| Patents for C23C 18 - Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating (16,252) |
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| 01/17/2002 | WO2002004701A2 Electroless autocatalytic platinum plating |
| 01/17/2002 | WO2002004700A2 Electroless silver plating |
| 01/17/2002 | WO2002004699A1 Surface modified stainless steel |
| 01/17/2002 | WO2002004693A2 Improvement in the production of a zinc-aluminum alloy coating by immersion into molten metal baths |
| 01/17/2002 | WO2001032951A3 Chemical fluid deposition for the formation of metal and metal alloy films on patterned and unpatterned substrates |
| 01/17/2002 | CA2415781A1 Electroless rhodium plating |
| 01/17/2002 | CA2415780A1 Electroless platinum-rhodium alloy plating |
| 01/17/2002 | CA2415772A1 Electroless autocatalytic platinum plating |
| 01/17/2002 | CA2415724A1 Electroless silver plating |
| 01/17/2002 | CA2415326A1 Improvement in the production of a zinc-aluminum alloy coating by immersion into molten metal baths |
| 01/16/2002 | EP1172824A1 Conductive electrolessly plated powder, its producing method, and conductive material containing the plated powder |
| 01/16/2002 | EP1171648A1 Composition and process for treating metal surfaces |
| 01/16/2002 | EP1171646A1 Non-electrolytic gold plating compositions and methods of use thereof |
| 01/15/2002 | US6338868 Forming coatings with silane from polysilazane and dialkyl alkanol amine for coatings |
| 01/15/2002 | US6338787 Bath precursor is formed stabilizing the bath so that reduction and deposition of the second metal ions do not occur in order to improve its storing performance; supplying the electrical current to the plating bath, to reduce first metal |
| 01/15/2002 | CA2178146C Electroless nickel cobalt phosphorous composition and plating process |
| 01/13/2002 | CA2343440A1 Ultrasonic process for autocatalytic deposition of metal |
| 01/10/2002 | WO2002002847A1 Activation of a cathode |
| 01/10/2002 | WO2002002313A1 Gas-barrier film |
| 01/10/2002 | WO2001038940A3 Method for surface patterning using a focused laser |
| 01/10/2002 | WO2001038603A3 Metallizing method for dielectrics |
| 01/10/2002 | US20020004320 Attaratus for socketably receiving interconnection elements of an electronic component |
| 01/10/2002 | US20020004180 Electroconductive zones on dielectric |
| 01/10/2002 | US20020004145 Crown compounds |
| 01/10/2002 | US20020003048 Metal interconnections and active matrix substrate using the same |
| 01/10/2002 | DE10129242A1 Bath used for copper plating an electrode in an electronic component contains a copper compound, a copper ion complex former, a reducing agent, a reagent for influencing the pH, and a carboxylic acid as oxidation accelerator |
| 01/09/2002 | EP1170251A1 Compositions for forming metal oxide films |
| 01/09/2002 | EP0719350B1 Metal treatment with acidic, rare earth ion containing cleaning solution |
| 01/09/2002 | CN2470369Y Chemical nicked-plating liquid regenerating treatment apparatus |
| 01/09/2002 | CN1330734A Double-dip Pd/Sn crossliker |
| 01/09/2002 | CN1330396A Method for dipositing copper on barrier layer |
| 01/08/2002 | US6337032 Providing sol-gel precursor solution comprising inorganic salt and alkoxide of metal, coating, heating, stabilizing, driving off volatile components, forming crystalline phase |
| 01/08/2002 | US6336962 Making aqueous solution of gold, formic acid and aromatic carboxylic acid derivatives, adjusting ph between 1-6, plating on palladium surface |
| 01/08/2002 | US6336716 Ink jet head having pressurizing means comprising piezoelectric element of ferroelectric material containing at least two metals and in situ produced fine particles of material having identical or similar crystal structure |
| 01/08/2002 | US6336269 Method of fabricating an interconnection element |
| 01/08/2002 | CA2228095C Electrode structural body, rechargeable battery provided with said electrode structural body, and process for the production of said electrode structural body and said rechargeable battery |
| 01/03/2002 | WO2002001636A1 Process for the manufacture of printed circuit boards with plated resistors |
| 01/03/2002 | WO2001051276A3 Fabrication of metallic microstructures via exposure of photosensitive composition |
| 01/03/2002 | US20020002128 Aqueous solutions containing dithionic acid and/or metal dithionate |
| 01/03/2002 | US20020001709 Primer for metallizing substrate surfaces |
| 01/02/2002 | EP1167322A1 Article comprising a substrate containing silicon and a barrier layer which functions as a protective/thermal barrier coating |
| 01/02/2002 | EP1165223A1 Method for coating particles |
| 01/02/2002 | CN2469018Y Equipment for chemically plating copper onto welding wire |
| 01/02/2002 | CN1328888A Direct quick precision metal type forming method based on liquid thermochemical reaction |
| 01/01/2002 | US6335107 Useful as an electrical connector |
| 01/01/2002 | US6335104 Providing a copper pad surface; selectively depositing a protection layer of phosphorus or boron-containing metal alloy on the copper pad surface; depositing adhesion layer of noble metal |
| 12/27/2001 | US20010055729 Metallic pattern on support |
| 12/27/2001 | US20010054905 Probe card assembly and kit |
| 12/27/2001 | US20010054728 Metal oxide integrated circuit on silicon germanium substrate |
| 12/26/2001 | CN1327894A Process for preparing light metallic microspheres with natural pollen as core skeleton |
| 12/25/2001 | US6333716 Method for manufacturing an antenna body for a phone |
| 12/20/2001 | WO2001096632A2 A method and apparatus for conditioning electrochemical baths in plating technology |
| 12/20/2001 | US20010052467 Making thermally stable electromagnetic coil vanes, by photolithographically exposing high resolution, dense wire patterns in copper on both sides of ceramic substrate, plating additional copper and firing to eutectically bond |
