Patents for C23C 18 - Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating (16,252)
11/2003
11/06/2003US20030207034 Method and apparatus for improving interfacial chemical reactions
11/06/2003US20030205478 Object plating method and system
11/06/2003US20030205169 Reacting titanium tetraalkoxide and/or a low condensation product containing a group hydrolyzable to a hydroxyl group with a solution of H2O2 in water; immediately followed by coordinating with H2O2 to form a chelate solution
11/06/2003US20030205073 Electrostatically fiber planted steel sheet and production process therefor
11/05/2003EP1357989A1 Process for degassing an aqueous plating solution
11/05/2003CN1453393A Environment protecting metal surface alloy treating liquid
10/2003
10/30/2003US20030204016 Modified polyurethanes, a process for their preparation, and electroplated or metallized molded articles produced therefrom
10/30/2003US20030203232 Comprises sonicated bath to form undercoat/topcoat; powder coating; brush plating
10/30/2003US20030203207 Process for coating particles
10/30/2003US20030203172 Constructions comprising solder bumps
10/30/2003US20030203111 Copper metal precursor
10/30/2003US20030201538 Method of forming metal interconnection using plating and semiconductor device manufactured by the method
10/29/2003EP1357153A1 Modified polyurethane, process for the production thereof and use thereof
10/29/2003CN1451782A Ni-P composite coating contg. silicon carbide and PTFE
10/29/2003CN1126190C Method for manufacture of antenna body for telephone, relative antenna component and telephone
10/28/2003US6639262 Metal oxide integrated circuit on silicon germanium substrate
10/28/2003US6638573 Spectacles frame surface treatment method
10/28/2003US6638564 Method of electroless plating and electroless plating apparatus
10/28/2003US6638359 Deposited film forming apparatus and deposited film forming method
10/23/2003WO2003087707A2 Metallization of carbon nanotubes for field emission applications
10/23/2003WO2003086659A1 Solution for sealing porous metal substrates and process of applying the solution
10/23/2003US20030197962 Metal salt solution for forming a metallic mirror surface on a receiving surface
10/23/2003US20030197961 Method for forming a metallic mirror surface on a receiving surface
10/23/2003US20030196901 Chemically depositing metals into high aspect ratio structures on substrate; semiconductors
10/23/2003US20030196892 Contact assemblies, methods for making contact assemblies, and plating machines with contact assemblies for plating microelectronic workpieces
10/23/2003CA2477299A1 Metallization of carbon nanotubes for field emission applications
10/22/2003EP1354982A1 Method for enhancing the solderability of a surface
10/22/2003EP1354073A2 Method for the treatment of work pieces with a palladium colloid solution
10/22/2003CN1451056A Improvement in the production of a zinc-aluminum alloy coating by immersion into molten metal baths
10/22/2003CN1450599A Methof for preparing 3-D orientation zinc oxide film
10/21/2003US6635410 Metallizing method for dielectrics
10/21/2003CA2213209C Method for producing thick ceramic films by a sol gel coating process
10/16/2003WO2003085167A1 Method for copper-plating or bronze-plating an object and liquid mixtures therefor
10/16/2003WO2003085166A2 Electroless deposition methods
10/16/2003WO2003084628A2 Process for preparing palladium alloy composite membranes for use in hydrogen separation, palladium alloy composite membranes and products incorporating or made from the membranes
10/16/2003WO2002099163A3 Autocatalytic coating method
10/16/2003US20030194494 Forming fiber array bases having V-grooves on one surface; forming a Ni/Cr alloy or aluminum metal through evaporation or sputtering; sensitizing the surface with Sn2+ from deionized water and SnCl2; electroless nickel plating
10/16/2003US20030194485 Alloy plating solution for surface treatment of modular printed circuit board
10/16/2003US20030192443 Surface for a structural component of a printing machine
10/15/2003EP1353539A2 PWB manufacture
10/15/2003EP1352108A1 Coating compositions containing nickel and boron and particles
10/15/2003CN1448538A Bath and method for coating bright and high anticorrosion alloy layer on metal surface
10/15/2003CN1448537A Nonconductor surface metallization method
10/15/2003CN1124647C Interconnect structure in semiconductor device and method of formation
10/15/2003CN1124366C Three-layer coating-plating technology for metal surface
10/14/2003US6632539 Polycrystalline thin film and method for preparing thereof, and superconducting oxide and method for preparation thereof
10/14/2003US6632473 Method of producing ferrite thin film
10/14/2003US6632335 Filling a metal such as copper in fine interconnection pattern recesses on a semiconductor
10/09/2003WO2003083155A2 Patterned hydrophilic-oleophilic metal oxide coating and method of forming
