics |
| 03/19/2002 | US6358566 Process for producing decorative beverage can bodies |
| 03/19/2002 | US6358390 Obtaining a surface charge on ceramic materiall depositing an electroconductive material on surface of ceramic material; activating electroconductive material; electrolytically plating metal on surface of electroconductive material |
| 03/14/2002 | WO2002020872A2 Uv curable silver chloride compositions for producing silver coatings |
| 03/14/2002 | US20020031671 Fabrication of pure and modified Ta2O5 thin film with enhanced properties for microwave communication, dynamic random access memory and integrated electronic applications |
| 03/14/2002 | US20020030283 Semiconductor device having wires and insulator layers with via-studs |
| 03/14/2002 | US20020029974 Method and apparatus of purifying an electrolyte |
| 03/14/2002 | CA2421807A1 Uv curable silver chloride compositions for producing silver coatings |
| 03/12/2002 | US6355301 Providing a non-conducting substrate having an uncoated portion; treating with sensitizer solution to provide a sensitized portion; covering sensitized portion with an activator solution; coating with stannous salt solution |
| 03/07/2002 | WO2002019313A1 Chord winder for stringed instrument |
| 03/07/2002 | WO2002018677A1 Method for coating a number of similar base bodies and use of said method |
| 03/06/2002 | EP1184898A1 Method and apparatus for forming thin film of metal |
| 03/06/2002 | EP1184487A1 Process for purifying an electrolyte |
| 03/06/2002 | EP0842229B1 Plate-like titanium dioxide reduction pigment |
| 03/06/2002 | CN2480380Y Liquid deposit generator |
| 03/05/2002 | US6352790 Substrate containing silicon and a barrier layer which functions as a protective/thermal barrier coating |
| 02/28/2002 | WO2002016673A1 Electrochemical treating method such as electroplating and electrochemical reaction device therefor |
| 02/28/2002 | WO2002016668A1 Electroless displacement gold plating solution and additive for preparing said plating solution |
| 02/28/2002 | WO2002016149A1 Processing method of creating rainbow color, method of manufacturing article which presents rainbow-coloured reflective luster, and article which presents rainbow-coloured reflective luster |
| 02/28/2002 | WO2002016059A2 Narrow diameter needle having reduced inner diameter tip |
| 02/28/2002 | WO2001055478A3 Method and device for depositing a precursor on a substrate, said precursor being present in liquid form |
| 02/28/2002 | WO2001049897A3 Method for characterization and quality control of porous media |
| 02/28/2002 | US20020023845 Platable engineered polyolefin alloys |
| 02/28/2002 | US20020023773 Method for manufacturing raised electrical contact patten of controlled geometry |
| 02/27/2002 | CN1338008A Heat exchanger with a reduced tendency to produce deposits and method for producing same |
| 02/21/2002 | US20020022081 Electrocatalyst or protective coatings; in situ activation;blowing heated air through jet |
| 02/21/2002 | US20020020627 Filling a metal such as copper in fine interconnection pattern recesses on a semiconductor |
| 02/21/2002 | DE10121774A1 Material for ball-grid arrays comprises a plating layer formed from two metals which are mixed together on a metal material as the base material and a covering layer formed from the metal on the plating layer |
| 02/20/2002 | EP1180681A1 Gas sensing element and method for manufacturing the same |
| 02/20/2002 | EP1088121B1 Method for metal coating of substrates |
| 02/20/2002 | CN2477931Y Anti-corrosion pipe having chemical nickel plated phosphorus alloy layer for steam condenser |
| 02/20/2002 | CN1079449C Self-catalytic nickel alloy plating layer and plating process thereof |
| 02/19/2002 | US6348737 Metallic interlocking structure |
| 02/19/2002 | US6348240 Methods for and products of modification and metallization of oxidizable surfaces, including diamond surfaces, by plasma oxidation |
| 02/19/2002 | US6348239 Depositing amorphous film of metal precursor complex on substrate, irradiating film to cause metal complex to undergo reaction which transforms metal complex into metal containing material adherent to substrate |
| 02/14/2002 | US20020018861 Methods for the lithographic deposition of materials containing nanoparticles |
