| Patents for C08G 59 - Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by reaction of epoxy polycondensates with monofunctional low-molecular-weight compounds; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups (30,286) |
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| 10/24/2012 | CN102753630A Curable composition for inkjet and method for producing electronic component |
| 10/24/2012 | CN102753626A Resin composition, molded body and composite molded body |
| 10/24/2012 | CN102753620A Curable resin compositions useful as underfill sealants for low-k dielectric-containing semiconductor devices |
| 10/24/2012 | CN102753597A Production of epoxy resins using improved ion exchange resin catalysts |
| 10/24/2012 | CN102751430A Optical semiconductor device and the making process thereof |
| 10/24/2012 | CN102751095A Electrolyte material concoction, electrolyte material composition formed by the same and use thereof |
| 10/24/2012 | CN102746622A Prepreg with moderate-temperature cured epoxy resin as substrate material and preparation method thereof |
| 10/24/2012 | CN102746621A Low-viscosity epoxy resin system for rapid repair and reinforcement and preparation method of low-viscosity epoxy resin system |
| 10/24/2012 | CN102746489A Composition and preparation technology of hydroxyl-terminated liquid butadiene styrene rubber modified epoxy resin |
| 10/24/2012 | CN102746488A Diphenylmethyl itaconate-modified polyamine curing agent and preparation method thereof |
| 10/24/2012 | CN102746487A LED-packaging epoxy resin composition |
| 10/24/2012 | CN102226033B Epoxy resin composition as well as prepreg and metal-foil-clad laminated board manufactured by using same |
| 10/24/2012 | CN102181128B Epoxy resin premix and preparation technology of the epoxy resin premix |
| 10/24/2012 | CN102181043B latent curing agent with multiple storage stability |
| 10/24/2012 | CN101928380B Method for preparing flame resistance polyepoxy compound |
| 10/24/2012 | CN101896537B Alkali-developable curable composition, insulating thin film using the same, and thin film transistor |
| 10/24/2012 | CN101809088B Thermosetting resin composition for light reflection, substrate made therefrom for photosemiconductor element mounting, process for producing the same, and photosemiconductor device |
| 10/23/2012 | US8293132 Phenalkamine and salted amine blends as curing agents for epoxy resins |
| 10/23/2012 | CA2565785C Comb-like polyetheralkanolamines in inks |
| 10/18/2012 | WO2012142570A1 Cross-linked reactive polymer microparticles |
| 10/18/2012 | WO2012142567A1 Thermoset cross-linked network |
| 10/18/2012 | WO2012141174A1 Curing agent composition for epoxy resin and thermosetting molding material |
| 10/18/2012 | WO2012141167A1 Reinforcing material for solid polymer fuel cell, and cohesive/adhesive composition for use in same |
| 10/18/2012 | WO2012141027A1 Anisotropic conductive film |
| 10/18/2012 | WO2012139975A1 Hybrid matrix for fiber composite materials |
| 10/18/2012 | WO2012088158A3 Curable epoxy composition comprising imidazolium salts and method for curing same |
| 10/18/2012 | DE102011016918A1 Solvent free epoxy resin mixture containing components made of renewable resources, useful for preparing curable molding compositions, comprises multifunctional glycidyl compound, multi-functional aromatic monomer and/or activator |
| 10/17/2012 | EP2510053A2 Curable resin compositions useful as underfill sealants for low-k dielectric-containing semiconductor devices |
| 10/17/2012 | EP2510035A1 Hydroxyl-functional polyester resins |
| 10/17/2012 | EP2510034A1 Polyether-modified epoxy amine adducts as wetting and dispersing agents |
| 10/17/2012 | CN102741351A Thermosetting composition |
| 10/17/2012 | CN102741348A Curable composition, cured article, and use of curable composition |
