| Patents for C23C 18 - Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating (16,252) |
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| 06/14/2000 | CN1256854A Adhesive for electroless plating, feedstock composition for preparing adhesive for electroless plating, and printed wiring board |
| 06/14/2000 | CN1256718A Coating method for elongated metal blanks |
| 06/13/2000 | US6074962 Forming a silica based coating by hydrolysis of trialkloxy silane, drying, radiation, coating and drying |
| 06/08/2000 | WO2000033625A1 Process for depositing conducting layer on substrate |
| 06/08/2000 | WO2000032516A1 Method of producing inorganic compound solid substance and method of manufacturing semiconductor device |
| 06/08/2000 | CA2351607A1 Method of forming inorganic compound solid and method of manufacturing semiconductor device employing the same |
| 06/08/2000 | CA2350506A1 Process for depositing conducting layer on substrate |
| 06/07/2000 | EP1006213A2 Process for regenerating a processing solution |
| 06/07/2000 | CN1255438A Technology for coating decorative film on curved surface |
| 06/07/2000 | CN1053231C Plating bath for chemical plating nickel-phosphorus alloy and chemical plating process |
| 06/06/2000 | US6072207 Process for fabricating layered superlattice materials and making electronic devices including same |
| 06/06/2000 | US6071623 Hydrophilic article and method for producing same |
| 06/06/2000 | US6071622 Coated article with alloy substrate and diffusion barrier layer |
| 06/06/2000 | US6071606 Hydrophilic film and method for forming same on substrate |
| 06/06/2000 | US6071555 Ferroelectric thin film composites made by metalorganic decomposition |
| 06/06/2000 | US6071554 Process for forming electrode for ceramic sensor element by electroless plating |
| 06/02/2000 | WO2000031319A1 Electroless silver plating solution for electronic parts |
| 06/02/2000 | WO2000031318A1 Electroless silver plating solution for electronic parts |
| 05/31/2000 | EP1005261A1 Adhesive for electroless plating, feedstock composition for preparing adhesive for electroless plating, and printed wiring board |
| 05/31/2000 | EP0885315B1 Misted precursor deposition apparatus and method with improved mist and mist flow |
| 05/31/2000 | EP0811083B1 Electroless deposition of metal films with spray processor |
| 05/30/2000 | US6068938 Zn layer of an average thickness of 0.6 mum or more, or a zn deposition of 0.43 mg/cm2 or more formed on the mg alloy base material. |
| 05/30/2000 | US6068690 Precursor solution for forming thin film of ferroelectric substance and production process thereof |
| 05/25/2000 | WO2000029646A1 Process for metallizing a plastic surface |
| 05/25/2000 | WO2000029638A1 Electroless silver plating solution for electronic parts |
| 05/25/2000 | WO2000029501A1 Radioactive coating solutions, methods, and substrates |
| 05/25/2000 | DE19950562A1 Chip-type electronic component manufacturing method for filter, involves activating irradiation portion of film, which is then precipitated by immersing substrate in non-electrolytic bath |
| 05/25/2000 | CA2350422A1 Process for metallizing a plastic surface |
| 05/24/2000 | CN1254385A Metal paste and method for production of metal film |
| 05/23/2000 | US6066592 Gas separator |
| 05/23/2000 | US6066581 Sol-gel precursor and method for formation of ferroelectric materials for integrated circuits |
| 05/23/2000 | US6066406 Coating compositions containing nickel and boron |
| 05/23/2000 | US6065424 Electroless deposition of metal films with spray processor |
| 05/18/2000 | WO2000028115A1 Plating method and apparatus |
| 05/18/2000 | WO2000028108A2 Non-electrolytic gold plating compositions and methods of use thereof |
| 05/18/2000 | WO2000011233A3 Fluxing process for galvanization of steel |
| 05/18/2000 | DE19852776A1 Plastic metallization process comprises irradiating photosensitive particle-filled plastic workpiece to expose surface particles prior to electroless plating |
| 05/17/2000 | EP1001052A2 Method for metallizing a plastic surface |
| 05/16/2000 | US6063445 Preconditioning etching |
| 05/16/2000 | US6063172 Aqueous immersion plating bath and method for plating |
| 05/16/2000 | US6063143 Saturating a cation exchange resin with nickel ions, followed by treating it with an aqueous solution of boron hydride of an alkali metal. |
| 05/16/2000 | US6062015 Spinning rotor for an open-end spinning machine and method for coating the same |
| 05/11/2000 | WO2000006958A3 A method for preventing water accumulation and ice formation on the evaporators and condensers of refrigerators |
| 05/10/2000 | WO2000059022A1 Process for the formation of silicon oxide films |
| 05/09/2000 | US6060176 Corrosion protection for metallic features |
| 05/09/2000 | US6060121 Microcontact printing of catalytic colloids |
| 05/09/2000 | CA2193007C Process for extending the life of a displacement plating bath |
| 05/04/2000 | WO2000024951A2 Decorative beverage can bodies |
| 05/04/2000 | WO2000024948A1 Composition and process for treating metal surfaces |
| 05/04/2000 | CA2349376A1 Composition and process for treating metal surfaces |
| 05/04/2000 | CA2347831A1 Decorative beverage can bodies |
| 05/03/2000 | EP0997061A1 Method for metallization of a substrate containing electric non-conductive surface areas |
| 05/03/2000 | EP0996771A1 Method for applying a coating to a metal substrate or repairing a coating applied to the same |
| 05/03/2000 | EP0920544B1 Durable electrode coatings |
