| Patents for C23C 18 - Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating (16,252) |
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| 12/18/2003 | CA2488553A1 Process for metallising support media made from plastic material |
| 12/18/2003 | CA2488116A1 Metallised parts made from plastic material |
| 12/18/2003 | CA2481133A1 Acidic solution for silver deposition and method for silver layer deposition on metal surfaces |
| 12/18/2003 | CA2432580A1 Electroless nickel plating solutions |
| 12/17/2003 | EP1371758A1 Aluminium deposition process on a piece made of plastic |
| 12/17/2003 | EP1371755A1 Method of electroless plating and apparatus for electroless plating |
| 12/17/2003 | EP1371754A1 Method for plating polymer molding material, circuit forming component and method for producing circuit forming component |
| 12/17/2003 | EP1371753A1 Pretreating method before plating and composites having a plated coat |
| 12/17/2003 | EP1371620A2 Method for spin coating including sol-gel processing |
| 12/17/2003 | EP1371606A1 Method of forming oxide-ceramics film |
| 12/17/2003 | EP1370497A2 Sol-gel derived resistive and conductive coating |
| 12/17/2003 | EP1301653B1 Coating blade and method for making same |
| 12/17/2003 | EP0772771B2 Determining biodegradability of aspartic acid derivatives, degradable chelants, uses and compositions thereof |
| 12/17/2003 | CN1462242A Processing method of creating rainbow color, method of manufacturing article which presents rainbow-colored reflective luster, and article which presents rainbow-colored reflective luster |
| 12/17/2003 | CN1461779A Substance for forming electrically-conducting film and electrically-conducting film and its manufacturing method |
| 12/16/2003 | US6664727 Field emision type cold cathode device, manufacturing method thereof and vacuum micro device |
| 12/16/2003 | US6664122 Electroless copper deposition method for preparing copper seed layers |
| 12/16/2003 | US6664115 Metal insulator structure with polarization-compatible buffer layer |
| 12/16/2003 | US6663976 Laminate articles on biaxially textured metal substrates |
| 12/16/2003 | US6663915 Immersing the substrate in a copper plating bath; immersing an activator in copper plating bath; performing a direct contact between activator and substrate to deposit copper on substrate |
| 12/11/2003 | WO2003102267A1 Method for electroless metalisation of polymer substrate |
| 12/10/2003 | EP1369504A1 Metal strip for the manufacture of components for electrical connectors |
| 12/10/2003 | EP1369501A2 Preparation of LCPMO thin films which have reversible resistance change properties |
| 12/10/2003 | EP1369404A2 Method for protecting a substrate with a multilayer oxide/phosphate coating having a temperature-stepped cure |
| 12/10/2003 | CN1461584A Improved adhesion of polymeric materials to metal surfaces |
| 12/10/2003 | CN1461043A Preparation of LCPMO film having reversible resistance change property |
| 12/10/2003 | CN1460730A Metallization method of bimaleimide resin-glass fibre composite material |
| 12/09/2003 | US6661642 Dielectric structure |
| 12/09/2003 | US6660632 Applying amorphous film of metal complex to substrate, converting to metal or its oxides by thermal, photochemical or electron beam irradiation |
| 12/09/2003 | US6660625 Method of electroless plating copper on nitride barrier |
| 12/09/2003 | US6660154 Contacting a metal seed layer with a copper colloid composition including a minor amount of ionizable palladium compound |
| 12/09/2003 | US6660071 Electroless copper plating bath, electroless copper plating method and electronic part |
| 12/09/2003 | US6658967 Cutting tool with an electroless nickel coating |
| 12/04/2003 | WO2003099735A2 Substrate comprising a titanium oxide/cerium oxide protective layer |
| 12/04/2003 | US20030224537 Ferroelectric thin film processing for ferroelectric field-effect transistor |
| 12/04/2003 | US20030224152 Conductive film forming composition, conductive film, and method for forming the same |
| 12/04/2003 | US20030224111 Bundle becomes stretched and slackened by turns while it travels within the liquid of the processing vessel; when bundle is slackened or untied, the bundle is loosened so that liquid is easily exchanged between the inside and outside |
| 12/04/2003 | US20030222667 Probe card assembly |
| 12/04/2003 | US20030221612 Substrate processing apparatus |
| 12/03/2003 | EP1367872A2 Laser-activated dielectric material and method for using the same in an electroless deposition process |
| 12/03/2003 | EP1367146A2 Method of preparing a metal material for bonding |
| 12/03/2003 | EP1366513A1 Method for multilevel copper interconnects for ultra large scale integration |
| 12/03/2003 | EP1366207A1 Plating method of metal film on the surface of polymer |
| 12/03/2003 | EP1365895A1 Cutting tool with an electroless nickel coating |
| 12/03/2003 | CN1460131A Electroless gold plating solution and method for electroless gold plating |
| 12/03/2003 | CN1459347A Mothod of preparing foaming agent using oxide to cover titanium hydride |
| 12/02/2003 | US6655023 Method and apparatus for burning-in semiconductor devices in wafer form |
| 11/27/2003 | WO2003098681A1 Wafer level electroless copper metallization and bumping process, and plating solutions for semiconductor wafer and microchip |
| 11/27/2003 | WO2003096859A2 Method for producing galvanised sanitary objects made of plastic |
| 11/27/2003 | WO2002095088A3 Surface coating of black platinum |
