| Patents for C23C 18 - Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating (16,252) |
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| 07/15/2003 | US6592938 Method for coating particles |
| 07/10/2003 | WO2003056614A1 Substrate processing apparatus and method |
| 07/10/2003 | WO2003056062A2 Polymer derivatives for treating metals |
| 07/10/2003 | WO2003056061A2 Polymer derivatives for the treatment of metals |
| 07/10/2003 | US20030130127 Vapor deposition of organometallic compound; hydrolysis forming metal oxide |
| 07/10/2003 | US20030129310 Methods of electroless deposition of nickel, and methods of forming under bump metallurgy, and constructions comprising solder bumps |
| 07/10/2003 | US20030128497 Dielectric structure |
| 07/10/2003 | US20030127015 Stabilizers for electroless plating solutions and methods of use thereof |
| 07/10/2003 | CA2472120A1 Polymer derivatives for treating metals |
| 07/10/2003 | CA2472116A1 Polymer derivatives for the treatment of metals |
| 07/09/2003 | EP1325970A1 Process for local plating of an article |
| 07/09/2003 | EP1325171A2 Uv curable silver chloride compositions for producing silver coatings |
| 07/09/2003 | EP1325169A2 Magnetic transparent conducting oxide film and method of making |
| 07/09/2003 | CN1429297A Methods and fabrics for combating nosocomial infections |
| 07/09/2003 | CN1428458A Mfg. method of electronic parts and siad electronic parts, electroless coating method |
| 07/09/2003 | CN1428457A Method for mfg. electronic parts and said electronic parts |
| 07/09/2003 | CN1428456A Plating method |
| 07/08/2003 | US6589593 Method for metal coating of substrates |
| 07/08/2003 | US6589457 Polymer-assisted aqueous deposition of metal oxide films |
| 07/03/2003 | WO2003053895A2 Copper deposition using copper formate complexes |
| 07/03/2003 | US20030124457 Organic metal precursor for use in forming metal containing patterned films |
| 07/03/2003 | US20030124263 ULSI wiring and method of manufacturing the same |
| 07/03/2003 | US20030124256 Omnishield process and product |
| 07/03/2003 | US20030124255 Layers are separately formed via a diffusion prevention layer with an insulating interlayer portion made of SiO2. |
| 07/03/2003 | US20030121545 Method for constructing a layer structure on a substrate |
| 07/02/2003 | EP1323846A2 Process for preparing metal coatings from liquid solutions utilizing cold plasma |
| 07/02/2003 | EP1323721A2 Organic metal precursor for use in forming metal-containing patterned films |
| 07/02/2003 | EP1322798A1 Bath and method of electroless plating of silver on metal surfaces |
| 07/02/2003 | CN1427986A Chord winder for stringed instrument |
| 07/02/2003 | CN1113399C Method for mfg. Bi layer structure strong electrolyte thin-film |
| 07/01/2003 | US6586155 Forming electroconductive film pattern |
| 07/01/2003 | US6586047 Electrolessly plating particulate matter is disclosed wherein the particulate and the electroless plating solution, without a reducing agent component, are combined with agitation in a plating vessel. If necessary, activator species added to |
| 07/01/2003 | US6586043 Methods of electroless deposition of nickel, methods of forming under bump metallurgy, and constructions comprising solder bumps |
| 07/01/2003 | US6585811 For forming conductive patterns connecting active or passive devices as well as integrated circuits |
| 06/26/2003 | WO2003052164A2 Method for coating a substrate with calcium phosphate |
| 06/26/2003 | US20030118743 Nanostructured and nanoporous film compositions, structures, and methods for making the same |
| 06/26/2003 | US20030118742 Method for enhancing the solderability of a surface |
| 06/26/2003 | US20030118732 Electroless plating system |
| 06/26/2003 | US20030118723 Method for preparing surface-modified nickel powder |
| 06/26/2003 | US20030118624 Film exhibits a log kill rate for Klebsiella pneumoniae of >/= .5 as measured under a modified plate contact method |
| 06/26/2003 | US20030116439 Electroless deposition of barrier material; forming aperture pattern by photolithography |
| 06/25/2003 | EP1321539A2 Process to deposit metal and metal oxide coatings |
| 06/25/2003 | CN1425920A Method for fixing biological macro molecule in common pattern on inorganic silicone material surface |
| 06/25/2003 | CN1425800A Coating composition |
| 06/25/2003 | CN1425799A Stabilizing agent for chemical plating solution and using method for said stabilizing agent |
| 06/25/2003 | CN1425798A Activation solution for aluminium alloy before chemical nickel plating |
| 06/25/2003 | CN1425783A High temperature resistant anti-oxidant base metal copper-silver alloy composition and its producing method |
| 06/25/2003 | CN1425341A Process for producing slide fastener and device with assembled element |
| 06/25/2003 | CN1112729C Electric connection structure in electronic device and forming method for conductor surface material |
| 06/24/2003 | US6582767 Microstamping pattern of alkanethiol to surface; surface treating silicon polymer with aqueous solution of metal salt; electroless deposition |
| 06/24/2003 | US6582581 Comprises selective plating of metallic reinforcing members, solder mount pads, signal lines and interconnections sequentially. The resultant board is desirably free of glass fiber reinforcement. |