| 05/03/2000 | EP0818561B1 Protection coatings produced by sol-gel on silver reflectors |
| 05/03/2000 | CN1252107A Method for providing metal surface with vitreous layer |
| 05/02/2000 | US6056994 Liquid deposition methods of fabricating layered superlattice materials |
| 05/02/2000 | US6056870 Method of promoting the decomposition of silicon compounds in a process for depositing silicon upon a metal surface |
| 05/02/2000 | CA2154809C Method of promoting the decomposition of silicon compounds in a process for depositing silicon upon a metal surface |
| 04/27/2000 | WO2000023637A1 Method and device for electrodialytic regeneration of an electroless metal deposition bath |
| 04/27/2000 | WO2000010200A8 Wafer plating method and apparatus |
| 04/27/2000 | WO1999060095A3 Formation and metallization of high aspect ratio lipid microtubules |
| 04/25/2000 | US6054495 Synthesis of unagglomerated metal nano-particles at membrane interfaces |
| 04/25/2000 | US6054174 Method of making an electronic apparatus casing |
| 04/25/2000 | US6054173 Forming patterned aluminum layer on substrate, such that titanium-containing surface is exposed in selected regions; depositing copper from electroless solution onto exposed regions of titanium-containging surface adjacent to catalyst |
| 04/25/2000 | US6054172 Forming patterned catalyst material on substrate, such that titanium-containing surface is exposed in selected regions; depositing copper from electroless solution onto exposed regions of titanium-containing surface adjacent to catalyst |
| 04/20/2000 | DE19851180C1 Chemical reduction metal plating solution is regenerated using a weakly basic anion exchanger for hypophosphite ion recycle to the cathodic chamber of an electrodialysis cell |
| 04/19/2000 | CN1051584C Bronze plating liquid, prepn. method and use therefor |
| 04/18/2000 | US6049976 Method of mounting free-standing resilient electrical contact structures to electronic components |
| 04/13/2000 | WO2000020663A1 Substrate plating device |
| 04/13/2000 | WO2000020656A1 A method of metallizing the surface of a solid polymer substrate and the product obtained |
| 04/12/2000 | EP0807192B1 Process for batch-plating aramid fibers |
| 04/11/2000 | US6048804 Process for producing nanoporous silica thin films |
| 04/11/2000 | US6048790 Metalorganic decomposition deposition of thin conductive films on integrated circuits using reducing ambient |
| 04/11/2000 | US6048585 Precipitation with an alkali metal or alkaline earth metal cation such as calcium. |
| 04/11/2000 | US6048445 Metal seed layer is then deposited over a photoresist layer utilizing a directional deposition technique. a portion of the metal seed layer is then removed. a metal plating is then formed on the metal seed layer |
| 04/06/2000 | WO1999060189A3 Method for metal coating of substrates |
| 04/04/2000 | US6045866 Method of forming electroless metal plating layers on one single surface of a plastic substrate and the product thereof |
| 04/04/2000 | US6045860 Controlling temperature and deposition rates |
| 04/04/2000 | US6045859 Treating with an aqueous solution of an alkali metal or ammonium dithiosulfatoaurate having a gold concentration of 0.1-10% by weight; evaporating the water and decomposing the dithiosulfatoaurate by heating to 300-1400 degrees. c. |
| 04/04/2000 | US6045680 Process for making thermally stable metal coated polymeric monofilament or yarn |
| 04/04/2000 | US6045604 Autocatalytic chemical deposition of zinc tin alloy |
| 03/29/2000 | EP0989205A1 Metal paste and method for production of metal film |
| 03/29/2000 | CN1248641A 化学镀镍液 Chemical nickel plating solution |
| 03/29/2000 | CN1050865C Solution and coating methodfor chemically plating amorphous nickel, chromium and phosphur alloys |
| 03/28/2000 | US6042889 Immersing substrate in aqueous plating bath containing dissolved metal salt, chelating agent, reducing agent, dissolved mediator organometallic compound |
| 03/28/2000 | US6042883 Pyrolysis of olefinic, borane or carborane polymer containing organo-transition metal moieties |
| 03/28/2000 | US6042712 Apparatus for controlling plating over a face of a substrate |
| 03/28/2000 | US6041828 Copper installation pipe having a tin coating applied with temperature control so as to be adherent over the entire inner surface; intermetallic phase formed at the transition from the copper pipe to the tin coating is less than 20% |
| 03/23/2000 | WO2000016597A1 Printed wiring board and its manufacturing method |
| 03/23/2000 | WO2000015352A1 Electroless metal deposition of electronic components in an enclosable vessel |
| 03/22/2000 | EP0987218A1 Process for the formation of oxide ceramic thin film |
| 03/22/2000 | CN1248300A Microporous copper film and electroless copper plating solution for obtaining the same |
| 03/22/2000 | CN1050523C Apparatus for maintaining stable autodeposition bath |
| 03/16/2000 | WO2000014306A1 Method for plating substrate and apparatus |
| 03/16/2000 | WO2000014013A1 Process for preparing silica or silica-based thick vitreous films according to the sol-gel technique and thick films thereby obtained |
| 03/15/2000 | EP0985333A1 New process for modification of surfaces |
| 03/15/2000 | EP0792387B1 Method of coating cutting tool inserts |
| 03/15/2000 | EP0772771B1 Determining biodegradability of aspartic acid derivatives, degradable chelants, uses and compositions thereof |
| 03/15/2000 | CN1247577A Pretreatment solution and pretreatment process of chemical nickle plating |