| 02/14/2002 | US20020017465 Filling copper into recesses for interconnects formed on a semiconductor and removing a plating liquid remaining on the substrate-contacting portion with suction |
| 02/13/2002 | EP1179861A2 Piezoelectric element and process for producing the same |
| 02/13/2002 | EP1179618A2 Plating apparatus and plating liquid removing method |
| 02/13/2002 | EP1179617A1 Apparatus for plating substrate, method for plating substrate, electrolytic processing method, and apparatus thereof |
| 02/07/2002 | WO2002011503A1 Method for making a circuitry comprising conductive tracks, chips and micro-vias and use of same for producing printed circuits and multilayer modules with high density of integration |
| 02/07/2002 | WO2002009884A2 Methods for the lithographic deposition of materials containing nanoparticles |
| 02/07/2002 | US20020015244 A coating process for forming a metallic mirror surface on a receiving surface |
| 02/07/2002 | US20020014282 Surface modified stainless steel |
| 02/07/2002 | CA2417159A1 Method for making a circuitry comprising conductive tracks, chips and micro-vias and use of same for producing printed circuits and multilayer modules with high density of integration |
| 02/06/2002 | EP1178493A1 Ceramic capacitor electrode-forming paste |
| 02/06/2002 | EP1178129A1 Polycrystalline thin film and method for preparation thereof, and superconducting oxide and method for preparation thereof |
| 02/06/2002 | EP0807190B1 Process for producing metal-coated materials |
| 02/06/2002 | CN1335045A Process for depositing conducting layer on substrate |
| 02/06/2002 | CN1334358A Process for preparing concentrated liquid specially adapted for chemical spray coating of Ni and its application method |
| 02/05/2002 | US6344278 Coating method of amorphous type titanium peroxide |
| 02/05/2002 | US6344277 Reacting ticl4 solution with nh4oh solution at ph 2 to 6, to sediment lightly bluish white orthotitanic acid hydrate; reacting with h2o2 stirring at a low temperature, thereby obtaining a reaction product; curing |
| 02/05/2002 | US6344242 Metal alkoxide mixed with solvent, acid, chloride salt or acid chloride, catalytic metal salt, no prior etching or conditioning needed |
| 02/05/2002 | US6343855 Ferroelectric element process for producing the same and ink jet head |
| 01/31/2002 | WO2002008490A1 Coating material for forming titanium oxide film, method for forming titanium oxide film and use of said coating material |
| 01/31/2002 | US20020012868 Composition for forming electroconductive film such as electrode or wiring, method for forming electroconductive film such as electrode or wiring, and method for producing electron emitting device, electron source and image forming apparatus |
| 01/31/2002 | US20020011176 Electroless copper plating bath, electroless copper plating method and electronic part |
| 01/30/2002 | CN1333843A Process for metallizing a plastic surface |
| 01/30/2002 | CN1333561A Method for preparing non-electroplating more than two layers of metal convex blocks |
| 01/30/2002 | CN1333387A Method for making light tye composite hollow metal microball |
| 01/29/2002 | US6342733 Structure having thin metal layer on copper surface to reduce susceptibility to electromigration, oxidation, corrosion, stress voiding and delamination during subsequent chip processing and/or chip utilization |
| 01/24/2002 | WO2002006561A2 Process for deposition of metal on a surface |
| 01/24/2002 | WO2001081671A3 Methods and fabrics for combating nosocomial infections |
| 01/24/2002 | US20020008227 Multilayer coating |
| 01/24/2002 | CA2415736A1 Process for deposition of metal on a surface |
| 01/23/2002 | EP1174912A1 Semiconductor wafer processing apparatus and processing method |
| 01/23/2002 | CN1332810A Method for coating reactors for high pressure polymerisation of 1-olefins |
| 01/23/2002 | CN1332270A Composite coating containing nanometer inorganic fullerene material and its prepn |
| 01/23/2002 | CN1332269A Chemical bismuth plating process |
| 01/17/2002 | WO2002004705A1 Method for preliminary treatment of material to be subjected to electroless plating |
| 01/17/2002 | WO2002004704A2 Method and apparatus for patching electrochemically deposited layers using electroless deposited materials |
| 01/17/2002 | WO2002004703A2 Electroless rhodium plating |
| 01/17/2002 | WO2002004702A2 Electroless platinum-rhodium alloy plating |