Patents for C23C 18 - Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating (16,252)
01/2003
01/07/2003US6503849 Method for forming insulating film
01/07/2003US6503570 Cyclosilane compound, and solution composition and process for forming a silicon film
01/07/2003US6503565 Metal treatment with acidic, rare earth ion containing cleaning solution
01/07/2003US6503561 Liquid precursor mixtures for deposition of multicomponent metal containing materials
01/07/2003US6503343 Controlled plating on reactive metals
01/03/2003WO2002066701A3 Process for depositing a metal coating containing nickel and boron
01/02/2003US20030003235 From reaction product of a tantalum alkoxide and an amino alcohol, polyalcohol, beta-diketone or ketoester, ester of of beta-dicarboxylic acid, lactic acid, ethyl lactate or 1,5-cyclooctadiene or a hydrolyzate of reaction product
01/02/2003US20030003233 Method for preparation of thermally and mechanically stable metal/porous substrate composite membranes
01/02/2003US20030000847 Immersing surface selected from magnesium, titanium, aluminum, berrylium or their alloys in an anodizing solution containing hydroxylamine, phosphate, nonioinc surfactant and alkali metal hydroxide; passing a current between surface and cathode
01/02/2003US20030000846 Plating method
01/02/2003US20030000422 For forming a uniform film free from uneven coating (striation)
01/02/2003EP1268880A2 Process for the direct metal-plating of a plastic substrate
12/2002
12/31/2002US6500482 Using a solution containing such as nickel sulfate, succinic acid, lactic acid, glycine, malic acid, sodium hypophosphite and potassium hydroxide; monitoring and adjusting ph; ammonium hydroxide free
12/27/2002WO2002102712A1 Ceramic and method for preparation thereof, and dielectric capacitor, semiconductor and element
12/27/2002WO2002102709A1 Ceramics film and production method therefor, and ferroelectric capacitor, semiconductor device, other elements
12/27/2002WO2002006561A3 Process for deposition of metal on a surface
12/27/2002WO2001000901A9 Corrosion resistant component of semiconductor processing equipment and method of manufacturing thereof
12/26/2002US20020197415 Method for the deposition of materials from mesomorphous films
12/26/2002US20020197405 Method and apparatus for improving interfacial chemical reactions in electroless depositions of metals
12/26/2002US20020197404 Method of activating non-conductive substrate for use in electroless deposition
12/25/2002CN1387465A Process for non-galvanic tin plating of copper or copper alloys
12/25/2002CN1386900A Metal plating liquid and its preparing process
12/25/2002CN1386818A Composition contg. azacyclic compound and glycol for grain decoration of resin material, removal of stain and removal of resin material
12/24/2002CA2068176C Method of applying metal coatings on diamond and articles made therefrom
12/19/2002WO2002101822A2 Interconnection in semiconductor device and method for manufacturing the same
12/19/2002WO2002081554A3 Pre-treatment of plastic materials
12/19/2002US20020192508 Method of fabricating improved buffer architecture for biaxially textured structures
12/19/2002US20020192392 Method of making a printed circuit board
12/19/2002US20020192379 Pretreating agent for metal plating
12/19/2002US20020192364 Electroless copper plating solution and high-frequency electronic component
12/19/2002US20020190251 Thin film materials of amorphous metal oxides
12/19/2002US20020189637 Utilization of an ultrasonic prewetting in a liquid bath preceding cleaning for the electroless plating, thereby enabling all the holes to be degassed, and allowing cleansing solution to easily flow into the respective holes
12/19/2002US20020189437 Swash plate and compressor utilizing the same
12/18/2002EP1266051A1 Method for the surface treatment of objects and means for carrying out said method
12/18/2002EP1095434B1 Spark plug electrode having iridium based sphere and method for manufacturing same
12/18/2002EP0750549B1 Bismuth coating protection for copper
12/17/2002US6495456 Method of manufacturing chip type electronic parts
12/17/2002US6495200 Pd/pd acetate seeding layer; copper plug for a semiconductor interconnect
12/17/2002US6495004 Substrate plating apparatus
12/17/2002US6495003 Apparatus for producing decorative beverage can bodies
12/12/2002WO2002099847A2 Apparatus and method for rotating drum chemical bath deposition
12/12/2002WO2002099164A2 Electroless-plating solution and semiconductor device
12/12/2002WO2002099163A2 Autocatalytic coating method
12/12/2002WO2002099162A2 Patterning method
12/12/2002WO2002099161A2 Method for the deposition of materials from mesomorphous films
12/12/2002US20020187895 Process of forming catalyst nuclei on substrate, process of electroless-plating substrate, and modified zinc oxide film
12/12/2002US20020187347 Multi-layer nanoshells
12/12/2002US20020187335 Patterned hydrophilic-oleophilic metal oxide coating and method of forming
12/12/2002US20020187267 Method of producing the plated molded articles by non-electrode plating, and the resin compositions for that use
12/12/2002US20020187266 Metal film pattern and manufacturing method thereof
12/12/2002US20020184968 Lightweight wave gear device
12/12/2002CA2449358A1 Patterning method
12/11/2002EP1264986A1 Swash plate and compressor utilizing the same
12/11/2002EP1155170B1 Method for producing nitride monocrystals
12/11/2002CN1384222A Electroplating liquor without electrolytic copper and high-frequency electronic element
12/11/2002CN1384158A Resin material for decoration and sweller for deterging and eliminating the resin material
12/11/2002CN1383922A Production process of carrier metal catalyst
12/05/2002WO2002098193A1 A method for applying thick copper on substrates
12/05/2002WO2002097159A2 Coating
12/05/2002US20020182437 Covering comprising a nickel-based matrix and particles of ceramic, diamond or carbide dispersed in said matrix, on the functional part of said blade.
