Patents
Patents for C08G 59 - Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by reaction of epoxy polycondensates with monofunctional low-molecular-weight compounds; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups (30,286)
03/2013
03/06/2013CN102952370A Epoxy resin composition for optical semiconductor device and optical semiconductor device using the same
03/06/2013CN102952369A Special modified thermoset ultrahigh-molecular epoxy resin electric-strip fastener baffle seat for railway track
03/06/2013CN102952257A Method for preparing stereolithography rapid-prototyping photosensitive resin by adopting 1,4-cyclohexanedimethanol diglycidyl ether diacrylate as prepolymer
03/06/2013CN102952256A Preparation method of water-based acrylic acid epoxy resin
03/06/2013CN102952255A Preparation method of water-soluble epoxy resin
03/06/2013CN102952254A Synthetic method of low-viscosity electron beam curing resin
03/06/2013CN102952253A Epoxy resin based on 2,5-furandicarboxylic acid, preparation method and application thereof
03/06/2013CN102504199B Preparation method of room-temperature self-crosslinking water-based epoxy resin
03/06/2013CN102352025B Preparation method of silica modified epoxy resin curing agent and varnish
03/06/2013CN102268214B Preparation method of aqueous epoxy resin paint
03/06/2013CN102134375B Halogen-free Tg resin composite and presoaked material and laminated board made by adopting same
03/06/2013CN101967265B High-frequency resin composition and high-frequency circuit substrate manufactured by using same
03/06/2013CN101896271B Anion exchange polymers, methods for making and materials prepared therefrom
03/06/2013CN101724218B Unsaturated resin composition as well as preparation method and purpose thereof
03/06/2013CN101619169B Heat-curable silicone resin-epoxy resin composition, and premolded package molded from same
03/05/2013US8389651 Electrodepositable coating composition comprising a non-solubilized zinc compound
03/05/2013US8389630 Curable composition
02/2013
02/28/2013WO2013028607A1 Polyepoxides and epoxy resins and methods for the manufacture and use thereof
02/28/2013WO2013028292A1 Cyclic carbonate monomers and polymers prepared therefrom
02/28/2013WO2013028281A1 Toughener and toughened epoxy adhesive
02/28/2013WO2013027833A1 Photopolymerizable composition, photopolymerizable coating agent, laminate, and polarizing plate
02/28/2013WO2013027732A1 Curable resin composition, film, prepreg, laminate, cured product and composite body
02/28/2013WO2013027541A1 Thermally cationically polymerizable composition, anisotropic conductive adhesive film, connected structure and manufacturing process therefor
02/28/2013WO2013027389A1 Sheet-shaped epoxy resin composition, and sealing sheet containing same
02/28/2013WO2012125240A3 Polyamides and amidoamines from selectively modified amine amines
02/28/2013US20130053539 Process for preparing eddn and/or edmn and process for preparing deta and/or teta
02/28/2013US20130053538 Process for preparing edfa and/or edmfa and deta and/or teta
02/28/2013US20130053537 Process for regenerating raney catalysts
02/28/2013US20130053536 Process for preparing eddn and/or edmn and a process for preparing deta and/or teta
02/28/2013US20130052381 Polyepoxides and epoxy resins and methods for the manufacture and use thereof
02/27/2013EP2562196A1 Thermosetting composition
02/27/2013EP2562195A1 Epoxy resin composition, prepreg, metal-clad laminate, and printed wiring board
02/27/2013EP2562194A1 Epoxy resin curing agent, epoxy resin composition, and adhesive agent for laminate
02/27/2013CN102947403A Improvements in or relating to structural adhesives
02/27/2013CN102947388A Resin composition, prepreg and laminate
02/27/2013CN102943935A Epoxy resin impregnation glass fiber tape continuous enhancing composite tube and preparation method thereof
02/27/2013CN102942891A Epoxy potting resin for bus ducts, and preparation method and application thereof
02/27/2013CN102942889A Low-halogen epoxy potting adhesive, and preparation method and application thereof
02/27/2013CN102942835A High throwing power cathode electrophoresis paint and preparation method and using method thereof
02/27/2013CN102942767A Insulation composition as well as insulation material, shed and insulator using same, and manufacturing method thereof
02/27/2013CN102942765A Method for preparing high toughness epoxy resin matrix by using heat fusion method
02/27/2013CN102942683A Composite epoxy resin emulsifier and method for preparing same
02/27/2013CN102942682A Diimidazole alkane epoxy curing agent
02/27/2013CN102942681A Modified epoxidized soybean oil acrylate used for 3G communication optical fibers and preparation method thereof
02/27/2013CN102942680A Ultraviolet-cured high-temperature-resistant epoxy acrylate and preparation method thereof
02/27/2013CN102942679A Method for modifying aromatic multifunctional glycidyl amine epoxy resin
02/27/2013CN102942450A 1-methyl-4-isopropyl-bicyclo[2,2,2]-2,3-dihydroxytoluene-5-octylene, as well as preparation method and application thereof
02/27/2013CN102391617B Human body canal cast filler and preparation method thereof
02/27/2013CN102304217B Epoxy solvent-free impregnating resin with low viscosity and preparation method thereof