| 10/17/2012 | CN102741315A Phenolic compound, epoxy resin, epoxy resin composition, prepreg, and cured product thereof |
| 10/17/2012 | CN102741314A Method for producing a phosphorus-containing epoxy resin, epoxy resin composition, and cured product thereof |
| 10/17/2012 | CN102741313A Epoxy resin curing compositions and epoxy resin systems including same |
| 10/17/2012 | CN102732197A Preparation process of adhesive suitable for adhesive coated copper foil |
| 10/17/2012 | CN102731975A Polyester composition for production of thermally cured film |
| 10/17/2012 | CN102731968A Low-smoke flame-retardant epoxy-resin-containing composition and preparation method thereof |
| 10/17/2012 | CN102731967A Adhesive for road antiskid layer and preparation method of adhesive |
| 10/17/2012 | CN102731966A Thermosetting epoxy resin composition as well as prepreg and copper-foil-plated laminated board manufactured by using same |
| 10/17/2012 | CN102731798A Self-emulsifying water-borne epoxy resin emulsion and preparation method thereof |
| 10/17/2012 | CN102731750A Preparation method of latent epoxy resin curing system |
| 10/17/2012 | CN102731558A Organosilicone oligomer and preparation method thereof, and bi-component system and application thereof |
| 10/17/2012 | CN102731440A Itaconic acid diglycidyl ester, its preparation method and application |
| 10/17/2012 | CN102731350A Sulfhydryl compound containing beta-ester groups and acetyl-transferred synthesis method thereof |
| 10/17/2012 | CN102161814B Preparation method of oriented carbon nano tube/ polymer composite membrane |
| 10/17/2012 | CN102153730B Method for preparing high-strength epoxy resin adhesive |
| 10/17/2012 | CN101914348B Sealing adhesive and preparation method thereof |
| 10/17/2012 | CN101883797B Curable composition for transfer materials and method for forming micropattern using the curable composition |
| 10/17/2012 | CN101291973B 热固性树脂组合物和光半导体密封材料 The thermosetting resin composition and an optical semiconductor sealing material |
| 10/16/2012 | US8288591 Curing agents for epoxy resins |
| 10/16/2012 | US8288466 Composite of a polymer and surface modified hexagonal boron nitride particles |
| 10/16/2012 | US8288003 Method for producing phosphorus-containing phenolic compound, novel phosphorus-containing phenol, curable resin composition, cured product of the same, printed wiring board, and semiconductor sealing material |
| 10/11/2012 | WO2012137880A1 Resin composition, hardened coating films therefrom, and photosemiconductor device using same |
| 10/11/2012 | WO2012137837A1 Polycarboxylic acid resin and composition thereof |
| 10/11/2012 | WO2012136658A1 Catalyst for epoxide polymerisation and for the copolymerisation of epoxide with carbon dioxide |
| 10/11/2012 | WO2012136458A1 Adhesive compositions |
| 10/11/2012 | WO2012136273A1 Hyperbranched polymers for modifying the toughness of anionically cured epoxy resin systems |
| 10/11/2012 | WO2012047537A3 Epoxy composition with crystallization inhibition |
| 10/11/2012 | US20120259087 Bicarbonate precursors, method for preparing same and uses thereof |
| 10/11/2012 | US20120259075 Etheramines and their use as intermediates for polymer synthesis |
| 10/10/2012 | EP2508546A1 Epoxy resin composition |
| 10/10/2012 | EP2508545A1 Thermosetting resin composition and photosemiconductor encapsulation material |
| 10/10/2012 | EP2507325A1 Coating compositions |
| 10/10/2012 | EP2507285A2 Composite compositions |
| 10/10/2012 | EP2507284A1 Adducts based on divinylarene oxides |
| 10/10/2012 | EP2507283A1 Epoxy resin compositions |
| 10/10/2012 | CN102725353A Thermoplastic elastomer composition and manufacturing method therefor |
| 10/10/2012 | CN102725324A Thermosetting resin composition, flip-chip mounting adhesive, semiconductor device fabrication method, and semiconductor device |
