Patents for C23C 18 - Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating (16,252)
11/2001
11/21/2001EP0925384B1 Substrates seeded with precious metal salts, process for producing the same and their use
11/21/2001CN1322857A Anticorrosive wear-resistant gradient film
11/21/2001CN1322855A Selective chemical plating process of preparing nanometer gap electrode
11/21/2001CN1075126C Activating catalytic solution for chemical sedimentation and chemical sedimentation method
11/20/2001US6319564 Multilayer element with coating a nonconductive organic heavy metal complex to a microporous surface, breaking up the complex and metallization the conductor tracks
11/20/2001US6319543 Process for silver plating in printed circuit board manufacture
11/20/2001US6319386 Submerged array megasonic plating
11/20/2001US6319308 For forming hard, wear and corrosion resistant, ductile coating on a substrate
11/20/2001CA2042970C Surface treated al or al alloy material
11/15/2001US20010041267 Multilayer; nickel phosphide aand nickel boride
11/15/2001US20010040047 Process for reducing extraneous metal plating
11/15/2001DE10053201A1 Aufschleuder-Glaszusammensetzung und Verfahren zur Herstellung einer Siliziumoxidschicht bei einem Halbleiterherstellungsprozeß unter Verwendung derselben Spin-on glass composition and method for producing a silicon oxide film in a semiconductor fabrication process using the same
11/14/2001EP1153888A1 Method of producing inorganic compound solid substance and method of manufacturing semiconductor device
11/14/2001EP1153762A1 Optical recording medium and apparatus for manufacture thereof
11/14/2001EP1153427A1 Improvement of liquid deposition by selection of liquid viscosity and other precursor properties
11/14/2001EP1153158A1 Ceramic coating
11/14/2001CN1322009A Spin coating glass composition and method for forming silica layer in production of semiconductor
11/14/2001CN1321792A Environment-protecting type microcrystal alloy plating solution
11/13/2001US6316359 Interconnect structure in a semiconductor device and method of formation
11/13/2001US6316059 Modifying the substrate with a silane layer, locally removing said layer with uv-ozone treatment and selectively nucleating the remaining silane layer in a polymer-stabilized pd sol.
11/13/2001US6315880 Chemical plating method, electrolytic cell and automotive oxygen sensor using it
11/08/2001WO2001083856A1 Surface treatment of parts of die-cast and extrusion machines
11/08/2001WO2001083844A2 Method for depositing metal and metal oxide films and patterned films
11/07/2001EP0808295B1 Method of manufacturing a glass substrate coated with a metal oxide and a glass substrate for an electronic display
11/06/2001US6312533 Stainless steel material with excellent antibacterial property and process for producing the same
11/01/2001WO2001081671A2 Methods and fabrics for combating nosocomial infections
11/01/2001WO2001081652A1 Pretreating agent for metal plating
11/01/2001US20010036721 Process for metallizing at least one insulating layer of a component
11/01/2001US20010035347 Method for providing a protective coating for carbonaceous components of an electrolysis cell
11/01/2001CA2407087A1 Methods and fabrics for combating nosocomial infections
10/2001
10/31/2001DE10057757A1 Production of gold wires used in the semiconductor industry comprises applying a solution onto a carrier material, removing the solvent, crushing the carrier material and treating with a reducing agent
10/31/2001DE10017886A1 Vesicles filled with metal cluster suspension or ionogenic metal activator or coated with metal clusters, used as printing paste for selective activation before metallization, comprise tin, noble or transition metal and amphiphilic membrane
10/31/2001CN1073901C Method and device for dry fluxing of metallic surfaces before soldering or tinning
10/30/2001US6310373 Metal insulator semiconductor structure with polarization-compatible buffer layer
10/30/2001US6309524 Methods and apparatus for processing the surface of a microelectronic workpiece
10/25/2001US20010033935 Coating with activating solution containing ions of bismuth, chromium, gold, indium, nickel, palladium, platinum, rhodium, ruthenium, titanium, vanadium, and/or zinc, and a sensitizing step, and subsequent silvering; adhesion, aging resistance
10/25/2001US20010033889 Manufacturing computer systems with fine line circuitized substrates
10/25/2001US20010032787 Multilayer metal plating
10/24/2001EP1148157A1 Process to decorate an article and article decorated by this process
10/24/2001EP1148153A2 Electroless plating process and pretreating agent used therefor
10/24/2001EP0756718B1 Electrochromic thin-film systems and components thereof
10/24/2001CN1073644C Chemical nickei plating solution
10/23/2001US6306747 Conductive metal oxide based layer
10/23/2001US6306466 Contacting surface of body with electroless metallizing bath comprising aqueous solution of metal salt, reducing agent, insoluble particulate matter and particulate matter stabilizer which shifts zeta potential for insoluble particles
10/18/2001WO2001078453A1 Electrical device having ptc conductive polymer
10/18/2001WO2001077419A2 Process for the direct metal-plating of a plastic substrate
10/18/2001WO2001077410A2 Activator metals that are encapsulated in vesicles or metal clusters that adhere to vesicles and a method for producing same