| 11/27/2003 | US20030219978 Method and apparatus for liquid phase deposition |
| 11/27/2003 | US20030219976 Using stabilizers in electroless solutions to inhibit plating of fuses |
| 11/27/2003 | US20030219609 Plated component with a hybrid surface and method for manufacturing same |
| 11/27/2003 | US20030219534 Preparation of LCPMO thin films which have reversible resistance change properties |
| 11/26/2003 | EP1365421A1 Ceramic insulation coated electric wire, self-fusing ceremic insulation coated electric wire, coating composition, and coil and voice coil for speaker |
| 11/26/2003 | EP1364984A1 Resin composite material and method of forming the same |
| 11/26/2003 | EP1363707A2 Narrow diameter needle having reduced inner diameter tip |
| 11/25/2003 | US6653245 Method for liquid phase deposition |
| 11/25/2003 | US6653236 Methods of forming metal-containing films over surfaces of semiconductor substrates; and semiconductor constructions |
| 11/25/2003 | US6651335 Catalyst layer is absorbed on a surface of a substrate, a laser beam is selectively applied to the catalyst layer, processing of electroless plating is applied to the substrate, |
| 11/20/2003 | WO2003033779A3 Coating method for light metal alloys |
| 11/20/2003 | WO2002053801A3 Electroless copper plating of ferrous metal substrates |
| 11/20/2003 | WO2002050330A3 Method for improving metal surfaces to prevent thermal tarnishing |
| 11/20/2003 | US20030216025 Wafer level electroless copper metallization and bumping process, and plating solutions for semiconductor wafer and microchip |
| 11/20/2003 | US20030215620 Member having metallic layer, its manufacturing method and its application |
| 11/20/2003 | US20030214017 Method of manufacturing a semiconductor device |
| 11/20/2003 | US20030213773 Power module member manufactured by wet treatment, and wet treatment method and wet treatment equipment thereof |
| 11/19/2003 | EP1362136A2 Iron and sole plate for an iron |
| 11/19/2003 | CN1457377A Iron and sole plate for iron |
| 11/19/2003 | CN1456712A Electroplated component and its making method |
| 11/19/2003 | CN1128250C Acidic displacing solution for electroplating of zinc |
| 11/19/2003 | CN1128248C Chemical Ni-P plating process with high compactedness and high corrosion resistance |
| 11/19/2003 | CN1128247C Selective chemical plating process of preparing nanometer gap electrode |
| 11/13/2003 | WO2003094226A2 Contacting of nanotubes |
| 11/13/2003 | US20030211330 Method of preparing a metal material for bonding |
| 11/13/2003 | US20030211246 Printed circuits; forming patterns; multilayer |
| 11/13/2003 | US20030211239 Electrodeposition of alloy; gas turbine engine |
| 11/13/2003 | US20030209446 Method for enhancing the solderability of a surface |
| 11/12/2003 | EP1360347A2 Method for producing plated molded product |
| 11/12/2003 | CN1456034A Method for making a circuitry comprising conductive tracks, chips and micro-vias and use of same for producing printed circuits and multilayer modules with high density of integration |
| 11/12/2003 | CN1455021A Submarine surface anticorrosive process scheme |
| 11/12/2003 | CN1455020A Submarine surface anticorrosive process scheme |
| 11/12/2003 | CN1455019A Submarine surface anticorrosive process scheme |
| 11/12/2003 | CN1455018A Submarine surface anticorrosive process method |
| 11/12/2003 | CN1127755C Integrated circuit having mixed layered superlattice materials and precruser solutions for use in process of making same |
| 11/12/2003 | CN1127582C Method for chemical plating nickel and then over plating hard chromium on metallic material |
| 11/11/2003 | US6645881 Method of forming coating film, method of manufacturing semiconductor device and coating solution |
| 11/11/2003 | US6645778 Method for the preparation of ferroelectric semiconductive coating and apparatus for removing environmental air pollutants using this coating and electric power |
| 11/11/2003 | US6645567 Electroless plating bath composition and method of using |
| 11/11/2003 | US6645564 Forming a microcrack to suppress corrosion in the metal plating layer by cold-heat treatment or supersonic wave treatment after formation of the basecoat layer and metal plating layer, forming topcoat |
| 11/11/2003 | US6645557 Treating surface with silver compound before plating; preferably surface is sensitized with a stanous compound before silver treatment |
| 11/11/2003 | US6645549 Sheet is immersed in immersion tin solution for a time sufficient to provide a thin tin deposit operative in conjunction with the first tin deposit to enhance subsequent bonding of the sheet to an organic polymer layer |
| 11/09/2003 | CA2426663A1 Method of preparing a metal material for bonding |
| 11/06/2003 | WO2003091630A1 Heating cooking utensil and method for manufacture thereof, and method for use thereof |
| 11/06/2003 | WO2003091477A1 Method for electroless deposition of a metal layer on selected portions of a substrate |
| 11/06/2003 | WO2003091476A1 Method of electroless plating and semiconductor wafer having metal plating layer formed thereon |
| 11/06/2003 | WO2003065423A3 Electroless deposition apparatus and method |
| 11/06/2003 | US20030207568 Organometallic precursor for forming metal pattern and method of forming metal pattern using the same |
| 11/06/2003 | US20030207567 Metal film pattern and manufacturing method thereof |
| 11/06/2003 | US20030207470 Metal insulator semiconductor structure with polarization-compatible buffer layer |