12/05/2002US20020182362 Method for repairing a thermal barrier coating and repaiied coating formed thereby
12/05/2002US20020182338 Apparatus and method for rotating drum chemical bath deposition
12/05/2002US20020182324 Method of producing ferrite thin film
12/05/2002US20020182308 Method for electroless gold plating of conductive traces on printed circuit boards
12/05/2002US20020178999 Laminate articles on biaxially textured metal substrates
12/04/2002EP1262782A2 Mounting spring elements on semiconductor devices, and wafer-level testing methodology
12/04/2002CN1383484A Automatic analyzing/controlling device for electroless composite plating solution
12/03/2002US6488984 Forming barrier and conductive metal layers under an environment shutoff from air; pyrolytic decomposition of such as copper from organometallic compound; low resistance; good adhesion
11/2002
11/28/2002WO2002095088A2 Surface coating of black platinum
11/28/2002WO2002066728A3 Iron and sole plate for an iron
11/28/2002WO2002066727A3 Domestic appliance and method of manufacturing thereof
11/28/2002US20020175397 Wiring substrate and method for producing the same
11/28/2002US20020175071 Copper interconnect seed layer treatment methods and apparatuses for treating the same
11/28/2002US20020174742 Lightweight bearing and wave gear drive
11/28/2002DE10124426A1 Surface coating used e.g. as a protective layer against mechanical, chemical and thermal action is made from platinum in a black modification
11/27/2002EP1260615A1 Metal coating of graphite
11/27/2002EP1260607A2 Plating method
11/27/2002EP1091965B1 Precursors for growth of heterometal-oxide films by mocvd
11/27/2002CN1382307A Method for applying flat outer electrodes to piezoceramic multi-layer actuator
11/27/2002CN1382306A Copper deposit process
11/27/2002CN1094807C Method for surface chemical nickel plating of neckel-base alloy powder
11/27/2002CN1094799C Palladium immersion deposition to selectively initiate electroless plating on Ti and W alloys for wafer fabrication
11/26/2002US6485784 Precursors for the growth of strontium tantalum/niobium oxide films
11/26/2002US6485779 Solution for forming ferroelectric film and method for forming ferroelectric film
11/21/2002WO2002093991A1 Method for electroless deposition and patterning of a metal on a substrate
11/21/2002WO2002092884A1 Graphite metal coating
11/21/2002WO2002092879A1 Substrate with photocatalytic coating
11/21/2002WO2002092878A2 Electroless plating method and device, and substrate processing method and apparatus
11/21/2002WO2002092877A2 Catalyst-imparting treatment solution and electroless plating method
11/21/2002US20020173170 Supplying saturated solution of raw materials to mixing vessel; stirring; filtration; low temperature
11/21/2002US20020173168 Process for producing dielectric thin films
11/21/2002US20020172892 Metallizing method for dielectrics
11/21/2002US20020171904 Method of forming an optical layer on a substrate
11/21/2002US20020171182 High density ceramic thick film fabrication method by screen printing
11/20/2002EP1257690A1 A method for providing a protective coating for carbonaceous components of an electrolysis cell
11/20/2002CN1380443A Fuzzy control film-coating process for electric heating film
11/19/2002US6482424 For use in patient contact and care, wherein the textile fabric is effective for the inactivation of antibiotic resistant strains of bacteria.
11/14/2002WO2002072495A3 Sol-gel derived resistive and conductive coating
11/14/2002US20020168309 Method for recovering catalytic metals
11/14/2002DE10121812A1 Solar absorber coating on aluminum-magnesium alloy, used in collector, for decorative part as undercoat or as catalyst, is heat-treated oxide film with specified titanium content