Patents for C09J 163 - Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins (8,472)
12/2014
12/24/2014CN103113544B 一种酚醛改性胺类固化剂及其制备方法 One kind of phenolic modified amine curing agent and its preparation method
12/24/2014CN102471456B 快速固化性优异的能量射线固化型环氧树脂组合物 Excellent in rapid curability energy ray-curable epoxy resin composition
12/23/2014US8916020 Assembly bonded to a structural adhesive and method and applicator for making it
12/18/2014US20140370265 Composition for preparing a bonding material and uses thereof
12/17/2014CN104220547A 半固化减压粘结膜 Semi-cured adhesive film decompression
12/17/2014CN104220543A 结构粘合剂或其改进 Structural adhesives or modifications
12/17/2014CN104212410A 一种钢桥环氧浙青防水粘结料及其制备和使用方法 One kind of green steel bridge Zhejiang waterproof epoxy binder and its preparation and use
12/17/2014CN104212399A 用于半导体芯片封装的低模量非导电胶 Low modulus non-conductive adhesive for a semiconductor chip package
12/17/2014CN104212397A 一种环保型粘胶及其制备方法和应用 An eco-friendly adhesive and its preparation method and application
12/17/2014CN104212396A 一种用于饰面大理石板材修补的光固化树脂组合物及其制备使用方法 A decorative marble repair photo-curable resin composition and preparation methods for use
12/17/2014CN104212395A 一种挠性覆铜板用环氧树脂胶黏剂及其制备方法 A flexible copper clad laminate with epoxy adhesive and its preparation method
12/17/2014CN104212394A 一种室温固化环氧树脂胶黏剂及其制备方法 One kind of room temperature curing epoxy adhesive and its preparation method
12/17/2014CN104212393A 一种单组份环氧胶基体树脂结构的设计 A one-component epoxy resin matrix structure design
12/17/2014CN104212392A 一种局强度环氧树脂粘接剂 An epoxy adhesive strength Bureau
12/17/2014CN104212391A 环氧树脂-丙烯酸酯共聚胶黏剂配方及其制备工艺 Epoxy - acrylate copolymer adhesive formulation and preparation process
12/17/2014CN104212375A 粘接片、及切割/芯片接合薄膜 The adhesive sheet, and cutting / die-bonding film
12/17/2014CN104212374A 热固型芯片接合薄膜、带切割片的芯片接合薄膜及半导体装置的制造方法 The method of manufacturing a thin film semiconductor device and a thermosetting die-bonding film with the die-bonding dicing sheet
12/17/2014CN104212372A 用于半导体的粘合剂组合物、粘合剂膜和半导体装置 Adhesive composition for semiconductor, the adhesive film and a semiconductor device
12/17/2014CN103468199B 一种经环氧树脂改性的硅橡胶组合物及其用途 One kind of epoxy resin modified by silicone rubber composition and its use
12/17/2014CN103160229B 一种环保型轻质层压板用胶液、层压板及其制备方法 An eco-friendly lightweight laminates with glue, laminate and its preparation method
12/17/2014CN102719058B 一液型氰酸酯-环氧复合树脂组合物 A liquid type cyanate ester - epoxy composite resin composition
12/17/2014CN102051141B 电路部件连接用粘接剂及使用该粘接剂的半导体装置 The semiconductor device circuit member connecting adhesive using the adhesive agent
12/10/2014CN104205236A 抗洗脱的环氧粘合剂组合物及预胶凝粘合剂 Anti eluted epoxy adhesive composition and pre-gelling binder
12/10/2014CN104194704A 一种新型汽车挡风玻璃密封胶 A new windshield sealant
12/10/2014CN104194703A 一种用于电子封装材料的无卤阻燃环氧树脂及其制备方法 Halogen-free flame retardant epoxy resin and a preparation method for electronic packaging materials
12/10/2014CN104194702A 一种高弹性环氧树脂粘合剂 A highly flexible epoxy adhesive
12/10/2014CN104194701A 一种环氧树脂耐热粘黏剂 An epoxy resin resistant sticky agent
12/10/2014CN104194700A 防腐耐酸无溶剂环氧树脂胶黏剂配方及其制备工艺 Acid and solvent-free epoxy adhesive antiseptic formulation and preparation process
12/10/2014CN104194699A 环氧树脂-大豆蛋白胶环保共聚胶黏剂配方及其制备工艺 Epoxy - soy protein gel copolymer adhesive formulation and preparation of environmental protection technology
12/10/2014CN104194698A 一种长效建筑胶 Building a long-acting glue
12/10/2014CN104194668A 一种海洋工程用导电胶 A MARINE engineering conductive plastic
12/10/2014CN104194667A 一种环保环氧树脂补强材料及其制备方法和应用 Reinforcing material and preparation method and application of an environmentally friendly epoxy resin
