| Patents for C23C 18 - Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating (16,252) |
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| 04/03/2003 | US20030062398 Method for manufacturing raised electrical contact pattern of controlled geometry |
| 04/03/2003 | US20030062334 Method for forming a micro-pattern on a substrate by using capillary force |
| 04/02/2003 | EP1297200A1 Activation of a cathode |
| 04/02/2003 | EP1297198A2 Electroless platinum-rhodium alloy plating |
| 04/02/2003 | EP1297197A2 Electroless autocatalytic platinum plating |
| 04/02/2003 | EP1297196A2 Electroless silver plating |
| 04/02/2003 | CN1407132A Nonelectrolytic gold plating liquid and method thereof |
| 04/02/2003 | CN1407018A Silane composition, silicon film forming method and manufacture of solar cells |
| 04/01/2003 | US6541080 Surface of the plastic object is roughened by pickling, activated with the a colloidal or ionogenic aqueous solution also contains a second base metal, providing electron conductivity with alkaline treatment and metallizing |
| 04/01/2003 | CA2281231C Method for producing electro- or electroless-deposited film with a controlled crystal orientation |
| 03/27/2003 | WO2003025256A1 Platable engineered polyolefin alloys |
| 03/27/2003 | US20030060873 Providing an electrochemical solution comprising metal and bioactive material; contacting electrochemical solution and substrate; forming a bioactive composite structure on substrate using an electrochemical procedure |
| 03/27/2003 | US20030060040 Method of electroless plating copper on nitride barrier |
| 03/27/2003 | US20030059642 Method of making lead-free solder and solder paste with improved wetting and shelf life |
| 03/27/2003 | US20030059621 Plating resin molded article and process for producing the same |
| 03/27/2003 | US20030059550 Method of film formation, insulating film, and substrate for semiconductor |
| 03/27/2003 | US20030059544 Photodegradation of complex |
| 03/27/2003 | US20030057091 Gas sensing element and method for manufacturing the same |
| 03/27/2003 | US20030056728 Method and device for depositing at least one precursor, which is in liquid or dissolved form, on at least one substrate |
| 03/27/2003 | CA2460879A1 Platable engineered polyolefin alloys |
| 03/26/2003 | EP1296365A2 Method of film formation, insulating film, and substrate for semiconductor |
| 03/26/2003 | EP1296358A2 Process for producing semiconductor substrates |
| 03/26/2003 | EP1295985A1 Method for making coated metallic cord |
| 03/26/2003 | EP1295344A2 Direct printing of thin-film conductors using metal-chelate inks |
| 03/26/2003 | EP1295337A1 Process for the manufacture of printed circuit boards with plated resistors |
| 03/26/2003 | CN1406288A Pretreating agent for plating and method for metal plating using the same |
| 03/26/2003 | CN1404983A Metallization treatment method for plastic surface |
| 03/25/2003 | US6538214 Method for manufacturing raised electrical contact pattern of controlled geometry |
| 03/25/2003 | US6537845 Chemical surface deposition of ultra-thin semiconductors |
| 03/25/2003 | US6537830 Method of making ferroelectric FET with polycrystalline crystallographically oriented ferroelectric material |
| 03/20/2003 | WO2003023848A2 Apparatus and method of surface treatment for electrolytic and electroless plating of metals in integrated circuit manufacturing |
| 03/20/2003 | WO2003023087A1 Plated resin molding and process for producing the same |
| 03/20/2003 | WO2003023086A2 Use of a solution for roughening the surface of plastics |
| 03/20/2003 | WO2003002773A3 Treatment for improved magnesium surface corrosion-resistance |
| 03/20/2003 | WO2002079542A9 Improved adhesion of polymeric materials to metal surfaces |
| 03/20/2003 | US20030054633 Method of electroless plating copper on nitride barrier |
| 03/20/2003 | US20030054114 Method for coating apparatuses and parts of apparatuses for the construction of chemical installation |
| 03/20/2003 | US20030054094 Using glycolic acid reducing agent |
| 03/20/2003 | US20030052330 Providing a first electrode layer and an overlying chalcogenide material; plating a conductive metal onto the chalcogenide to form diffusion layer, diffusing metal ions into chalcogenide to form resistance variable material |
| 03/19/2003 | EP1292718A2 Method for depositing metal and metal oxide films and patterned films |
| 03/19/2003 | CN1404120A Method for removing stain from through-hole |
| 03/19/2003 | CN1403628A Method of activating non-conducting base plate for non-electric plating |
| 03/19/2003 | CN1403234A Hollow metal particle with microbe cell template and its prepn process |
| 03/19/2003 | CN1403233A Silver-plated copper powder and its prepn process |
| 03/18/2003 | WO2002028528A1 Supported catalyst consisting of metal of the platinum group and obtained by means of controlled electroless deposition |
| 03/18/2003 | US6534865 Method of enhanced fill of vias and trenches |
| 03/18/2003 | US6534124 Molding a thermoplastic resin having a specific Izod impact strength and a Rockwell surface hardness and an inorganic filler, air blasting the surface, catalyst coating, activation treatment and electroless plating. |
| 03/18/2003 | US6534117 Electroless plating method and electroless plating solution |
