| Patents for C08G 59 - Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by reaction of epoxy polycondensates with monofunctional low-molecular-weight compounds; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups (30,286) |
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| 12/06/2012 | WO2012164870A1 Curable resin composition |
| 12/06/2012 | WO2012164869A1 Curable resin composition |
| 12/06/2012 | US20120309933 Divinylarene dioxide resins |
| 12/06/2012 | US20120309923 Solventless one liquid type cyanate ester-epoxy composite resin composition |
| 12/06/2012 | US20120308832 Phenol resin composition, production method therefor, curable resin composition, cured product thereof, and printed circuit board |
| 12/06/2012 | US20120308831 Epoxy resin composition |
| 12/06/2012 | US20120308481 Radio-opaque compounds, compositions containing same and methods of their synthesis and use |
| 12/06/2012 | US20120305830 Heat transfer compositions |
| 12/06/2012 | DE112011100378T5 Phenolische Verbindung, Epoxyharz, Epoxyharz-Zusammensetzung, Prepreg, und gehärtetes Produkt daraus Phenolic compound, epoxy resin, epoxy resin composition, prepreg, and cured product thereof |
| 12/05/2012 | EP2530098A1 Long-chain alkylene-containing curable epoxy resin composition |
| 12/05/2012 | EP2528734A1 A multilayer structure, and a method for making the same |
| 12/05/2012 | CN102812067A Epoxy resin curing agent, epoxy resin composition, and adhesive agent for laminate |
| 12/05/2012 | CN102812066A Curable composition, dicing-die bonding tape, connecting structure and method for producing semiconductor tape with cohesive/adhesive layer |
| 12/05/2012 | CN102807736A Static conductive lining for repairing product oil pipeline and manufacturing method thereof |
| 12/05/2012 | CN102807735A Halogen-free resin composition and resin-coated copper foil and copper foil covered laminate prepared by halogen-free resin composition |
| 12/05/2012 | CN102807734A Epoxy resin type guiding and pulling element |
| 12/05/2012 | CN102807732A Plugging putty and preparation method thereof |
| 12/05/2012 | CN102807666A Insulating resin composition used for printed circuit board (PCB) and PCB comprising the same |
| 12/05/2012 | CN102321232B Water-soluble hyperbranched epoxy resin and preparation method thereof |
| 12/05/2012 | CN102286151B 热固性改性氰酸酯树脂及其制备方法 Thermosetting modified cyanate ester resin and preparation method |
| 12/05/2012 | CN102134376B Halogen-free flame-retardant resin composition and preparation method of prepreg and laminated plate |
| 12/05/2012 | CN102051024B Halogen-free flame-retardant epoxy resin composition and application thereof |
| 12/05/2012 | CN101942063B Water-borne epoxy ester modified alkyd resin emulsion and preparation method thereof |
| 12/05/2012 | CN101827876B 树脂组合物 Resin composition |
| 12/05/2012 | CN101792520B Low-corrosive epoxy resins and production method thereof |
| 12/05/2012 | CN101784579B One-pack type epoxy resin composition and use thereof |
| 12/05/2012 | CN101696263B Epoxy resin curing agent, method for preparing same and application thereof |
| 12/05/2012 | CN101622578B Solder resist, dry film thereof, cured product and printed wiring board |
| 12/05/2012 | CN101124233B Novel curable resin, method for producing same, epoxy resin composition and electronic component device |
| 12/04/2012 | US8323502 Multi-layered macromolecules and methods for their use |
| 12/04/2012 | CA2618362C Hindered cyclic polyamines and their salts for acid gas scrubbing process |
| 11/29/2012 | WO2012162299A1 Coating compositions for containers |
| 11/29/2012 | WO2012162298A1 Coating compositions with improved adhesion to containers |
| 11/29/2012 | WO2012162056A1 Coating system comprising high acid resin |
| 11/29/2012 | WO2012161997A1 Pressure-sensitive adhesives with onium-epoxy crosslinking system |
| 11/29/2012 | WO2012161490A2 Epoxy resin compound and radiant heat circuit board using the same |
| 11/29/2012 | WO2012161175A1 Organic thin-film transistor insulating layer material |
| 11/29/2012 | US20120302727 Phosphorus-containing epoxy resin |
| 11/29/2012 | US20120302699 Resin composition, molded body and composite molded body |
| 11/29/2012 | CA2836801A1 Coating compositions for containers |
| 11/29/2012 | CA2836670A1 Coating compositions with improved adhesion to containers |
| 11/29/2012 | CA2836415A1 Coating system comprising high acid resin |
| 11/28/2012 | EP2527385A1 Epoxy resin composition for optical semiconductor device and optical semiconductor device using the same |
| 11/28/2012 | CN102803343A Multi-amine functional oligomers and method for producing the same by the reduction of corresponding oximes |
| 11/28/2012 | CN102803335A Hardener composition for epoxy resins |
| 11/28/2012 | CN102803334A Thermosettable composition containing a half ester of a cycloaliphatic diol and a thermoset product therefrom |
| 11/28/2012 | CN102803333A Epoxy resin composition, prepreg and cured products thereof |
| 11/28/2012 | CN102803205A Base and radical generator, composition using same and method for curing same |