12/10/2014CN104194662A 一种酚酞基聚芳醚酮改性环氧结构胶膜及其制备方法 One kind of phenolphthalein base Polyaryletherketones modified epoxy structural adhesive film and its preparation method
12/10/2014CN103602301B 一种水下高分子粘接剂及制备方法 Underwater polymer adhesive and preparation method
12/10/2014CN103436212B 一种室温固化复合板结构胶 One kind of room temperature curing structural adhesive composite panels
12/10/2014CN103275666B 一种环氧树脂与聚氨酯复合热转印胶及其制备方法 An epoxy resin and polyurethane composite thermal plastic and its preparation method
12/10/2014CN103131372B 2,6-双(2,4-二氨基苯氧基)甲苯型耐高温环氧胶粘剂及其制备方法 2,6-bis (2,4-aminophenoxy) toluene-temperature epoxy adhesive and its preparation method
12/10/2014CN103102857B 一种玻璃用耐高温胶粘剂及其制备方法 A glass with high temperature adhesive and its preparation method
12/10/2014CN103003381B 含有反应性的硫化合物的晶片背面涂料 Wafer back coating containing the reactive sulfur compounds
12/10/2014CN102876277B 粘接剂组合物和使用该组合物的电路连接膜,以及电路部件的连接方法和电路连接体 The adhesive composition and the circuit-connecting film using the composition, and a circuit member connection method and the circuit-connected body
12/10/2014CN102822303B 用于环氧树脂系粘接剂的固化剂组合物及用于多孔体的粘接剂 Adhesive curing agent composition for epoxy resin adhesive is used for the porous body and
12/10/2014CN102765225B 一种金字塔点阵金属夹层板及其制备方法 One kind of pyramid lattice metal sandwich board and its preparation method
12/10/2014CN102648262B 含有用酮肟封端的弹性增韧剂的结构环氧树脂胶粘剂 Toughener comprising an elastic ketoxime blocked structure epoxy resin adhesive
12/02/2014US8901207 Adhesive for electronic components
11/2014
11/27/2014US20140349109 Pressure sensitive adhesives based on carboxylic acids and epoxides
11/27/2014US20140347730 Unit for image display device having adhesive layer, and image display device using the unit
11/27/2014US20140345797 Pressure sensitive adhesives based on fatty acids
11/25/2014US8895148 Structural adhesive and bonding application thereof
11/20/2014US20140342153 Vegetable oil-based pressure-sensitive adhesives
11/18/2014US8889803 Polymerizable epoxy composition, and sealing material composition comprising the same
11/13/2014US20140332984 Adhesive composition, process for producing the same, adhesive film using the same, substrate for mounting semiconductor and semiconductor device
11/11/2014US8882610 Golf ball
11/04/2014US8877837 Curing of epoxy resin compositions comprising cyclic carbonates using mixtures of amino hardeners and catalysts
10/2014
10/23/2014US20140316081 Cationically curable resin composition for assembling hard disk devices
10/21/2014US8865392 Photosensitive resin composition and cured product thereof
10/21/2014US8865030 Microcapsules having a radiation-induced or thermal release
10/21/2014US8865026 Thermosetting adhesive
10/14/2014US8859694 Cure accelerators
10/14/2014US8858752 Structural epoxy resin adhesives containing elastomeric tougheners capped with ketoximes
10/09/2014WO2014163090A1 Photocurable epoxy adhesive agent, resin composition, laminate , display, and method for producing resin composition
10/09/2014WO2014163003A1 Adhesive composition for optics, adhesive sheet for optics, and method for producing adhesive sheet for optics
10/09/2014WO2014162990A1 Conductive adhesive, anisotropic conductive film and electronic devices using both
10/09/2014WO2014162974A1 Underfill adhesive film, underfill adhesive film with integrated backgrinding tape, underfill adhesive film with integrated dicing tape, and semiconductor device
10/09/2014WO2014161638A1 Biogenic fluid non-reactive thinning agents in synthetic resin adhesives
10/09/2014WO2014161637A1 Solid biogenic fillers in adhesives for securing technology
10/09/2014US20140303286 Adhesive composition for temporarily bonding use in wafer manufacturing
