| Patents for C08G 59 - Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by reaction of epoxy polycondensates with monofunctional low-molecular-weight compounds; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups (30,286) |
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| 01/16/2013 | CN102875974A Epoxy resin composition for semiconductor sealing and semiconductor device |
| 01/16/2013 | CN102875971A Preparation method for nanometer modified cation epoxy resin and application thereof |
| 01/16/2013 | CN102875969A Moisture resistant epoxy resin potting material and its preparation method |
| 01/16/2013 | CN102875777A Novel epoxy hardener and preparation method thereof |
| 01/16/2013 | CN102875741A Anticorrosive paint used for aluminum evaporator of refrigerator |
| 01/16/2013 | CN102875470A Composite for forming inclusion compound, curing catalyst, and curing resin and curing resin |
| 01/16/2013 | CN102875376A Resin composition suitable for (re) lining of tubes, tanks and vessels |
| 01/16/2013 | CN102046690B Optical semiconductor sealing resin composition and optical semiconductor device using same |
| 01/16/2013 | CN101978313B Sealing material for liquid-crystal dropping process, vertical-conduction material, and liquid-crystal display element |
| 01/16/2013 | CN101755008B Curable resin composition and cured product |
| 01/10/2013 | WO2013006250A1 Hybrid epoxy resin adducts |
| 01/10/2013 | WO2013005691A1 Novel (meth)acrylic resin and resin composition utilizing same |
| 01/10/2013 | WO2013005633A1 Compound comprising isocyanuric skeleton, epoxy groups, and organopolysiloxane or silsesquioxane skeleton having sih groups, thermosetting resin composition comprising compound as agent for imparting adhesion, cured product, and sealing member for optical semiconductor |
| 01/10/2013 | WO2013005471A1 Resin composition |
| 01/10/2013 | WO2013005441A1 Epoxy polymerizable composition and organic el device |
| 01/10/2013 | WO2013004023A1 Sealant of liquid crystal panel and modification method thereof |
| 01/10/2013 | WO2013003999A1 Adducts as tougheners in thermosettable epoxy systems |
| 01/10/2013 | WO2012110193A3 Curable polymer materials |
| 01/10/2013 | US20130012670 Sealant of liquid crystal panel and modification method therefor |
| 01/10/2013 | US20130012620 Curing agents for epoxy resins |
| 01/10/2013 | US20130011682 Resin composition, and prepeg and laminate prepared using the same |
| 01/09/2013 | EP2543705A2 Epoxy resin composition for electronic component encapsulation and electronic component device using the same |
| 01/09/2013 | EP2543693A1 Epoxy resin composition for carbon-fiber-reinforced composite material, prepreg, integrated molding, fiber-reinforced composite sheet, and casing for electrical/electronic equipment |
| 01/09/2013 | EP2543687A1 Resin composition, prepreg, and laminated sheet |
| 01/09/2013 | EP2542637A2 Two-component structural adhesive which is impact resistant at room temperature |
| 01/09/2013 | EP2542610A1 Novel curing agents |
| 01/09/2013 | EP2542609A1 The use of linear triethylentetramine as curing agent for epoxy resins |
| 01/09/2013 | CN202658115U Low-bromide epoxy resin filter device |
| 01/09/2013 | CN202658114U Low bromide epoxy resin reaction kettle system |
| 01/09/2013 | CN202655032U Novel low-bromide epoxy resin reacting kettle |
| 01/09/2013 | CN102869697A Curable resin composition and cured article thereof |
| 01/09/2013 | CN102863745A Resin adhesive solution and preparation method and method for preparing insulating laminated sheet by adhesive solution |
| 01/09/2013 | CN102863743A Epoxy resin composition for electronic component encapsulation and electronic component device using the same |
| 01/09/2013 | CN102863742A 热硬化性树脂组成物及其应用 Thermosetting resin composition and its application |
| 01/09/2013 | CN102863610A Epoxy resin system and preparation method of maleated rosin imidazolium salt accelerator |
| 01/09/2013 | CN102863609A Organic silicon curing agent for epoxy floor paint and preparation method and application thereof |
| 01/09/2013 | CN102295741B Polyamine organosilicon curing agent for epoxy floor coating, and preparation method thereof |
| 01/09/2013 | CN102061060B High-reliability intelligent-card encapsulating glue and preparation method thereof |
| 01/09/2013 | CN101851330B Alpha, omega-amino terminated polyether compound with phenolic hydroxyl group, preparation method thereof and epoxy resin adhesive containing the same |
| 01/09/2013 | CN101679611B Amine epoxy resin curing agent, gas barrier epoxy resin composition comprising the curing agent, coating agent, and adhesive agent for laminate |
| 01/09/2013 | CN101679599B Catalyst for curing epoxides |
| 01/09/2013 | CN101560226B Novel phosphorus series compound as well as preparation method and application thereof |
| 01/09/2013 | CN101522792B Epoxy resin molding material for sealing and electronic component device |
| 01/08/2013 | US8349989 Method of sealing a semiconductor element with an epoxy resin composition |
| 01/08/2013 | US8349924 Fire-resistant plasticizer for the plastic material industry and method of making thereof |
| 01/08/2013 | US8349903 Dispersant for carbon nanotubes and carbon nanotube composition comprising the same |
| 01/03/2013 | WO2013003202A1 Curable epoxy resin systems containing mixtures of amine hardeners and an excess of epoxide groups |
| 01/03/2013 | WO2013002177A1 Sealant for liquid crystal dropping technique, method for producing sealant for liquid crystal dropping technique, vertical conducting material, and liquid crystal display element |
| 01/03/2013 | WO2013000476A1 High solids antifouling paint composition |
