C23C 18 - Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating

Patents for C23C 18 - Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating (16,252)
11/2002
11/14/2002	DE10120011A1 Production of thin coated flat glass, especially display glass, comprises applying functional coating or mechanical support layer made from metal, metal oxide or plastic onto flat glass and adhering by thermal treatment
11/13/2002	EP0909838B1 Electroless copper plating solution and method for electroless copper plating
11/13/2002	CN1379421A Ceramic electronic parts and its making method
11/12/2002	US6479405 Method of forming silicon oxide layer in semiconductor manufacturing process using spin-on glass composition and isolation method using the same method
11/12/2002	US6479384 Process for fabricating a semiconductor device
11/12/2002	US6478941 Gas sensing element and method for manufacturing the same
11/07/2002	WO2002088423A1 Copper plating solution and method for copper plating
11/07/2002	WO2002088422A1 Method of pretreatment of material to be electrolessly plated
11/07/2002	WO2002058775A3 Device for dilating and irradiating a vascular segment or body passageway
11/07/2002	US20020163770 Supercapacitors and method for fabricating the same
11/06/2002	EP1144724B1 Heat exchanger with a reduced tendency to produce deposits and method for producing same
11/05/2002	US6476333 Raised contact structures (solder columns)
11/05/2002	US6475644 Medical devices for delivery of targeted radioisotopes
11/05/2002	US6475358 Electrolysis of aluminum
11/05/2002	US6475272 Chemical solution for Cu-Ca-O thin film formations on Cu surfaces
10/2002
10/31/2002	US20020160222 Electrolessly depositing on copper and copper alloys a ternary amorphous-microcrystalline cobalt alloy of cobalt, tungsten and phosphorus from an aqueous bath to achieve a barrier layer to impede the migration of copper atoms to the overplate
10/31/2002	US20020160206 Method for fabricating plated products
10/31/2002	US20020160164 Charge containing element
10/31/2002	US20020160103 Method and apparatus for forming thin film of metal
10/31/2002	US20020158111 Patterned hydrophilic-oleophilic metal oxide coating and method of forming
10/30/2002	EP1253217A1 Method for preliminary treatment of material to be subjected to electroless plating
10/30/2002	EP1252366A2 Method for surface patterning using a focused laser
10/30/2002	EP1252362A2 Method and device for depositing a precursor on a substrate, said precursor being present in the liquid form
10/30/2002	EP1251970A1 Method for preparation of thermally and mechanically stable metal/porous substrate composite membranes
10/30/2002	CN1376803A Recovery method for catalytic metal
10/29/2002	USRE37896 Solution for fabrication of electron-emitting devices, manufacture method of electron-emitting devices, and manufacture method of image-forming apparatus
10/29/2002	US6472023 Seed layer of copper interconnection via displacement
10/29/2002	US6471777 Holder for electroless plating and method of electroless plating
10/29/2002	CA2076088C Method for enhancing the uniform electroless deposition of gold onto a palladium substrate
10/24/2002	WO2002083981A1 Device and method for electroless plating
10/24/2002	WO2002083980A1 Electroless plating
10/24/2002	US20020155315 Cobalt-molybdenum-phosphorus alloy diffusion barrier coatings
10/24/2002	US20020154427 Metal salt solution for use as a reacting solution and method for using same
10/24/2002	US20020152955 Apparatus and method for depositing an electroless solution
10/24/2002	US20020152926 Immersing the substrate in a copper plating bath; immersing an activator in copper plating bath; performing a direct contact between activator and substrate to deposit copper on substrate
10/24/2002	US20020152925 Printed circuit board manufacture
10/23/2002	EP1250584A2 Method for characterization and quality control of porous media
10/23/2002	CN1093023C Ultraviolet irradiation process preparing cuprous oxide superfine powder
10/17/2002	WO2002081554A2 Pre-treatment of plastic materials
10/17/2002	WO2002029449A3 Magnetic transparent conducting oxide film and method of making
10/17/2002	US20020151439 Forming a dielectric layer by thermal decomposition of a metallo-organic material
10/17/2002	US20020151433 Process for producing a supported metal catalyst
10/17/2002	US20020150693 Holder for electroless plating and method of electroless plating
10/17/2002	US20020150692 Electroless deposition; corrosion resistance
10/17/2002	DE10113857A1 Selective, metal-based activation of substrates for wet-chemical, electroless plating, especially on circuit board for microelectronic device, uses vesicles to transport activator metal or precursor to selected area
10/16/2002	EP0729652B1 Method for fabricating a contact structure for interconnections, interposer, semiconductor assembly
