Patents
Patents for C08G 59 - Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by reaction of epoxy polycondensates with monofunctional low-molecular-weight compounds; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups (30,286)
07/2013
07/09/2013US8481616 Intercalation agent free compositions useful to make nanocomposite polymers
07/09/2013US8481615 Process for preparing self-healing composite materials of high efficiency for structural applications
07/04/2013WO2013102006A1 Epoxy coating systems using polycyclic polyamines as epoxy hardeners
07/04/2013WO2013101973A1 Foam, composition, and method
07/04/2013WO2013101531A2 Curable water soluble epoxy acrylate resin compositions
07/04/2013WO2013101354A1 Peel ply, method of surface preparation and bonding composite structures using the same
07/04/2013WO2013098034A1 Curable composition comprising a polyisocyanate composition
07/04/2013WO2013097197A1 Functional silane-compatibilized epoxy compositions for insulation applications
07/04/2013US20130172522 Epoxy compound with nitrogen-containing ring
07/04/2013CA2857613A1 Curable composition comprising a polyisocyanate composition
07/03/2013EP2610277A1 Resin composition, molded object and substrate material both obtained from the resin composition, and circuit board including the substrate material
07/03/2013EP2609136A1 Formulated benzoxazine based system for transportation applications
07/03/2013CN103189413A Cation-curable resin composition
07/03/2013CN103189412A Epoxy-thiol compositions with improved stability
07/03/2013CN103189411A Curable and cured compositions
07/03/2013CN103184022A Adhesive composition used for temporary adhesion in wafer preparation
07/03/2013CN103183930A Phenolic epoxy resin forming material
07/03/2013CN103183927A Environment-friendly aldehyde-free epoxy injecting paste material and preparation method and application therefor
07/03/2013CN103183926A Resin composition and sheet thereof, and sheet preparation method, wiring plate material, wiring plate, light source component and semiconductor device
07/03/2013CN103183810A Preparation method of aqueous epoxy curing agent and application in terrace coating thereof
07/03/2013CN103183809A Epoxy resin composition for transparent circuit board, and laminated glass sheet
07/03/2013CN102585257B Heating solidifying method of epoxy resin for preparing fan blade
07/03/2013CN102516502B Preparation method of novel Mannich water-based epoxy curing agent
07/03/2013CN102311715B Healant for chemical pipes and preparation method thereof
07/03/2013CN102174172B Waterborne rosin-based epoxy resin and preparation method as well as application thereof
07/03/2013CN102119201B One-part structural epoxy resin adhesives containing elastomeric tougheners capped with phenols and hydroxy-terminated acrylates or hydroxy-terminated methacrylates
07/03/2013CN102047774B Resin composition for forming the adhesive layers of a multi-layer flexible printed circuit board
07/03/2013CN101921456B Resin composition for sealing an optical semiconductor device
07/03/2013CN101735569B Preparation method of transparent inflaming retarding epoxy resin
07/03/2013CN101679606B Composite material with blend of thermoplastic particles
07/03/2013CN101544744B Acrylic acid rosin and epoxy resin prepolymer and preparation method thereof
07/02/2013US8476381 Method for producing crystalline polyoxyalkylene polyol, and resin obtained by using the same as raw material
07/02/2013US8476331 Photosensitive resin composition and preparation method
07/02/2013US8475925 PBI/epoxy coatings
07/02/2013CA2755856C Polyisocyanate composition
06/2013
06/27/2013WO2013096474A1 Toughening agent for epoxy thermoset
06/27/2013WO2013095936A1 Epoxy resin production
06/27/2013WO2013092504A1 Isocyanate-functional prepolymer for a biologically degradable fabric adhesive
06/27/2013US20130165620 Etheramines containing flexible and rigid segments and their use as intermediates for polymer synthesis
06/26/2013EP2606076A1 Process for producing breakdown-resistant ultrathin dielectrics in electronic components using crosslinkable polymeric dielectric materials
06/26/2013EP2606037A1 Novel compositions and methods to produce triazine-arylhydroxy-aldehyde condensates with improved solubility
06/26/2013CN103180489A Electrodeposition coatings including lanthanide series element for use over aluminum substrates
06/26/2013CN103180385A Resin composition, and prepreg and laminate using same
06/26/2013CN103180359A Heat-curing resin composition, heat-curing adhesive sheet, and method for producing heat-curing adhesive sheet
06/26/2013CN103180355A Phenol-type oligomer and process for production thereof
06/26/2013CN103173183A Polyurethane modified epoxy resin adhesive and preparation method thereof
06/26/2013CN103173176A Bi-component modified epoxy adhesive and preparation method thereof
06/26/2013CN103173175A Organic silicone modified epoxy resin sealant and preparation method thereof
06/26/2013CN103173173A Bi-component epoxy adhesive and preparation method thereof
06/26/2013CN103173114A Epoxy modified organic silicon resin adhesive and preparation method thereof