10/09/2014US20140299268 Thermally Curable Bonding Film Adhesive with Uniform Thickness
10/09/2014DE102014103924A1 Feste biogene Füllstoffe in Verklebungsmitteln für die Befestigungstechnik Solid biogenic fillers in Verklebungsmitteln for Fastening Technology
10/09/2014DE102014103923A1 Kunstharz-Verklebungsmittel mit biogenen reaktiven Verdünnern und Harzen Resin Verklebungsmittel with biogenic reactive diluents and resins
10/09/2014DE102014103920A1 Biogene flüssige nichtreaktive Verdünner in Kunstharz-Verklebungs mitteln Biogenic liquid non-reactive diluent in synthetic resin adhesive bonding agents
10/09/2014DE102014004751A1 Epoxymethacrylat-basierter Klebstoff für Strömumgsfeldplatten von Brennstoffzellen Epoxy methacrylate-based adhesive for Strömumgsfeldplatten of fuel cells
10/08/2014EP2787039A1 Resin composition, resin composition sheet, semiconductor device and method for manufacturing same
10/08/2014EP2785791A1 Dual cure system
10/08/2014EP2785769A1 Epoxy curative composition and compositions therefrom
10/02/2014WO2014158705A1 Methods of making low shrinkage and expandable compositions and expandable monomers
10/02/2014WO2014156843A1 Heat-curable resin composition
10/02/2014WO2014156685A1 Anisotropic conductive film
10/02/2014US20140291870 Resin composition, resin composition sheet, semiconductor device and production method therefor
10/02/2014US20140290854 Adhesive composition
09/2014
09/30/2014US8845910 Aluminum alloy composite and method for joining thereof
09/30/2014US8845849 Anisotropic conductive adhesive
09/25/2014WO2014153316A1 Panel assembly and method for making the same
09/25/2014WO2014148155A1 Resin composition and adhesive film, coverlay film, and interlayer adhesive using resin composition
09/25/2014WO2014147903A1 Adhesive composition, and coverlay film and flexible copper-clad laminate using same
09/25/2014WO2014146674A1 Method for producing a bonded bow contact for current collectors
09/24/2014EP2781277A1 Panel assembly and method for making the same
09/18/2014WO2014139212A1 Frame sealant composition, preparation method thereof and display device
09/18/2014US20140275423 One-part structural epoxy resin adhesives containing elastomeric tougheners capped with phenols and hydroxy-terminated acrylates or hydroxy-terminated methacrylates
09/18/2014US20140272175 Dual curable composition
09/17/2014EP2776527A2 Improvements in or relating to structural adhesives
09/17/2014EP2776526A1 A structural adhesive sheet specifically for use in a mirror base of an automobile interior rear-view mirror and a method for producing the same
09/17/2014EP2776487A1 Structural adhesive and bonding application thereof
09/16/2014US8835772 Production method of connection structure
09/16/2014US8835574 Adhesive compositions for use in die attach applications
09/16/2014US8835572 Aluminum chelate latent curing agent
09/12/2014WO2014137801A1 Temporary adhesive with tunable adhesion force sufficient for processing thin solid materials
09/12/2014WO2014136836A1 Adhesive film, adhesive film integrated with dicing sheet, adhesive film integrated with back grind tape, adhesive film integrated with back grind tape cum dicing sheet, laminate, cured product of laminate, semiconductor device, and process for producing semiconductor device
09/12/2014WO2014136773A1 Epoxy resin composition, cured product, heat radiating material, and electronic member
09/12/2014WO2014136484A1 Apparatus, composition for adhesive, and adhesive sheet
09/11/2014US20140256841 Composition for forming electronic paper without particle freezing, and adhesive film prepared thereby
1 2 3 4 5 6 7 8 9 10 11 12 13 ... 85