| Patents for C23C 18 - Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating (16,252) |
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| 09/09/2003 | US6615485 Probe card assembly and kit, and methods of making same |
| 09/04/2003 | WO2003072851A1 Partial plating method, partially-plated resin base, method for manufacturing multilayer circuit board |
| 09/04/2003 | WO2003072527A1 Method for metallizing titanate-based ceramics |
| 09/04/2003 | WO2002061173A3 Advanced composite ormosil coatings |
| 09/04/2003 | US20030165633 Plating method of metal film on the surface of polymer |
| 09/04/2003 | US20030165623 Copper deposition using copper formate complexes |
| 09/03/2003 | EP1340716A1 Ferrite thin film for high frequency and method for preparation thereof |
| 09/03/2003 | CN1440467A Activation of cathode |
| 09/03/2003 | CN1439838A Anti-pitting abrasion-resistant oil pipe and manufacture thereof |
| 09/03/2003 | CN1439741A Method for chemically electroplating thick nickle on titanium alloy |
| 09/02/2003 | US6613486 Immersion in electrolytic solution and irradiated with ultraviolet light |
| 08/28/2003 | WO2003031682A3 Photolytic conversion process to form patterned amorphous film |
| 08/28/2003 | WO2002064862A3 Method for producing plated molded product |
| 08/28/2003 | WO2001088211A3 Method for the treatment of work pieces with a palladium colloid solution |
| 08/28/2003 | US20030161954 Selecting precursor of deposit material and solvent, wherein precursor dissociates under conditions at which solvent is supercritical fluid, dissolving precursor, exposing substrate to solution under conditions at which precursor dissociates |
| 08/28/2003 | US20030159923 Activation of a cathode |
| 08/28/2003 | US20030159762 Heating; controlling temperature; buffering using oxidizer |
| 08/27/2003 | EP1338675A1 Electroless gold plating solution and method for electroless gold plating |
| 08/27/2003 | EP1337685A2 Electroless rhodium plating |
| 08/27/2003 | CN1439174A Process for the manufacture of printed circuit boards with plated resistors |
| 08/27/2003 | CN1439060A Method for depositing metal and metal oxide films and patterned films |
| 08/26/2003 | US6610596 Method of forming metal interconnection using plating and semiconductor device manufactured by the method |
| 08/26/2003 | US6610182 Cup-type plating apparatus and method for plating wafers |
| 08/21/2003 | WO2003069967A1 Circuit substrate production method |
| 08/21/2003 | WO2003068674A1 Noble-metal nanowire structure and process for producing the same |
| 08/21/2003 | WO2003049172B1 Lanthanide series layered superlattice materials for integrated circuit applications |
| 08/21/2003 | WO2003032084A3 Low viscosity precursor compositions and methods for the deposition of conductive electronic features |
| 08/21/2003 | US20030157265 Having film has high corrosion resistance to oxidization and reduction; durability |
| 08/21/2003 | US20030157264 Bath and method of electroless plating of silver on metal surfaces |
| 08/21/2003 | US20030157250 Hyrdrothermal treatment of nanostructured films |
| 08/21/2003 | US20030155250 Method for the treatment of work pieces with a palladium colloid solution |
| 08/20/2003 | EP1336669A2 Process for providing a tortoise-shell chromatic effect to metallic substrates |
| 08/20/2003 | CN1118878C Bipolar stacked wafer unit electrochemical battery |
| 08/19/2003 | US6607981 Method for forming a Cu interconnect pattern |
| 08/19/2003 | US6607980 Rapid-temperature pulsing anneal method at low temperature for fabricating layered superlattice materials and making electronic devices including same |
| 08/14/2003 | US20030153143 Electroless deposition of doped noble metals and noble metal alloys |
| 08/14/2003 | US20030152813 Lanthanide series layered superlattice materials for integrated circuit appalications |
| 08/14/2003 | US20030152704 Reacting titanium compound with hydrogen peroxide |
| 08/14/2003 | US20030152690 Controlling temperature |
| 08/14/2003 | US20030151141 External connection terminal and semiconductor device |
| 08/14/2003 | US20030150738 High efficiency plating apparatus and method |
| 08/14/2003 | US20030150353 Reducing agent that is oxidized by gold, and an additional reducing agent that is either oxidized by gold or by a substrate metal |
| 08/13/2003 | EP1335039A1 Device and method for plating |
| 08/13/2003 | EP1335038A1 Device and method for electroless plating |
| 08/13/2003 | EP1334219A2 Selective fiber metallization |
| 08/13/2003 | CN1435510A Non-electrolysis gold plating solution |
| 08/13/2003 | CN1435509A Pre-plating nickel dipping solution for chemical plating aluminium and aluminium alloy with nickel |
| 08/13/2003 | CN1118099C Method for mounting intermediate connecting element to terminal of electronic module |
| 08/12/2003 | US6605365 Pigmented alkoxyzirconium sol |
| 08/07/2003 | WO2003065423A2 Electroless deposition apparatus and method |
| 08/07/2003 | WO2003064730A1 Gate bush producing method by electroforming |
| 08/07/2003 | US20030149187 High density, durability |
| 08/07/2003 | US20030148024 Electrical feature such as a conductive feature. The precursor composition advantageously has a low viscosity enabling deposition using direct-write tools. The precursor composition also has a low conversion temperature, enabling the deposition |
| 08/06/2003 | EP1332244A1 Method for enhancing the solderability of a surface |
