| Patents for C08G 59 - Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by reaction of epoxy polycondensates with monofunctional low-molecular-weight compounds; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups (30,286) |
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| 02/07/2013 | WO2013018847A1 Epoxy resin composition for semiconductor encapsulation, semiconductor device using the same, and method for producing semiconductor device |
| 02/07/2013 | WO2013018635A1 Photosensitive resin composition and cured product thereof |
| 02/07/2013 | WO2013017149A1 Curable epoxy resin composition |
| 02/07/2013 | WO2013016865A1 An oxazolidone ring containing vinyl ester resin and products therefrom |
| 02/07/2013 | US20130035456 Phosphazene Blocked Imidazole as Latent Catalyst for Epoxy Resins |
| 02/06/2013 | EP2554561A1 Epoxy resin composition for prepreg, prepreg, and multilayer printed circuit board |
| 02/06/2013 | EP2552992A2 Epoxy adhesive compositions comprising an adhesion promoter |
| 02/06/2013 | EP2552991A1 Curable compositions |
| 02/06/2013 | CN102918107A Prepreg, metal-clad laminate, and printed circuit board |
| 02/06/2013 | CN102918105A Electroconductive composition, solar battery cell, and method for producing solar battery cell |
| 02/06/2013 | CN102918076A Epoxy resin composition and pre-preg, support-provided resin film, metallic foil clad laminate plate and multilayer printed circuit board utilizing said composition |
| 02/06/2013 | CN102918075A Alcohol compound, polyester resin, unsaturated polyester resin, resin particle and electrophotography toner |
| 02/06/2013 | CN102911585A Special primer paint for medium and high grade automobile aluminum hubs and preparation method of primer paint |
| 02/06/2013 | CN102911501A Resin composition and substrate using same |
| 02/06/2013 | CN102911345A Preparation method and application of epoxy resin adhesive |
| 02/06/2013 | CN102911344A Preparation method of cationic acrylate epoxy resin |
| 02/06/2013 | CN102391473B Preparation method for anhydride cured epoxy resin/palygorskite nanocomposite material |
| 02/06/2013 | CN102329431B Preparation method of epoxy resin composite material strengthened by in situ growth of CNT (carbon nano tube) on surface of quartz fibre |
| 02/06/2013 | CN101522750B Composite materials with improved performance |
| 02/06/2013 | CN101283018B Method for chemical anchoring |
| 02/05/2013 | US8367212 an organopolysiloxane and an organopolysiloxane containing epoxy groups at the two terminals of the molecular chain; can be readily peeled from a pressure sensitive adhesive; release paper |
| 02/05/2013 | CA2537431C Curable alkanolamine-containing epoxy powder coating composition |
| 01/31/2013 | WO2013015659A2 Epoxy resin compound and radiant heat circuit board using the same |
| 01/31/2013 | WO2013015577A1 Heat-curable resin composition, and prepreg and metal foil-stacked plate using same |
| 01/31/2013 | WO2013015344A1 Epoxy resin mixture, epoxy resin composition, prepreg, and curing product of each |
| 01/31/2013 | WO2013015286A1 Epoxy resin, epoxy resin composition, prepreg, and curing product of each |
| 01/31/2013 | WO2012131009A8 Polymeric formulations with chemically adjustable rheology for the manufacture of prepregs and articles made of composite material |
| 01/31/2013 | WO2012088160A3 A coated substrate comprising a curable epoxy composition comprising imidazolium salts and method for preparing same |
| 01/31/2013 | WO2011146580A9 Curable compositions |
| 01/30/2013 | EP2551288A1 Epoxy resin composition for use in a carbon-fiber-reinforced composite material, prepreg, and carbon-fiber-reinforced composite material |
| 01/30/2013 | EP2550311A1 Novel curing agents |
| 01/30/2013 | EP2550310A2 Toughening agent for epoxy resin compositions |
| 01/30/2013 | CN102906934A Photoelectric conversion element using thermosetting sealing agent for photoelectric conversion element |
| 01/30/2013 | CN102906198A Curable composition, hardened material, and method for using curable composition |
| 01/30/2013 | CN102906162A Curable composition, method for manufacturing an epoxy resin/inorganic polymer composite material using said curable composition, and epoxy resin/inorganic polymer composite material |
| 01/30/2013 | CN102906149A Solventless one-pack type cyanic ester/epoxy composite resin composition |
| 01/30/2013 | CN102906148A Curable compositions |
| 01/30/2013 | CN102906147A Semicarbazones as accelerators for curing epoxy resins |
| 01/30/2013 | CN102905877A Acid-hardening epoxy thermoset resins and composites that can be hot-processed and recycled |
| 01/30/2013 | CN102903514A End sealing process for multilayer foil coil of dry-type transformer |
| 01/30/2013 | CN102898996A Impact-resistant epoxy adhesive |
| 01/30/2013 | CN102898993A High strength epoxy pouring sealant composition and application thereof |
| 01/30/2013 | CN102898786A Epoxy molding compound for packaging tantalum capacitor and manufacturing method for epoxy molding compound |
| 01/30/2013 | CN102898785A Encapsulation adhesive for smart card, and preparation method thereof |
| 01/30/2013 | CN102898624A Epoxy resin curing agent and preparation method thereof |
| 01/30/2013 | CN102898623A Cashew amine epoxy curing agent for marine heavy anti-corrosion coating and preparation method for curing agent |
| 01/30/2013 | CN102898622A Epoxy resin for preparing carbon fiber prepreg by using low temperature hot melting method and preparation method |