06/26/2013CN103172977A Anti-flaming, high-temperature-resistant, high-property and hybrid glass-fiber prepreg and preparation method thereof
06/26/2013CN103172974A Epoxy resin-based nanometer composite material and preparation method thereof
06/26/2013CN103172973A High thermal-conductivity polymer composite material and preparation method thereof
06/26/2013CN103172958A Thermo-sensitive epoxy resin composite material and preparation method thereof
06/26/2013CN103172833A High temperature resisting epoxy resin curing agent for room temperature curing and preparation method thereof
06/26/2013CN103172832A Epoxy resin early-strength curing agent for binding and preparation method thereof
06/26/2013CN103172831A Epoxy resin composition for luminous characters
06/26/2013CN103172812A Preparation method of phosphorous-containing phenol formaldehyde resin and resin prepared
06/26/2013CN102504491B Preparation method for waste circuit board non-metal powder modified epoxy glass fiber reinforced plastic composite material
06/26/2013CN102504490B Injection moldable electric epoxy molding plastic and preparation method thereof
06/26/2013CN102432787B Modified hydrocarbylphenol-aldehyde resins for use as tackifiers and rubber compositions containing them
06/26/2013CN102408545B Resin compound used for sealing rare earth permanent magnet coreless energy-saving motor
06/25/2013US8470938 Resin composition for printed wiring board, prepreg, and laminate obtained with the same
06/25/2013US8470435 Epdxy resin for prepreg, prepreg, fiber-reinforced composite material, and methods for production thereof
06/25/2013CA2601660C Use of cationic polycondensation products as additives for fixing colours and/or inhibiting the running of colours, for washing products and washing aftertreatment products
06/20/2013WO2013090938A1 Curable epoxy composition with quaternary ammonium bicarbonate curing catalyst, coated article prepared therewith, and method for preparing consolidated multi-layer article
06/20/2013WO2013090702A2 Sulfide extended epoxy resins and barrier coatings applications thereof
06/20/2013WO2013090138A1 Mercapto-containing bisanhydrohexitol derivatives and uses thereof
06/20/2013WO2013089100A1 Curable resin composition
06/20/2013WO2013089000A1 Curable composition
06/20/2013WO2013088974A1 Curable composition, cured product, and organic electroluminescence element using same
06/20/2013WO2013087592A2 Epoxy resin compositions
06/20/2013WO2013087317A1 Epoxy resin system, aging-resistant molding material which can be produced from the epoxy resin system, and electronic component comprising the molding material
06/19/2013EP2604639A2 Resin composition, cured resin product, wiring board, and manufacturing method for wiring board
06/19/2013EP2604638A1 Curable resin composition and cured article thereof
06/19/2013CN103168074A 固化性环氧树脂组合物 The curable epoxy resin composition
06/19/2013CN103168061A Sealing resin composition and electronic component device
06/19/2013CN103168060A 固化性环氧树脂组合物 The curable epoxy resin composition
06/19/2013CN103168059A Resin composition
06/19/2013CN103167788A Electromagnetic wave shielding composite film and flexible printed circuit board with the same
06/19/2013CN103160234A High-performance thermosetting epoxy resin adhesive for roads and bridges and preparation method thereof
06/19/2013CN103160077A Self-lubrication-type wear-resistant epoxy resin containing POSS and preparation method thereof
06/19/2013CN102675559B Method for in-situ synthesis of epoxy group vacuum pressure impregnating resin hybridized by inorganic nanometer particles
06/19/2013CN102634314B Heat-conducting epoxy dipped adhesive and preparation method
06/19/2013CN102504205B Preparation method for epoxy hardener resistant to boiling water boiling
06/19/2013CN102432836B Halogen-free thermosetting resin composition and prepreg and laminated board manufactured by same
06/19/2013CN102399309B Reactive emulsifier and its preparation method
06/19/2013CN102382281B Resin composition, resin-based composite material and preparation method of the resin-based composite material
06/19/2013CN101868489B Impact strength improving agent for epoxy resin compositions
06/19/2013CN101790552B 环氧树脂组合物 The epoxy resin composition
06/19/2013CN101698739B Carbon fiber composite core composition and method for preparing carbon fiber composite core
06/19/2013CN101643538B Benzylated aminopropylated ethylenediamines and uses thereof
06/19/2013CN101643537B Alkylated aminopropylated ethylenediamines and uses thereof
06/18/2013US8466238 Latent curing agents, epoxy resin compositions containing the same, sealing materials, and organic EL displays
06/18/2013US8466216 Low odor binders curable at room temperature
06/13/2013WO2013086277A2 Structural adhesive compositions
06/13/2013WO2013084819A1 Resin composition, prepreg, and laminate
06/13/2013WO2013084708A1 Cationic hardening resin composition for hard disk drive assembly
06/13/2013WO2013019092A3 Epoxy resin composition with excellent moldability and metal copper clad laminate for printed circuit board including same
06/13/2013WO2013009113A3 Epoxy resin compound and radiant heat circuit board using the same
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