| 01/03/2013 | US20130005855 Epoxy resin composition for use in a carbon-fiber-reinforced composite material, prepreg, and carbon-fiber-reinforced composite material |
| 01/03/2013 | US20130005853 Curable epoxy resin systems containing mixtures of amine hardeners and an excess of epoxide groups |
| 01/03/2013 | US20130004654 Reactive polymer-supported porous film for for battery separator, method for producing the porous film, method for producing battery using the porous film, and electrode/porous film assembly |
| 01/03/2013 | US20130000839 Epoxide-based fixing mortar having silane additions |
| 01/02/2013 | EP2540776A2 Thermosetting light-reflecting resin composition, optical semiconductor element mounting board produced therewith, method for manufacture thereof, and optical semiconductor device |
| 01/02/2013 | EP2540775A2 Thermosetting light-reflecting resin composition, optical semiconductor element mounting board produced therewith, method for manufacture thereof, and optical semiconductor device |
| 01/02/2013 | EP2540755A1 Composite material with blend of thermoplastic particles |
| 01/02/2013 | EP2540754A1 Varnish, prepreg, film with resin, metal foil-clad laminate, and printed circuit board |
| 01/02/2013 | CN102859439A Positive radiation-sensitive composition, interlayer insulating film for display element, and formation method for same |
| 01/02/2013 | CN102858839A Epoxy resin composition, prepreg, metal-clad laminate, and printed wiring board |
| 01/02/2013 | CN102858838A Epoxy resin curing agent, epoxy resin composition, and adhesive agent for laminate |
| 01/02/2013 | CN102858837A Epoxy Resin Curing Compositions And Epoxy Resin Systems Including Same |
| 01/02/2013 | CN102858836A Curable resin composition, adhesive epoxy resin paste, die-bonding agent, non-conductive paste, adhesive epoxy resin film, non-conductive epoxy resin film, anisotropic conductive paste, and anisotropic conductive film |
| 01/02/2013 | CN102858757A Process for preparing divinylarene dioxides |
| 01/02/2013 | CN102850892A Weathering resistance type cathode electrophoresis coating material composition |
| 01/02/2013 | CN102850725A Epoxy potting material for microfiltration or ultrafiltration membrane filling and preparation method thereof |
| 01/02/2013 | CN102850722A Epoxy resin composition, and prepreg and copper foil-clad laminated sheet prepared by using epoxy resin composition |
| 01/02/2013 | CN102850721A Liquid resin composition for electronic components and electronic component device |
| 01/02/2013 | CN102850521A Preparation method of epoxy resin hollow microsphere |
| 01/02/2013 | CN102850520A Toughening-antiflaming type epoxy resin and preparation method thereof |
| 01/02/2013 | CN102850519A Synthetic method of epoxy resin, and associated device thereof |
| 01/02/2013 | CN102391476B Polythiol epoxy resin curing agent and preparation method thereof |
| 01/02/2013 | CN102329428B Block copolymer modified epoxy resin and preparation method thereof |
| 01/02/2013 | CN102295742B Epoxy resin composition and prepreg material as well as printed circuit board prepared by same |
| 01/02/2013 | CN102127290B Epoxy resin composition and flexible copper-clad plate prepared from same |
| 01/02/2013 | CN102010608B Thermosetting emulsified flexible epoxy resin modified emulsified asphalt |
| 01/02/2013 | CN102002237B White heat-curable silicone/epoxy hybrid resin composition |
| 01/02/2013 | CN101940080B Curable electromagnetic shielding adhesive film, method for producing the same, use of the same, method for producing electromagnetic shielding article, and electromagnetic shielding article |
| 01/02/2013 | CN101899195B Dam composition and method for fabrication of multilayer semiconductor device |
| 01/02/2013 | CN101896529B Solid power formulations for the preparation of resin-coated foils and their use in the manufacture of printed circuit boards |
| 01/02/2013 | CN101555310B Curing agent for low temperature cure applications |
| 01/02/2013 | CN101389691B Process for producing low-molecular polyphenylene ether |
| 01/02/2013 | CN101370837B Active energy ray-curable resin composition and use thereof |
| 01/02/2013 | CN101103038B Silane formulation for moisture-crosslinking hybrid adhesives and sealants |
| 01/02/2013 | CN101065708B Method for forming photoresist pattern using double layer antireflection film |
| 01/01/2013 | US8344097 Cationically polymerizable composition and method for controlling cationic polymerization |
| 01/01/2013 | US8344076 Prepared by the reaction of an epoxy compound and a reactive ester; adhesive |
| 12/27/2012 | WO2012178100A2 Di-isoimide compounds,compositions, and preparation thereof |
| 12/27/2012 | WO2012177392A1 Thermosetting composition and process for preparing fiber-reinforced composites |
| 12/27/2012 | WO2012177337A1 Pressure-sensitive adhesives with onium-epoxy resin crosslinking system |
| 12/27/2012 | WO2012177122A1 Composition to protect surfaces and its coating method |
| 12/27/2012 | WO2012177121A1 Novel liquid curing agents and surfactants |
| 12/27/2012 | WO2012177120A1 Novel polymers and polymer compositions |
| 12/27/2012 | WO2012176750A1 Negative photosensitive resin composition and cured product of same |
| 12/27/2012 | WO2012176472A1 Surface sealant for optical semiconductor, method for manufacturing organic el device using same, organic el device, and organic el display panel |
| 12/27/2012 | WO2012174989A1 Epoxy resin compositions |
| 12/27/2012 | US20120328811 Epoxy Resin Compositions |
| 12/26/2012 | EP2537873A1 Metal Compounds for Use as Initiators |
| 12/26/2012 | EP2537817A1 Redispersible epoxy powder |
| 12/26/2012 | EP2536775A1 Divinylarene dioxide resin compositions |
| 12/26/2012 | EP2536774A2 Cationic acrylic resins |