Patents for C23C 18 - Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating (16,252) |
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11/21/2001 | EP0925384B1 Substrates seeded with precious metal salts, process for producing the same and their use |
11/21/2001 | CN1322857A Anticorrosive wear-resistant gradient film |
11/21/2001 | CN1322855A Selective chemical plating process of preparing nanometer gap electrode |
11/21/2001 | CN1075126C Activating catalytic solution for chemical sedimentation and chemical sedimentation method |
11/20/2001 | US6319564 Multilayer element with coating a nonconductive organic heavy metal complex to a microporous surface, breaking up the complex and metallization the conductor tracks |
11/20/2001 | US6319543 Process for silver plating in printed circuit board manufacture |
11/20/2001 | US6319386 Submerged array megasonic plating |
11/20/2001 | US6319308 For forming hard, wear and corrosion resistant, ductile coating on a substrate |
11/20/2001 | CA2042970C Surface treated al or al alloy material |
11/15/2001 | US20010041267 Multilayer; nickel phosphide aand nickel boride |
11/15/2001 | US20010040047 Process for reducing extraneous metal plating |
11/15/2001 | DE10053201A1 Aufschleuder-Glaszusammensetzung und Verfahren zur Herstellung einer Siliziumoxidschicht bei einem Halbleiterherstellungsprozeß unter Verwendung derselben Spin-on glass composition and method for producing a silicon oxide film in a semiconductor fabrication process using the same |
11/14/2001 | EP1153888A1 Method of producing inorganic compound solid substance and method of manufacturing semiconductor device |
11/14/2001 | EP1153762A1 Optical recording medium and apparatus for manufacture thereof |
11/14/2001 | EP1153427A1 Improvement of liquid deposition by selection of liquid viscosity and other precursor properties |
11/14/2001 | EP1153158A1 Ceramic coating |
11/14/2001 | CN1322009A Spin coating glass composition and method for forming silica layer in production of semiconductor |
11/14/2001 | CN1321792A Environment-protecting type microcrystal alloy plating solution |
11/13/2001 | US6316359 Interconnect structure in a semiconductor device and method of formation |
11/13/2001 | US6316059 Modifying the substrate with a silane layer, locally removing said layer with uv-ozone treatment and selectively nucleating the remaining silane layer in a polymer-stabilized pd sol. |
11/13/2001 | US6315880 Chemical plating method, electrolytic cell and automotive oxygen sensor using it |
11/08/2001 | WO2001083856A1 Surface treatment of parts of die-cast and extrusion machines |
11/08/2001 | WO2001083844A2 Method for depositing metal and metal oxide films and patterned films |
11/07/2001 | EP0808295B1 Method of manufacturing a glass substrate coated with a metal oxide and a glass substrate for an electronic display |
11/06/2001 | US6312533 Stainless steel material with excellent antibacterial property and process for producing the same |
11/01/2001 | WO2001081671A2 Methods and fabrics for combating nosocomial infections |
11/01/2001 | WO2001081652A1 Pretreating agent for metal plating |
11/01/2001 | US20010036721 Process for metallizing at least one insulating layer of a component |
11/01/2001 | US20010035347 Method for providing a protective coating for carbonaceous components of an electrolysis cell |
11/01/2001 | CA2407087A1 Methods and fabrics for combating nosocomial infections |
10/31/2001 | DE10057757A1 Production of gold wires used in the semiconductor industry comprises applying a solution onto a carrier material, removing the solvent, crushing the carrier material and treating with a reducing agent |
10/31/2001 | DE10017886A1 Vesicles filled with metal cluster suspension or ionogenic metal activator or coated with metal clusters, used as printing paste for selective activation before metallization, comprise tin, noble or transition metal and amphiphilic membrane |
10/31/2001 | CN1073901C Method and device for dry fluxing of metallic surfaces before soldering or tinning |
10/30/2001 | US6310373 Metal insulator semiconductor structure with polarization-compatible buffer layer |
10/30/2001 | US6309524 Methods and apparatus for processing the surface of a microelectronic workpiece |
10/25/2001 | US20010033935 Coating with activating solution containing ions of bismuth, chromium, gold, indium, nickel, palladium, platinum, rhodium, ruthenium, titanium, vanadium, and/or zinc, and a sensitizing step, and subsequent silvering; adhesion, aging resistance |
10/25/2001 | US20010033889 Manufacturing computer systems with fine line circuitized substrates |
10/25/2001 | US20010032787 Multilayer metal plating |
10/24/2001 | EP1148157A1 Process to decorate an article and article decorated by this process |
10/24/2001 | EP1148153A2 Electroless plating process and pretreating agent used therefor |
10/24/2001 | EP0756718B1 Electrochromic thin-film systems and components thereof |
10/24/2001 | CN1073644C Chemical nickei plating solution |
10/23/2001 | US6306747 Conductive metal oxide based layer |
10/23/2001 | US6306466 Contacting surface of body with electroless metallizing bath comprising aqueous solution of metal salt, reducing agent, insoluble particulate matter and particulate matter stabilizer which shifts zeta potential for insoluble particles |
10/18/2001 | WO2001078453A1 Electrical device having ptc conductive polymer |
10/18/2001 | WO2001077419A2 Process for the direct metal-plating of a plastic substrate |
10/18/2001 | WO2001077410A2 Activator metals that are encapsulated in vesicles or metal clusters that adhere to vesicles and a method for producing same |