| 08/06/2003 | EP1038049B1 Method for forming a metallic film using non-isothermal plasma |
| 08/06/2003 | EP0815586B1 Integrated circuits having mixed layered superlattice materials and precursor solutions for use in a process of making the same |
| 08/06/2003 | CN1434149A Method for preparing corrosion-resisting wearing-resisting coat used for magnesium and alloy thereof |
| 08/06/2003 | CN1116910C Method for removing metal ion and pollutant from self-sedimentation bath |
| 08/05/2003 | US6603205 Material for electronic components, method of connecting material for electronic components, ball grid array type electronic components and method of connecting ball grid array type electronic components |
| 07/31/2003 | WO2003061851A1 Catalyst solutions useful in activating substrates for subsequent plating |
| 07/31/2003 | WO2002099162A3 Patterning method |
| 07/31/2003 | US20030143837 Method of depositing a catalytic layer |
| 07/31/2003 | US20030143438 Buffer architecture for biaxially textured structures and method of fabricating same |
| 07/31/2003 | US20030143411 Surface conductive resin, process for forming the same and wiring board |
| 07/31/2003 | US20030143333 Subjecting a hydrothermally formed film to hydrothermally processing in an aqueous solution having a pH of about 5 to 7 |
| 07/31/2003 | US20030141785 Lead zirconate titanate fiber, smart board using lead zirconate titanate fiber, actuator utilizing smart board, and sensor utilizing smart board |
| 07/31/2003 | US20030141018 spreaders comprising frames for joining trowel blades and pivot points comprised of two juxtaposed side panels, for use in the laying of flooring and roofing surfaces |
| 07/31/2003 | US20030140988 Process control; controlling time and temperature; aftertreatment annealing |
| 07/30/2003 | EP1331286A2 Method of electroless plating and ceramic capacitor |
| 07/30/2003 | EP1331285A2 Thin-layer metal film |
| 07/30/2003 | EP1331284A1 Lead zirconate titanate fiber and use for actuators and sensors |
| 07/30/2003 | EP1330558A1 Leadfree chemical nickel alloy |
| 07/30/2003 | EP1250584B1 Method for characterization and quality control of porous media |
| 07/29/2003 | US6599780 Film production method and film produced thereby |
| 07/29/2003 | US6599563 Method and apparatus for improving interfacial chemical reactions in electroless depositions of metals |
| 07/24/2003 | WO2003060976A1 Contamination suppression in chemical fluid deposition |
| 07/24/2003 | WO2003060959A2 Method for applying metal features onto barrier layers using electrochemical deposition |
| 07/24/2003 | WO2002097159A3 Coating |
| 07/24/2003 | US20030139063 Method of forming coating film, method of manufacturing semiconductor device and coating solution |
| 07/24/2003 | US20030138661 A cookware coated with a protective coatings, a thermally cured transparent, inorganic polymer formed by coating the surface with hydrolyzed metal alkoxide particles in an organic solvent |
| 07/24/2003 | US20030138571 Electrons produced by oxidation of reducing agent are supplied to the electrode to form the desired metal only on the surface of the electrode, there by forming electroless plating film |
| 07/24/2003 | CA2471596A1 Contamination suppression in chemical fluid deposition |
| 07/23/2003 | EP1329973A1 Method of manufacturing an electrode |
| 07/23/2003 | EP1329433A1 Sol-gel process for the preparation of porous coatings, using precursor solutions prepared by polymeric reactions |
| 07/23/2003 | EP1328344A1 Supported catalyst consisting of metal of the platinum group and obtained by means of controlled electroless deposition |
| 07/23/2003 | CN1432072A Method for producing three-dimensional, selectively metallized parts and three-dimensional, selectively metallied part |
| 07/22/2003 | US6596344 Method of depositing a high-adhesive copper thin film on a metal nitride substrate |
| 07/17/2003 | WO2003057943A2 Electroless plating system |
| 07/17/2003 | WO2003056924A1 Antimicrobial sol-gel films comprising specific metal-containing antimicrobial agents |
| 07/17/2003 | US20030134050 Mixing workpieces with first conductive media in first plating solution, each workpiece comprising a substrate and an electrode provided thereon, and forming first plating films on electrodes by electroless plating |
| 07/17/2003 | US20030134047 Apparatus and method for electroless spray deposition |
| 07/17/2003 | US20030132121 Materials and methods for immobilization of catalysts on surfaces and for selective electroless metallization |
| 07/16/2003 | EP1327700A1 Electroless displacement gold plating solution and additive for preparing said plating solution |
| 07/16/2003 | EP1326709A1 Method for producing catalysts consisting of metal of the platinum group by means of electroless deposition and the use thereof for the direct synthesis of hydrogen peroxide |
| 07/16/2003 | EP1144725B1 Method for coating reactors for high pressure polymerisation of 1-olefins |
| 07/16/2003 | EP0948572B1 Multi-coated interference pigments |
| 07/16/2003 | CN1429933A Method for electroplating of selected surface of component |
| 07/15/2003 | US6593656 Multilevel copper interconnects for ultra large scale integration |
| 07/15/2003 | US6593252 Film deposition method and apparatus |
| 07/15/2003 | US6593149 Manufacturing method for ferroelectric thin film using sol-gel process |