| 11/28/2012 | CN102802590A Epoxy-containing composition curable by multiple polymerization mechanisms |
| 11/28/2012 | CN102796436A Nano modified aqueous epoxy rust-resisting paint and production method thereof |
| 11/28/2012 | CN102796349A Membranous room-temperature-curing epoxy resin composite material gasket and preparation method thereof |
| 11/28/2012 | CN102796347A Epoxy resin composition for optical semiconductor device and optical semiconductor device using the same |
| 11/28/2012 | CN102796243A Polyurethane modified epoxy resin adhesive, and preparation method and application thereof |
| 11/28/2012 | CN102796237A Dihydroxyl cationic hydrophilic chain extender and application thereof to synthesis of cationic aqueous polyurethane dispersoid |
| 11/28/2012 | CN102796141A Phosphor series benzoxazine and preparation method |
| 11/28/2012 | CN102276793B High-temperature-resistant liquid anhydride curing agent and preparation method thereof |
| 11/28/2012 | CN102276792B Liquid anhydride curing agent capable of rapidly curing while heating and preparation method thereof |
| 11/28/2012 | CN102181026B Production method for electronic-grade phenolic resin |
| 11/28/2012 | CN102174245B Epoxy asphalt for gravel sealing layer, gravel sealing layer material and gravel sealing layer method |
| 11/28/2012 | CN102070770B Phosphorous epoxy resin curing agent and preparation method thereof |
| 11/28/2012 | CN102040801B Epoxy resin composition as well as film and substrate |
| 11/28/2012 | CN101925629B Dimethylformamide-free formulations using dicyanadiamide as curing agent for thermosetting epoxy resins |
| 11/28/2012 | CN101878240B Silica-containing epoxy curing agent and epoxy resin cured body |
| 11/28/2012 | CN101754989B Flame retardant composition |
| 11/28/2012 | CN101611067B Novel epoxy resin, epoxy resin composition essentially containing the epoxy resin, and cured product essentially containing the epoxy resin |
| 11/28/2012 | CN101547885B Adamantane derivative, method for producing the same, and resin composition containing adamantane derivative |
| 11/27/2012 | US8318834 Epoxy resin reactive diluent compositions |
| 11/27/2012 | US8318410 Sulfur atom-containing resist underlayer film forming composition and method for forming resist pattern |
| 11/27/2012 | US8318309 Benzylated aminopropylated alkylenediamines and uses thereof |
| 11/27/2012 | CA2494997C Silicone modified polyurea |
| 11/22/2012 | WO2012158363A1 Epoxy resins with high thermal stability and toughness |
| 11/22/2012 | WO2012158336A1 Novel structural adhesive and use thereof |
| 11/22/2012 | WO2012158292A1 Insulation formulations |
| 11/22/2012 | WO2012158291A1 Insulation formulations |
| 11/22/2012 | WO2012157665A1 Semiconductor module component and liquid resin composition for encapsulation |
| 11/22/2012 | WO2012157627A1 Curable heat-dissipating composition |
| 11/22/2012 | WO2012085120A3 Use of thiocarbonates in epoxy resin formulations for surface improvement |
| 11/22/2012 | WO2012068414A3 Structural adhesive compositions |
| 11/22/2012 | US20120296013 Aluminum Phosphorus Acid Salts as Epoxy Resin Cure Inhibitors |
| 11/22/2012 | US20120295199 Long-chain alkylene-containing curable epoxy resin composition |
| 11/22/2012 | CA2835658A1 Insulation formulations |
| 11/22/2012 | CA2835651A1 Insulation formulations |
| 11/22/2012 | CA2835204A1 Epoxy resins with high thermal stability and toughness |
| 11/21/2012 | CN102791819A Heat-resistant adhesive |
| 11/21/2012 | CN102791796A Resin composition for sealing semiconductors, and semiconductor device using same |
| 11/21/2012 | CN102791761A Insulating polymer material composition |
| 11/21/2012 | CN102791760A Curable resin composition and cured article thereof |
| 11/21/2012 | CN102786903A Modified epoxy adhesive for stone combination and preparation method thereof |
| 11/21/2012 | CN102786864A Anticorrosive paint for rusty coating and preparation method of anticorrosive paint |
| 11/21/2012 | CN102786839A Glass protecting ink and preparation method thereof |
| 11/21/2012 | CN102786831A Rust-containing coating curing agent and preparation method thereof |
| 11/21/2012 | CN102786777A Intrinsic conduction shape memory polymer and preparation method thereof |
| 11/21/2012 | CN102786773A Encapsulating sheet and electronic device |
| 11/21/2012 | CN102786771A Resin liquid, metal substrate adopting the resin liquid, and manufacturing method of the metal substrate |
| 11/21/2012 | CN102786759A Latex particles imbibed with a thermoplastic polymer |
| 11/21/2012 | CN102786717A Acylamino-containing dialkyl phosphinic acid fire retardant and its preparation method |
| 11/21/2012 | CN102786676A Polyester elastomer with branching structure and preparation method thereof |
| 11/21/2012 | CN102786665A Cure catalyst, composition, electronic device and associated method |
| 11/21/2012 | CN102786664A Low dielectric and high heat-resistant epoxy resin composition and its preparation method |
| 11/21/2012 | CN102786663A Epoxy resin latent curing agent, preparation method thereof and method for preparing insulated paint by using epoxy resin latent curing agent |