| 10/10/2012 | CN102725323A Sheet-like resin composition, circuit component using the sheet-like resin composition, method for sealing electronic component, method for connecting electronic component, method for affixing electronic component, composite sheet, electronic component |
| 10/10/2012 | CN102725273A Clathrate and method for producing same |
| 10/10/2012 | CN102723201A Electrolyte concoction, electrolyte composition formed by electrolyte concoction, and the using method thereof |
| 10/10/2012 | CN102719213A Modified nano zinc oxide doped cycloaliphatic epoxy resin light-emitting diode (LED) packaging adhesive |
| 10/10/2012 | CN102719212A Silane coupling agent modified cycloaliphatic epoxy resin surface mount device (SMD) packaging adhesive |
| 10/10/2012 | CN102719174A Epoxy anticorrosive paint for underwater steel |
| 10/10/2012 | CN102719096A Resin composition and preparation method thereof |
| 10/10/2012 | CN102719058A One liquid type cyanate-epoxy composite resin composition |
| 10/10/2012 | CN102718945A Itaconic acid-based epoxy resin composition and method for preparing cured substance |
| 10/10/2012 | CN102295730B Method for synthesizing intramolecular toughening epoxy vinyl esters resin |
| 10/10/2012 | CN102181039B Process for synthesizing o-cresol formaldehyde epoxy resin with low chlorine content |
| 10/10/2012 | CN102167828B Preparation method of R-122-based episulfide resin |
| 10/10/2012 | CN102037048B Novel epoxy resin, method for producing the same, epoxy resin composition containing the epoxy resin as essential component, and cured product containing the epoxy resin as essential component |
| 10/10/2012 | CN101821312B Single-component cyanate-epoxy composite resin composition, cured product thereof and method for producing the same, and sealing material and adhesive each using the single-component cyanate-epoxy composite resin composition |
| 10/10/2012 | CN101796106B Insulating sheet and multilayer structure |
| 10/10/2012 | CN101772527B Epoxy resin composition |
| 10/10/2012 | CN101160549B Composition comprising polymer having ethylene-dicarbonyl structure for use in forming anti-reflective coating for lithography |
| 10/09/2012 | US8283408 Thermoplastic-toughened cyanate ester resin composites with low heat release properties |
| 10/04/2012 | WO2012133587A1 Resin composition, resin sheet, cured resin sheet, resin sheet laminate, cured resin sheet laminate and method for manufacturing same, semiconductor device, and led device |
| 10/04/2012 | WO2012133384A1 Liquid resin composition, semiconductor package, and method for manufacturing semiconductor package |
| 10/04/2012 | WO2012133182A1 Polyether compound, curing agent using polyether compound, and method for producing polyether compound |
| 10/04/2012 | WO2012133079A1 Basket type silsesquioxane resin, basket type silsesquioxane copolymer and method for producing same |
| 10/04/2012 | WO2012133033A1 Prepreg and method for manufacturing same |
| 10/04/2012 | WO2012132965A1 Resin composition, pre-preg, and metal foil clad laminate |
| 10/04/2012 | WO2012132923A1 Prepreg, metal-foil-cladded laminate board, and printed wiring board |
| 10/04/2012 | WO2012132501A1 Curable composition, cured product, and organic electroluminescent element using same |
| 10/04/2012 | WO2012132243A1 Ion-conducting resin and electrically conductive member for electrophotography |
| 10/04/2012 | WO2012131009A1 Polymeric formulations with chemically adjustable rheology for the manufacture of prepregs and articles made of composite material |
| 10/04/2012 | WO2012130570A1 Use of epoxidized arylalkylphenols as reactive resin diluents |
| 10/04/2012 | US20120253005 Conditioning of double metal cyanide catalysts |
| 10/04/2012 | US20120252996 Curable Bicyclic Compound Derived from Biomass, Solvent-Free Curable Composition, and Method for Preparing Same |