| 12/19/2001 | EP1164207A2 Method for preparing metal oxide film |
| 12/19/2001 | EP1060291B1 Method for producing a corrosion protective coating and a coating system for substrates made of light metal |
| 12/19/2001 | CN1327085A Process for preparing lanthanum-strontium-cobalt-oxygen conductive film material |
| 12/18/2001 | US6331348 Substrate having repaired metallic pattern and method and device for repairing metallic pattern on substrate |
| 12/18/2001 | US6331330 Pressure feeding precursor solvent and a ph-modifying catalyst, generating electric providing corona spray of droplets, electrostatically guiding towards the substrate, decreasing temperature gradient, evaporating from solvent, |
| 12/18/2001 | US6331239 Applying a catalyst for electroless plating using a colloidal solution containing a tin compound and a palladium compound, copper, reducing agent consisting of a saccharide, a complexing agent and an alkali metal hydroxide |
| 12/18/2001 | US6331201 Acidic mixture containing dissolved bismuth, halide ion, and a sulfur-containing ligand as a complexing agent. |
| 12/18/2001 | CA1341327C Methods for depositing finish coatings on substrates of anodisable metals and the products thereof |
| 12/13/2001 | WO2000029501A9 Radioactive coating solutions, methods, and substrates |
| 12/13/2001 | US20010051682 Treating the surface of a molded article of thermoplastic resin of given impact strength and hardness, and an inorganic filler with blast to roughen surface, then catalyst coating, activation treatment and electroless plating |
| 12/13/2001 | US20010051211 Manufacturing method and plating apparatus for film carrier tape |
| 12/13/2001 | US20010050100 Semiconductors |
| 12/12/2001 | EP0902854B1 Process for making thermally stable metal coated polymeric monofilament |
| 12/12/2001 | CN1326425A Method of producing inorganic compound solid substance and method of manufacturing semiconductor device |
| 12/12/2001 | CN1326227A Metal inter-connector and active matrix bottom therewith |
| 12/11/2001 | US6330164 Interconnect assemblies and methods including ancillary electronic component connected in immediate proximity of semiconductor device |
| 12/11/2001 | US6329072 Complexing agent, a hypophosphorus acid compound, a metallic catalyst, compound containing an acetylenic bond as surfactant, uniform and acicular with excellent adhesion due to impregnation of a vast number of micropores with a prepreg. |
| 12/11/2001 | US6328861 Electrolytic apparatus using a hydrogen storage cathode |
| 12/11/2001 | US6328810 Removing loose contamination from hardware surfaces; selectively applying reactive metal and filler to preselected portion of hardware surfaces; heating to cause reaction between combustion products and reactive metal; cooling |
| 12/06/2001 | WO2001092596A2 Method for producing three-dimensional, selectively metallized parts and a three-dimensional, selectively metallized part |
| 12/06/2001 | US20010048979 Electroless plating a substrate using argon laser beams |
| 12/06/2001 | US20010048563 Article having at least a portion of the outer surface thereof coated with a metallic mirror surface |
| 12/06/2001 | US20010047944 Means for holding plurality of wafers and rotating each wafer at constant speed and synchronous within the plurality for electroless plating of bondable metal caps onto bond pads of integrated corcuits having copper metallization |
| 12/05/2001 | EP1160356A1 Electroless plating solution and method of forming wiring with the same |
| 12/05/2001 | EP1021593B1 Method and solution for producing gold coatings |
| 12/05/2001 | EP0815588B1 Low temperature process for fabricating layered superlattice materials |
| 12/05/2001 | CN1075842C Process for generating metallic atom cluster-smaller than 10 nm or sequential 2D dot-matrix of metallic atoms on single-molecular film |
| 12/04/2001 | US6327135 Thin film capacitors on gallium arsenide substrate |
| 12/04/2001 | US6326303 Copper electroless deposition on a titanium-containing surface |
| 11/29/2001 | WO2001090727A1 Automatic analyzing/controlling device for electroless composite plating solution |
| 11/29/2001 | US20010045362 Fabrication of metallic microstructures via exposure of photosensitive composition |
| 11/29/2001 | US20010045361 Seeding; solvent selective removal |
| 11/28/2001 | EP1158573A1 Method and apparatus for forming interconnection |
| 11/28/2001 | EP1158073A1 Plating method, wiring forming method and devices therefor |
| 11/28/2001 | EP1157149A1 DOUBLE-DIP Pd/Sn CROSSLINKER |
| 11/28/2001 | EP1157076A1 Radioactive coating solutions, methods, and substrates |
| 11/28/2001 | CN1324412A Method for metallizing surface of a solid polymer substrate and the product obtd. |
| 11/28/2001 | CN1324275A Silver film incorporating protective insoluble metallic salt precipitate |
| 11/28/2001 | CN1323919A Acid chemical plating liquid of nickel-base multicomponent alloy resisting corrosion of sea water |
| 11/28/2001 | CN1323918A Chemical Ni-P plating process with high compactedness and high corrosion resitance |
| 11/22/2001 | WO2001088222A1 High density ceramic thick film fabrication method by screen printing |
| 11/22/2001 | WO2001088211A2 Method for the treatment of work pieces with a palladium colloid solution |
| 11/22/2001 | WO2001087469A1 Separation module and method for producing the same |
| 11/22/2001 | CA2404620A1 Method for the treatment of work pieces with a palladium colloid solution |
| 11/21/2001 | EP1156024A1 Composite ceramic precursors and layers |
| 11/21/2001 | EP1155170A1 Method for producing nitride monocrystals |
| 11/21/2001 | EP1155162A2 Metallizable moulded part |