| 01/30/2013 | CN102898621A Water-based latent curing agent for epoxy resin and application of water-based latent curing agent |
| 01/30/2013 | CN102898620A Epoxy resin composition and semiconductor device |
| 01/30/2013 | CN102898619A Method for synthesizing light color low-chlorinity o-cresol-formaldehyde epoxy resin |
| 01/30/2013 | CN102295824B One-part high-performance epoxy resin composition for pultrusion |
| 01/30/2013 | CN102124054B Unsaturated ester resin composition, unsaturated ester-cured product, and manufacturing method therefor |
| 01/29/2013 | US8362188 Flame-retardant hardner for epoxy resin and flame-retardant resin material comprising the same |
| 01/29/2013 | US8362115 Epoxy resin composition |
| 01/24/2013 | WO2013012587A2 Semiconductor package resin composition and usage method thereof |
| 01/24/2013 | WO2013012035A1 Negative-type photosensitive resin composition, resin film, and electronic component |
| 01/24/2013 | WO2013011832A1 Curable epoxy resin composition |
| 01/24/2013 | WO2013011677A1 Resin composition, resin varnish, prepreg, metal-clad laminate, and printed wiring board |
| 01/24/2013 | WO2013010842A1 Low-emission hardener for epoxy resins |
| 01/24/2013 | WO2013010841A1 Hardener for epoxy resins |
| 01/24/2013 | WO2013010788A2 Polyetheramines used as accelerating agents in epoxy systems |
| 01/24/2013 | WO2012157938A3 Thermosetting resin composition for light reflection, preparation method thereof, reflecting plate for loading photonic semiconductor prepared therefrom, and photonic semiconductor device containing same |
| 01/24/2013 | WO2012157903A3 Epoxy resin composition for neutron shielding, and method for preparing same |
| 01/23/2013 | EP2548933A1 Heat-resistant adhesive |
| 01/23/2013 | EP2548904A1 Epoxy resin curing agent, epoxy resin composition, and adhesive agent for laminate |
| 01/23/2013 | EP2547675A2 Process for preparing divinylarene dioxides |
| 01/23/2013 | CN102892806A Fluorine- and epoxy group-containing copolymer, and method for producing same |
| 01/23/2013 | CN102892745A Diolefin compound, epoxy resin, curable resin composition, and cured article |
| 01/23/2013 | CN102888767A Novel dye fixing agent |
| 01/23/2013 | CN102887990A Environmentally-friendly curing agent |
| 01/23/2013 | CN102887989A Novel formaldehyde-free fixing agent |
| 01/23/2013 | CN102276789B Method for recovering and utilizing waste and old paper-based copper-coated board non-metallic material |
| 01/23/2013 | CN102153725B Preparation and application of high-performance epoxy bitumen material compatibilizer |
| 01/23/2013 | CN102083881B Modified epoxy resin, epoxy resin compositions and cured articles |
| 01/23/2013 | CN101970525B Curable composition, anisotropic conductive material and connection structure |
| 01/23/2013 | CN101959923B Curable composition and color filter |
| 01/23/2013 | CN101946210B Composition for forming resist underlayer film and method for forming resist pattern using the same |
| 01/23/2013 | CN101602881B Thermosetting resin composition and application |
| 01/23/2013 | CN101400719B Phenoxy resin for optical material, resin composition for optical material, resin film for optical material, and optical waveguide using those |
| 01/23/2013 | CN101173086B Curing agent for low temperature cure applications |
| 01/22/2013 | US8357764 Fast curable epoxy compositions containing imidazole- and 1-(aminoalkyl) imidazole-isocyanate adducts |
| 01/22/2013 | CA2696158C Electrodeposition coatings for use over aluminum substrates |
| 01/17/2013 | WO2013009114A2 Epoxy resin compound and radiant heat circuit board using the same |
| 01/17/2013 | WO2013009113A2 Epoxy resin compound and radiant heat circuit board using the same |
| 01/17/2013 | WO2013008884A1 Liquid crystal sealant and liquid crystal display cell using same |
| 01/17/2013 | WO2013008841A1 White curable composition for optical semiconductor device, molded object for optical semiconductor device, and optical semiconductor device |
| 01/17/2013 | WO2013008684A1 Resin composition for printed wiring boards |
| 01/17/2013 | WO2013008680A1 Curable epoxy resin composition |
| 01/17/2013 | WO2013007128A1 Reinforced composite and method for recycling the same |
| 01/17/2013 | WO2012011804A3 Heat-resistant, chemical resistant, room temperature curable, solvent-free resin compositions to apply as protective coating |
| 01/17/2013 | US20130019256 Information recording medium and method for producing same, and information recording material |
| 01/16/2013 | EP2546276A1 Curing agent for epoxy resins |
| 01/16/2013 | EP2546275A2 Curable epoxy resin compositions, epoxy resin compositions for the encapsulation of electronic parts, stabilizers for electrical insulating oils, and casting epoxy resin compositions for electrical insulation. |
| 01/16/2013 | EP2546230A1 Low-emission curing agent for epoxy resins |
| 01/16/2013 | EP2545101A2 Multi-amine functional oligomers and method for producing the same by the reduction of corresponding oximes |
| 01/16/2013 | CN102884130A 1C epoxy resin composition with reduced toxicity |
| 01/16/2013 | CN102884101A Novel curing agents |
| 01/16/2013 | CN102884100A Epoxy resin compositions having poly(propylene oxide) poiyol as toughening agent |
| 01/16/2013 | CN102884099A Curable compositions |
| 01/16/2013 | CN102876200A Hydrophilic aluminum foil coating and method for preparing and curing same |