10/18/2001WO2001077409A2 Method for the selective, metal-based activation of substrate surfaces for the wet-chemical metal deposition without external current and a means therefore
10/18/2001WO2000028108A3 Non-electrolytic gold plating compositions and methods of use thereof
10/18/2001US20010031372 Process for the preparation of noble metal coated non-noble metal substrates, coated materials produced in accordance therewith and compositions utilizing the coated materials
10/18/2001US20010030366 Semiconducting system and production method
10/18/2001US20010029893 Deposited film forming apparatus and deposited film forming method
10/18/2001CA2404946A1 Process for the direct metal-plating of a plastic substrate
10/17/2001EP1146143A1 Process and apparatus for nickel plating and nickel-plated product
10/17/2001EP1146141A2 Liquid precursor mixtures for deposition of multicomponent metal containing materials
10/17/2001EP1144725A2 Method for coating reactors for high pressure polymerisation of 1-olefins
10/17/2001EP1144724A2 Heat exchanger with a reduced tendency to produce deposits and method for producing same
10/17/2001EP1144723A2 Method for coating apparatuses and parts of apparatuses used in chemical manufacturing
10/17/2001EP1100638A4 Casting steel strip
10/17/2001EP0996771B1 Method for applying a coating to a metal substrate or repairing a coating applied to the same
10/17/2001EP0850293B1 Succinic acid derivative degradable chelants, uses and compositions thereof
10/17/2001CN1317997A Electroless metal deposition of electronic components in enclosable vessel
10/17/2001CN1317597A Plating alloy solution and its preparing process
10/17/2001CN1317596A Self-catalytic plating Ni-Sn-P alloy solution and its plated layer
10/16/2001US6303278 Method of applying metal layers in distinct patterns
10/16/2001US6303231 Coating solutions for use in forming bismuth-based ferroelectric thin films, and ferroelectric memories formed with said coating solutions, as well as processes for production thereof
10/11/2001US20010029099 Thick copper layer is deposited by disproportionation caused by water which is added to the stabilized cuprous ion solution, hydration energy of cupric ions increased causing cuprous ion disproportionate into cupric and solid copper
10/11/2001US20010028113 Method of manufacturing semiconductor device
10/10/2001EP1142456A1 Process for depositing conducting layer on substrate
10/10/2001EP1141443A1 A method of metallizing the surface of a solid polymer substrate and the product obtained
10/10/2001EP1141442A1 METHOD FOR PRODUCING A METAL ALLOY POWDER SUCH AS MCrALY AND COATINGS OBTAINED WITH SAME
10/10/2001EP1141441A1 METHOD FOR FORMING A METAL ALLOY COATING SUCH AS MCrAlY
10/10/2001EP0973959B1 Coating method for elongated metal blanks
10/10/2001CN1317150A Vapor deposition routes to nanoporous silica
10/10/2001CN1316975A Process for preparing silica or silica-based thick vitreous films according to sol-gel technique and thick films thereby obtained
10/10/2001CN1072736C Method of coating copper film on ceramic substrate
10/10/2001CN1072735C Method of depositing aluminuium film
10/10/2001CN1072529C Technology for coating decorative film on curved surface
10/09/2001US6300244 Semiconductor device and method of manufacturing the same
10/09/2001US6300144 Method for fabricating ferro-electric thin films using a sol-gel technique
10/09/2001US6299942 Method of producing the plated molded articles by non-electrode plating, and the resin compositions for that use
10/09/2001US6299750 While avoiding covering parts of the workpiece, provides coatings, in particular diamond coatings, which gradually vary in size over the subregions of the workpiece.
10/09/2001CA2045272C Process for improving the surface of liquid crystal polymers
10/04/2001WO2001073163A1 Method for forming on a metal substrate a protective sulphur-free metal coating
10/04/2001WO2001073162A2 Method for coating apparatuses and parts of apparatuses for the construction of chemical installations
10/04/2001US20010025962 Field emmision type cold cathode device, manufacturing method thereof and vacuum micro device
10/04/2001EP1139396A2 Fixture and method for uniform electroless metal deposition on integrated circuit bond pads
10/04/2001EP1138803A2 Method for metallizing an insulator and/or a dielectric
10/04/2001DE10016215A1 Verfahren zur Beschichtung von Apparaten und Apparateteilen für den chemischen Anlagenbau A process for coating apparatuses and apparatus parts for chemical plant
10/04/2001CA2404435A1 Method for coating apparatuses and parts of apparatuses for the construction of chemical installations
10/03/2001CN1316023A Method and apparatus for copper plating using electroless plating and electroplating
10/03/2001CN1315589A Treating method of non-electrolyzing plating and pretreatment agent
10/03/2001CN1315249A Resin coated metal plate with good machinability and thermal stability
10/03/2001CN1072278C Currentless metallisation process for non electro-conductive substrates
10/03/2001CA2342954A1 Process for decorating an item, and item decorated using the process
10/02/2001US6297140 Method to plate C4 to copper stud
10/02/2001US6296897 Process for reducing extraneous metal plating
09/2001
09/27/2001US20010024842 Film production method and film produced thereby
09/27/2001US20010024691 Semiconductor substrate processing apparatus and method
09/27/2001US20010024685 Method for forming a protective coating and substrates coated with the same