10/16/2002	CN1375017A 化学镀膜方法 Chemical deposition method
10/15/2002	US6465108 Process for the production of articles covered with silica-base coats
10/10/2002	WO2002079542A2 Improved adhesion of polymeric materials to metal surfaces
10/10/2002	WO2002047446A3 Process for selectively plating areas of a substrate
10/10/2002	US20020145134 Sol-gel solution in which up to 90% of said solution is a conductive powder such as metal, ceramic, interceramic and semiconductor in a uniform stable dispersion; resistance heaters
10/10/2002	CA2416019A1 Improved adhesion of polymeric materials to metal surfaces
10/09/2002	EP1247877A1 Spectacle frame surface treatment method
10/09/2002	EP1247574A1 Process for producing a supported metal catalyst
10/09/2002	EP1246773A2 Fabrication of metallic microstructures via exposure of photosensitive composition
10/09/2002	EP0848084B1 Internally tin-plated copper pipe manufacturing method
10/09/2002	CN1092244C Method for directly depositing metal contg. patterned films
10/09/2002	CN1092169C Method for preparing lead zirconate titanate film
10/08/2002	US6461680 Simplified fabrication method of toroidal charged particle deflector vanes
10/08/2002	US6461678 Process for metallization of a substrate by curing a catalyst applied thereto
10/03/2002	WO2002077713A1 Method for forming metal pattern
10/03/2002	WO2002077322A1 Electroless deposition of cu-in-ga-se film
10/03/2002	WO2002077321A1 Method for forming metal pattern
10/03/2002	WO2001092596A3 Method for producing three-dimensional, selectively metallized parts and a three-dimensional, selectively metallized part
10/03/2002	US20020143202 Method of depositing a high-adhesive copper thin film on a metal nitride substrate
10/03/2002	US20020142092 Method for the metalization of an insulator and/or a dielectric
10/03/2002	US20020139960 Superconductive film may be obtained by applying organic solvent solution of above metal complex composition to substrate and heat treating coating
10/03/2002	US20020139684 Pump for supplying plating fluid from the reservoir tank to the closed plating cup cyclically changes the pressure or flow rate of the plating fluid to prevent air bubbles in the blind holes of the plating member
10/03/2002	US20020139663 Chemical treatment system
10/02/2002	EP1245697A2 Process for electroles silver plating
10/02/2002	EP1245695A2 Method for depositing a copper film
10/02/2002	EP0866735B1 Process for the fabrication of a silicon/integrated circuit wafer
10/02/2002	DE10159831A1 Kompressoren Compressors
10/01/2002	US6458498 Charge containing element
10/01/2002	US6458431 Embedding particles; photochemistry
10/01/2002	US6458196 Conductive filler
09/2002
09/26/2002	WO2002075020A1 Plating method of metal film on the surface of polymer
09/26/2002	WO2000040774A3 Method for coating apparatuses and parts of apparatuses used in chemical manufacturing
09/26/2002	US20020136844 Method for fabricating plated products
09/26/2002	US20020134963 For removal of residues from integrated circuits; comprises a choline compound, water and an organic solvent
09/26/2002	US20020134300 Method of depositing buffer layers on biaxially textured metal substrates
09/26/2002	EP1144723A3 Method for coating apparatuses and parts of apparatuses used in chemical manufacturing
09/26/2002	CA2426648A1 Plating method of metal film on the surface of polymer
09/25/2002	EP1242650A1 Patterned hydrophilic-oleophilic metal oxide coating and method of forming
09/25/2002	EP0804631B1 Method of depositing thin group iiia metal films
09/24/2002	US6455175 Solution of triamminetris(nitrito-n,n,n)rhodium(iii), ammonium hydroxide and hydrazine hydrate; uniform coating; chemical reduction
09/24/2002	US6455139 Printed circuit substrate treated with swelling agent, alkaline permanganate, chromate, and/or chlorite; coating with metal
09/24/2002	US6455106 Method of forming oxide-ceramics film
09/24/2002	US6454964 Metal polyoxyalkylated precursor solutions in an octane solvent and method of making the same
09/19/2002	WO2002073590A1 Metal components for string instrument
09/19/2002	WO2002072915A1 Conditioning agent and use thereof
09/19/2002	WO2002072495A2 Sol-gel derived resistive and conductive coating
09/19/2002	WO2002072319A1 Cutting tool with an electroless nickel coating
09/19/2002	WO2002009884A3 Methods for the lithographic deposition of materials containing nanoparticles
09/19/2002	US20020132498 Method of forming patterned thin film
09/19/2002	US20020132142 Magnetic transparent conducting oxide film and method of making
09/19/2002	US20020132109 Reflective optical element and method of producing the same
09/19/2002	US20020132051 Film or coating deposition and powder formation
09/19/2002	US20020132045 Method of making nanoshells
09/19/2002	US20020132042 Plating catalysts

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