| 06/19/2003 | WO2003023848A3 Apparatus and method of surface treatment for electrolytic and electroless plating of metals in integrated circuit manufacturing |
| 06/19/2003 | US20030113996 Semiconductor production device and production method for semiconductor device |
| 06/19/2003 | US20030113576 Electroless plating bath composition and method of using |
| 06/19/2003 | US20030113452 Metallization of non-conductive surfaces with silver catalyst and electroless metal compositions |
| 06/19/2003 | US20030111455 Dometic appliance and method of manufacturing thereof |
| 06/19/2003 | US20030110612 Method for making metallic cord |
| 06/19/2003 | US20030110600 Slide fastener and method of manufacturing attachment having constituent members |
| 06/18/2003 | EP1319734A1 Plating method |
| 06/18/2003 | EP1319452A1 Coated slider fastener having coated constituent elements and method of its manufacture |
| 06/18/2003 | CN1424433A Chemical coppering process for non-aqueous system hydrogen storage alloy powder |
| 06/18/2003 | CN1424432A Nickle-phosphorus alloy plating liquid and coating method |
| 06/18/2003 | CN1424431A Chemical nickel plating solution of aluminium based chassis |
| 06/18/2003 | CN1424430A Products and preparation of chemical plating liquid for chemical coating of nickle-phosphorus alloy |
| 06/17/2003 | US6579472 Combination of an organometallic salt, an organosilane, and a borate, phosphate, or zinc functional component. |
| 06/17/2003 | US6578975 Metal salt solution for use as a reacting solution and method for using same |
| 06/12/2003 | WO2003049515A1 Depositing solid materials |
| 06/12/2003 | WO2003049176A2 Method for defining a source and a drain and a gap inbetween |
| 06/12/2003 | WO2003049172A1 Lanthanide series layered superlattice materials for integrated circuit applications |
| 06/12/2003 | WO2002016059B1 Narrow diameter needle having reduced inner diameter tip |
| 06/12/2003 | US20030108751 An electrodeposited silver mirror on a subtrate with a catalyst support sandwiching layer; pretreating the baselayer for oxidation retardation; high polarity, increasing adhesion to topcoat layer, prevent delamination |
| 06/12/2003 | US20030107026 Electroconductive particles in curable polymer |
| 06/11/2003 | EP1242650B1 Patterned hydrophilic-oleophilic metal oxide coating and method of forming |
| 06/11/2003 | EP0725983B1 Bipolar electrochemical battery of stacked wafer cells |
| 06/11/2003 | CN1422981A Method for producing copper-resin composite material |
| 06/11/2003 | CN1111219C Electic-heating, shielding, anti-static multifunctional conductive fabric and its preparing method |
| 06/10/2003 | US6577218 Electronic component and method of manufacturing same |
| 06/10/2003 | US6576567 Film deposition method and apparatus for semiconductor devices |
| 06/10/2003 | US6576302 Applying solution of an organic acid metal salt, a metal acetylacetonato complex, or a metal alkoxide with 6 or more carbon atoms, drying, irradiation with laser without applying a heat treatment at a high temperature; semiconductors |
| 06/05/2003 | WO2003045582A1 Metallic structures incorporating bioactive materials and methods for creating the same |
| 06/05/2003 | WO2002045155A3 ELECTROLESS METHOD OF SEED LAYER DEPOSITION, REPAIR, AND FABRICATION OF Cu INTERCONNECTS |
| 06/05/2003 | US20030104211 Titanium oxide film laminated on one or both sides of a plastic film layer; food packaging |
| 06/05/2003 | DE10148632C1 Verfahren und Vorrichtung zum galvanotechnischen Behandeln von Werkstücken mit einer Edelmetalle enthaltenden Flüssigkeit Method and apparatus for plating work pieces with a liquid containing precious metals |
| 06/04/2003 | CN1421905A Method of and apparatus for producing semiconductor device |
| 06/04/2003 | CN1421607A Sliding element for compressor |
| 06/03/2003 | US6572930 Holder for electroless plating and method of electroless plating |
| 06/03/2003 | US6572754 Method for producing a tin film on the inner surface of hollow copper alloy components |
| 05/30/2003 | WO2002101822A3 Interconnection in semiconductor device and method for manufacturing the same |
| 05/29/2003 | US20030099048 Forming a silver coating on a vitreous substrate |
| 05/29/2003 | US20030098531 Method and apparatus of producing thin film of metal or metal compound |
| 05/29/2003 | US20030098241 Process and apparatus for manufacturing a semiconductor device |
| 05/28/2003 | EP1315407A2 Dielectric structure |
| 05/28/2003 | EP1314887A2 Compressor coating |
| 05/28/2003 | EP1314799A1 Electrochemical treating method such as electroplating and electrochemical reaction device therefor |
| 05/28/2003 | CN1420944A Method for metal plating, pretreating agent, and semiconductor wafer and semiconductor device using same |
| 05/28/2003 | CN1420717A Copper tin displacement method of PC board |
| 05/28/2003 | CN1419985A Method for mfg. Cu/Ti3SiC2 composite material by chemical copper plating |
| 05/28/2003 | CN1110080C Process for providing metal wire in IC |
| 05/27/2003 | US6569307 Object plating method and system |
| 05/22/2003 | WO2003042434A1 Method and device for surface treatment of treated object |