10/09/2003US20030190812 Electroless deposition method
10/09/2003US20030190486 Process for Preparing Palladium Alloy Composite Membranes for Use in Hydrogen Separation, Palladium Alloy Composite Membranes and Products Incorporating or Made from the Membranes
10/09/2003US20030190426 Electroless deposition
10/09/2003US20030189026 Electroless deposition method
10/08/2003EP1097254B1 Foam-coating method for making antenna elements
10/08/2003CN1447866A Electroless displacement gold plating solutirn and additive for preparing said plating solution
10/02/2003US20030186071 Used in oil wells; core of carbon steel coated with a copper alloy
10/02/2003US20030186022 Charge-giving body, and pattern-formed body using the same
10/02/2003US20030185975 Spin coating solution composed of silica precursor, water, alcohol, single proton acid, and polyoxyethylene (20) sorbitan compounds into a film; removing water and alcohol, baking; calcining; dehydroxylating
10/02/2003US20030184954 Separation module and method for producing the same
10/02/2003US20030183938 Methods of forming metal-containing films over surfaces of semiconductor substrates; and semiconductor constructions
10/02/2003US20030183120 Electroless copper plating solution, the electroless copper plating supplementary solution, and the method of manufacturing wiring board
10/01/2003EP1349206A2 Power module member manufactured by wet treatment, and wet treatment method and wet treatment equipment thereof
09/2003
09/30/2003US6627559 Coating film
09/30/2003US6627544 Method of making a metal film pattern
09/30/2003US6627007 Surface modified stainless steel
09/30/2003US6626196 Arrangement and method for degassing small-high aspect ratio drilled holes prior to wet chemical processing
09/26/2003CA2413666A1 Charge-giving body, and pattern-formed body using the same
09/25/2003WO2003079476A1 Metal member having corrosion-resistant conductive coating and process for producing the same
09/25/2003WO2003078678A1 Method for forming interconnection metal layer, method for selectively forming metal, apparatus for selectively forming metal, and substrate apparatus
09/25/2003WO2003049176A3 Method for defining a source and a drain and a gap inbetween
09/25/2003WO2003033436A3 Coating precursor and method for coating a substrate with a refractory layer
09/25/2003WO2003033435A3 Coating precursor and method for coating a substrate with a refractory layer
09/25/2003WO2003018871A3 Direct surface patterning of carbon
09/25/2003US20030181040 Apparatus and method for electroless deposition of materials on semiconductor substrates
09/25/2003US20030180548 Process for preparing silica or silica-based thick vitreous films according to the sol-gel technique and thick films thereby obtained
09/25/2003US20030180451 Using writing tools; low temperature substrate; oxidation and electromigration resistance
09/25/2003US20030178107 Method for reducing copper solubility at the inner surface of a copper tube
09/25/2003US20030178102 Method of depositing epitaxial layers on a substrate
09/24/2003EP1347081A1 A plating method and apparatus with fixed immersed plating tool
09/24/2003EP1347078A2 Process for reducing the solubility of copper at the inner surface of a copper pipe
09/24/2003EP1345704A1 Method and apparatus for applying controlled succession of thermal spikes or shockwaves through a medium
09/24/2003EP0895508B1 Tungsten oxide solution and process for producing the same
09/23/2003US6624648 Probe card assembly
09/23/2003US6624070 Plating catalysts
09/23/2003US6623803 Copper interconnect stamping
09/23/2003US6622593 Lightweight wave gear device
09/23/2003CA2419630A1 Method for reducing copper solubility at the inner surface of a copper tube
09/18/2003US20030175411 Precursor compositions and methods for the deposition of passive electrical components on a substrate
09/18/2003US20030174384 Nanoparticle-based all-optical sensors
09/17/2003EP1343921A1 Method for electroless nickel plating
09/17/2003CN1443252A Surface modified stainless steel
09/17/2003CN1442508A Surface anticorrusion method of submarine
09/17/2003CN1121512C Coating method for elongated metal blanks
09/16/2003US6620456 Forming a dielectric layer by thermal decomposition of a metallo-organic material
09/10/2003CN1441856A Coating material for forming titanium oxide film, method for forming titanium oxide film and use of said coating material
09/10/2003CN1440951A Continuous chemical powder plating method and apparatus
09/09/2003US6617047 Method for coating apparatuses and parts of apparatuses used in chemical manufacturing
09/09/2003US6616978 Protecting a substrate with a multilayer oxide/phosphate coating having a temperature-stepped cure
09/09/2003US6616967 Method to achieve continuous hydrogen saturation in sparingly used electroless nickel plating process
09/09/2003US6616965 Non-hydrolytic-sol-gel process for high K dielectric