| 03/18/2003 | US6533849 Electroless gold plated electronic components and method of producing the same |
| 03/18/2003 | CA2422806A1 Supported catalyst consisting of metal of the platinum group and obtained by means of controlled electroless deposition |
| 03/13/2003 | WO2003021648A1 Chemical surface deposition of ultra-thin semiconductors |
| 03/13/2003 | WO2003021005A1 Method of plating nonconductor product |
| 03/13/2003 | WO2003021004A1 Process for making thin film porous ceramic-metal composites and composites obtained by this process |
| 03/13/2003 | WO2003020446A1 Rocess for plating particulate matter |
| 03/13/2003 | WO2003020443A1 Electroless nickel plating solution and process for its use |
| 03/13/2003 | WO2002056650A3 Forming a conducor circuit on a substrate |
| 03/13/2003 | US20030049169 Automatic analyzing/controlling device for electroless composite plating solution |
| 03/13/2003 | US20030048314 Direct write TM system |
| 03/13/2003 | US20030047108 Adhesion properties and high solderability |
| 03/13/2003 | CA2458620A1 Chemical surface deposition of ultra-thin semiconductors |
| 03/12/2003 | EP1200640B1 Coating method |
| 03/12/2003 | CN1402363A Method for coating nucleic acid with metal by means of non-field produced metal nanoparticles |
| 03/12/2003 | CN1401822A Coating method |
| 03/12/2003 | CN1401819A Inorganic powder surface metallizing method |
| 03/12/2003 | CN1103116C Process for making electronic devices having low-leakage current and low-polarization fatigue |
| 03/12/2003 | CN1102948C Multi coated interference pigment |
| 03/11/2003 | US6531047 Treating nickel-phosphide plated aluminum substrate with functional water |
| 03/06/2003 | WO2003018871A2 Direct surface patterning of carbon |
| 03/06/2003 | WO2002065536A3 Rapid-temperature pulsing anneal method at low temperature for fabricating layered superlattice materials and making electronic devices including same |
| 03/06/2003 | US20030045632 Silane composition, silicon film forming method and solar cell production method |
| 03/06/2003 | US20030044540 Manufacturing method of anti-corrosive multi-layered structure material |
| 03/06/2003 | US20030044527 Process for plating particulate matter |
| 03/05/2003 | EP1289038A2 Manufacturing method of anti-corrosive multi-layered structure material |
| 03/05/2003 | EP1287179A2 Method for producing three-dimensional, selectively metallized parts and a three-dimensional, selectively metallized part |
| 03/05/2003 | EP1005261B1 Adhesive for electroless plating, feedstock composition for preparing adhesive for electroless plating, and printed wiring board |
| 03/05/2003 | CN1401018A A method for providing a protective coating for carbonaceous components of an electrolysis cell |
| 03/04/2003 | US6528185 Electrolessly depositing on copper and copper alloys a ternary amorphous-microcrystalline cobalt alloy of cobalt, tungsten and phosphorus from an aqueous bath to achieve a barrier layer to impede the migration of copper atoms to the overplate |
| 03/04/2003 | US6528184 Cobalt-molybdenum-phosphorus alloy diffusion barrier coatings |
| 03/04/2003 | US6527925 Contact assemblies, methods for making contact assemblies, and plating machines with contact assemblies for plating microelectronic workpieces |
| 03/04/2003 | US6527853 Method for producing nitride monocrystals |
| 03/04/2003 | US6527847 Coating composition |
| 03/04/2003 | US6527840 Consisting of palladium ions, gold ions and rhodium ions, the silver ions and at least one metal ion having a concentration of 0.001 to 0. 01 mol/l |
| 02/27/2003 | WO2003017359A1 Semiconductor device and production method therefor, and plating solution |
| 02/27/2003 | US20030040194 Spin-on glass composition and method of forming silicon oxide layer in semiconductor manufacturing process using the same |
| 02/27/2003 | US20030039755 Protective coatings; from high temperature gas, melt; vaporization polyoxyethylene glycol, decomposing metal compound |
| 02/27/2003 | US20030039754 Preactivation of plastic surfaces to be metallized |
| 02/26/2003 | EP1286576A2 Method for manufacturing copper-resin composite material |
| 02/26/2003 | EP1285979A1 Displacement gold plating solution |
| 02/26/2003 | EP1285978A2 Method of controlling drying stresses by restricting shrinkage of ceramic coatings |
| 02/26/2003 | EP1285102A1 High density ceramic thick film fabrication method by screen printing |
| 02/25/2003 | US6524724 Control of magnetic film grain structure by modifying Ni-P plating of the substrate |
| 02/25/2003 | US6524663 Method for selective activation and metallization of materials |
| 02/25/2003 | US6524645 Process for the electroless deposition of metal on a substrate |
| 02/25/2003 | US6524642 Electroless metal-plating process |
| 02/25/2003 | US6524490 Method for electroless copper deposition using a hypophosphite reducing agent |
| 02/25/2003 | US6523256 Method of manufacturing a wiring board |
| 02/20/2003 | WO2003014416A2 Plating device and method |
| 02/20/2003 | WO2002099847A3 Apparatus and method for rotating drum chemical bath deposition |
| 02/20/2003 | WO2002036852A3 Selective fiber metallization |
| 02/20/2003 | US20030036269 Method of removing smear from via holes |