10/18/2001 | WO2001077409A2 Method for the selective, metal-based activation of substrate surfaces for the wet-chemical metal deposition without external current and a means therefore |
10/18/2001 | WO2000028108A3 Non-electrolytic gold plating compositions and methods of use thereof |
10/18/2001 | US20010031372 Process for the preparation of noble metal coated non-noble metal substrates, coated materials produced in accordance therewith and compositions utilizing the coated materials |
10/18/2001 | US20010030366 Semiconducting system and production method |
10/18/2001 | US20010029893 Deposited film forming apparatus and deposited film forming method |
10/18/2001 | CA2404946A1 Process for the direct metal-plating of a plastic substrate |
10/17/2001 | EP1146143A1 Process and apparatus for nickel plating and nickel-plated product |
10/17/2001 | EP1146141A2 Liquid precursor mixtures for deposition of multicomponent metal containing materials |
10/17/2001 | EP1144725A2 Method for coating reactors for high pressure polymerisation of 1-olefins |
10/17/2001 | EP1144724A2 Heat exchanger with a reduced tendency to produce deposits and method for producing same |
10/17/2001 | EP1144723A2 Method for coating apparatuses and parts of apparatuses used in chemical manufacturing |
10/17/2001 | EP1100638A4 Casting steel strip |
10/17/2001 | EP0996771B1 Method for applying a coating to a metal substrate or repairing a coating applied to the same |
10/17/2001 | EP0850293B1 Succinic acid derivative degradable chelants, uses and compositions thereof |
10/17/2001 | CN1317997A Electroless metal deposition of electronic components in enclosable vessel |
10/17/2001 | CN1317597A Plating alloy solution and its preparing process |
10/17/2001 | CN1317596A Self-catalytic plating Ni-Sn-P alloy solution and its plated layer |
10/16/2001 | US6303278 Method of applying metal layers in distinct patterns |
10/16/2001 | US6303231 Coating solutions for use in forming bismuth-based ferroelectric thin films, and ferroelectric memories formed with said coating solutions, as well as processes for production thereof |
10/11/2001 | US20010029099 Thick copper layer is deposited by disproportionation caused by water which is added to the stabilized cuprous ion solution, hydration energy of cupric ions increased causing cuprous ion disproportionate into cupric and solid copper |
10/11/2001 | US20010028113 Method of manufacturing semiconductor device |
10/10/2001 | EP1142456A1 Process for depositing conducting layer on substrate |
10/10/2001 | EP1141443A1 A method of metallizing the surface of a solid polymer substrate and the product obtained |
10/10/2001 | EP1141442A1 METHOD FOR PRODUCING A METAL ALLOY POWDER SUCH AS MCrALY AND COATINGS OBTAINED WITH SAME |
10/10/2001 | EP1141441A1 METHOD FOR FORMING A METAL ALLOY COATING SUCH AS MCrAlY |
10/10/2001 | EP0973959B1 Coating method for elongated metal blanks |
10/10/2001 | CN1317150A Vapor deposition routes to nanoporous silica |
10/10/2001 | CN1316975A Process for preparing silica or silica-based thick vitreous films according to sol-gel technique and thick films thereby obtained |
10/10/2001 | CN1072736C Method of coating copper film on ceramic substrate |
10/10/2001 | CN1072735C Method of depositing aluminuium film |
10/10/2001 | CN1072529C Technology for coating decorative film on curved surface |
10/09/2001 | US6300244 Semiconductor device and method of manufacturing the same |
10/09/2001 | US6300144 Method for fabricating ferro-electric thin films using a sol-gel technique |
10/09/2001 | US6299942 Method of producing the plated molded articles by non-electrode plating, and the resin compositions for that use |
10/09/2001 | US6299750 While avoiding covering parts of the workpiece, provides coatings, in particular diamond coatings, which gradually vary in size over the subregions of the workpiece. |
10/09/2001 | CA2045272C Process for improving the surface of liquid crystal polymers |
10/04/2001 | WO2001073163A1 Method for forming on a metal substrate a protective sulphur-free metal coating |
10/04/2001 | WO2001073162A2 Method for coating apparatuses and parts of apparatuses for the construction of chemical installations |
10/04/2001 | US20010025962 Field emmision type cold cathode device, manufacturing method thereof and vacuum micro device |
10/04/2001 | EP1139396A2 Fixture and method for uniform electroless metal deposition on integrated circuit bond pads |
10/04/2001 | EP1138803A2 Method for metallizing an insulator and/or a dielectric |
10/04/2001 | DE10016215A1 Verfahren zur Beschichtung von Apparaten und Apparateteilen für den chemischen Anlagenbau A process for coating apparatuses and apparatus parts for chemical plant |
10/04/2001 | CA2404435A1 Method for coating apparatuses and parts of apparatuses for the construction of chemical installations |
10/03/2001 | CN1316023A Method and apparatus for copper plating using electroless plating and electroplating |
10/03/2001 | CN1315589A Treating method of non-electrolyzing plating and pretreatment agent |
10/03/2001 | CN1315249A Resin coated metal plate with good machinability and thermal stability |
10/03/2001 | CN1072278C Currentless metallisation process for non electro-conductive substrates |
10/03/2001 | CA2342954A1 Process for decorating an item, and item decorated using the process |
10/02/2001 | US6297140 Method to plate C4 to copper stud |
10/02/2001 | US6296897 Process for reducing extraneous metal plating |
09/27/2001 | US20010024842 Film production method and film produced thereby |
09/27/2001 | US20010024691 Semiconductor substrate processing apparatus and method |
09/27/2001 | US20010024685 Method for forming a protective coating and substrates coated with the same |