02/27/2013CN102276791B Flame-retardant epoxy resin compound
02/27/2013CN102076734B Modified resin composition, method for producing the same, and curable resin composition containing the same
02/27/2013CN101970524B Process for producing urethane (meth)acrylate
02/27/2013CN101903436B Phenalkamine and salted amine blends as curing agents for epoxy resins
02/26/2013US8383862 Salt compound, cationic polymerization initiator and cationically polymerizable composition
02/26/2013US8383320 Resist underlayer film forming composition and method of forming resist pattern using the same
02/21/2013WO2013025304A2 Curable resin compositions
02/21/2013WO2013025275A1 Liquid methylenedianiline compositions
02/21/2013WO2013024886A1 Fluorocopolymer composition, coating composition, article having film, and molded article
02/21/2013WO2013024844A1 Epoxy compound, epoxy compound mixture, curable composition, and connecting structure
02/21/2013WO2013024768A1 Sealing agent for liquid crystal display element and liquid crystal display element
02/21/2013WO2012088163A3 Method for preparing a conformally sealed printed wiring board using a coated substrate comprising a curable epoxy composition comprising imidazolium salts
02/21/2013US20130046067 Polycyclopentadiene compounds
02/21/2013US20130042475 Panels and processes therefor
02/20/2013EP2559717A1 Curable resin composition, adhesive epoxy resin paste, die-bonding agent, non-conductive paste, adhesive epoxy resin film, non-conductive epoxy resin film, anisotropic conductive paste, and anisotropic conductive film
02/20/2013CN202744480U Heat exchanger of low-bromine epoxy resin reaction kettle
02/20/2013CN102939316A Thermosetting composition
02/20/2013CN102939315A Curable resin composition and substance obtained by curing same
02/20/2013CN102939314A Use of cyclic carbonates in epoxy resin compositions
02/20/2013CN102939313A Curable resin composition and cured product thereof
02/20/2013CN102936394A Dry outdoor type electric power complete equipment insulation casting material and preparation method thereof
02/20/2013CN102936331A Microcapsule-type latent curing agent for epoxy resin and process for production thereof
02/19/2013US8377623 Photocurable resin composition for producing three dimensional articles having high clarity
02/14/2013WO2013022068A1 Photosensitive resin composition, photosensitive film, permanent resist and method for producing permanent resist
02/14/2013WO2013021734A1 Resin composition for resists
02/14/2013US20130037305 Electrical conductor coated in a bonding layer, and a method of manufacturing such an electrical conductor
02/13/2013EP2557121A1 Resin composition, prepreg and laminate
02/13/2013EP2557103A1 Epoxy compound, curable composition, and cured product thereof
02/13/2013EP2557099A1 Novel phenol resin, curable resin composition, cured article thereof, and printed wiring board
02/13/2013CN102933634A Water dispersible epoxy resin and production method thereof, water-based epoxy resin composition and curable articles thereof
02/13/2013CN102925094A Ultraviolet light polymerization adhesive and preparation method thereof
02/13/2013CN102925033A White ultraviolet light polymerization resin composition, and preparation method and application method thereof
02/13/2013CN102924875A Novel Ni-Mn-Ga resin based composite material, and preparation method thereof
02/13/2013CN102924873A High-strength reverser reinforcing ring
02/13/2013CN102924870A Low-density halogen-free flame retardant type high-strength composite material as well as preparation method and use thereof
02/13/2013CN102924693A Epoxy resin curing agent for die system
02/13/2013CN102924692A High-permeability polyurethane graft-modified epoxy resin interpenetrating-network polymer grouting material and preparation method thereof
02/13/2013CN102924691A Method for preparing low-dielectric epoxy resin composite material
02/13/2013CN102924690A Epoxy resin material used for toughening and reinforcing of hyperbranched polyether type epoxy resin and preparation method thereof
02/13/2013CN102924681A Isocyanate fluorinated polyurethane modified epoxy resin and preparation method thereof
02/13/2013CN102924680A Carbamate-modified vinyl ester resin
02/13/2013CN102924667A Single-component self-phosphatizing antirust acrylic emulsion, and preparation method and application thereof
02/13/2013CN102399350B Aqueous epoxy acrylate resin and preparation method thereof
02/13/2013CN102276797B Epoxy resin composition with excellent temperature cycle performance and preparation method thereof
02/13/2013CN102276788B Epoxy resin based on gallic acids as well as preparation method and application thereof
02/13/2013CN102046727B Novel resin composition and use thereof
02/13/2013CN102040804B 环氧树脂组成物 An epoxy resin composition
02/13/2013CN102027035B Process for continuous production of epoxy resins
02/13/2013CN101851388B Liquid resin composition for electronic component and electronic component device
02/12/2013US8372916 Phosphorus-containing compounds useful for making halogen-free, ignition-resistant polymers
02/07/2013WO2013019092A2 Epoxy resin composition with excellent moldability and metal copper clad laminate for printed circuit board including same
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