| Patents for C08G 59 - Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by reaction of epoxy polycondensates with monofunctional low-molecular-weight compounds; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups (30,286) |
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| 05/29/2013 | CN103124757A Advanced epoxy resin compositions |
| 05/29/2013 | CN103122232A 2,2-di[4-(2,4-diamino phenoxy) phenyl] propane form high-temperature epoxy adhesive and preparation method thereof |
| 05/29/2013 | CN103122231A 1,4-di(2,4-diamino phenoxy) benzenoid form high-temperature epoxy adhesive and preparation method thereof |
| 05/29/2013 | CN103122190A Class-H insulation dry-type air-core reactor wire epoxy polyester low-solvent bonding paint and production method thereof |
| 05/29/2013 | CN103122125A Resin mixture containing carbon nano tube for carbon fiber wet process winding and preparation method thereof |
| 05/29/2013 | CN103122010A Monofunctional, bifunctional, and multifunctional phosphinated phenols and their derivatives and preparation method thereof |
| 05/29/2013 | CN102504203B Preparation method and encapsulation method for encapsulation material used for encapsulating DG4 iron core coils |
| 05/29/2013 | CN102229700B Epoxy resin nanometer montmorillonite composite material and preparation method thereof |
| 05/29/2013 | CN102177187B Epoxy resins and composite materials with improved burn properties |
| 05/29/2013 | CN101558020B Sizing compositions and glass fiber reinforced thermoplastic composites |
| 05/28/2013 | US8450451 Epoxy resin curing agent for enhanced wear resistance and weatherability of cured materials |
| 05/28/2013 | US8450420 Polylactic acid-containing resin compositions |
| 05/23/2013 | WO2013073518A1 Carboxyl-containing resin, resin composition for use in solder resist, and manufacturing process for carboxyl-containing resin |
| 05/23/2013 | WO2013072356A1 Use of n,n'-(dimethyl) urons and method for curing epoxy resin compositions |
| 05/23/2013 | WO2013042894A3 Epoxy resin composition, adhesive sheet using same, circuit board including same, and method for manufacturing same |
| 05/23/2013 | WO2012161490A9 Epoxy resin compound and radiant heat circuit board using the same |
| 05/23/2013 | US20130131285 Phosphorus-containing compounds useful for making halogen-free, ignition-resistant polymers |
| 05/23/2013 | CA2855900A1 Use of n,n'-(dimethyl)-urones and method for curing epoxy resin compositions |
| 05/23/2013 | CA2855897A1 Alkyl or dialkyl semicarbazones as curing agents for epoxy resins |
| 05/22/2013 | EP2594596A1 Epoxy resin composition for semiconductor encapsulation and semiconductor device using the same |
| 05/22/2013 | CN103119109A Curable composition for inkjet, and method for producing electronic component |
| 05/22/2013 | CN103119080A Energy-ray-curable resin composition,adhesive comprising same, and cured object obtained therefrom |
| 05/22/2013 | CN103119079A 三聚氰胺环氧树脂单体及树脂组合物 Melamine monomers and epoxy resin composition |
| 05/22/2013 | CN103113872A High-efficiency decompression and augmented injection agent used for oil extraction and production method thereof |
| 05/22/2013 | CN103113808A Method for preparing water-borne epoxy resin zinc-rich primer by use of water-borne epoxy resin emulsion |
| 05/22/2013 | CN103113716A Preparation method of dimer acid modified epoxy resin toughened carbon fiber prepreg |
| 05/22/2013 | CN103113711A Preparation method for low-dielectric halogen-free flame retardant glass fiber pre-impregnation material |
| 05/22/2013 | CN103113710A Method for preparing epoxy resin prepreg capable of being cured at normal temperature |
| 05/22/2013 | CN103113604A Method for improving interlaminar shear strength of medium/low-temperature cured prepreg by using polyurethane prepolymer |
| 05/22/2013 | CN103113556A Preparation method of curing agent suitable for epoxy resin base microporous ceramic molding die |
| 05/22/2013 | CN103113544A Phenolic aldehyde modified amine curing agent and preparation method thereof |
| 05/22/2013 | CN103113526A Solvent-less impregnating resin for high-voltage motor and curing method |
| 05/22/2013 | CN102046691B Carboxyl group-containing resin, curable composition containing carboxyl group-containing resin, and cured product of the composition |
| 05/22/2013 | CN101230113B Sulfonyl grafted heterocycle materials for proton conducting electrolytes |
| 05/16/2013 | WO2013070415A1 Structural adhesive and bonding application thereof |
| 05/16/2013 | WO2013070393A1 Curable compositions |
| 05/16/2013 | WO2013069787A1 Epoxy curing agent |
| 05/16/2013 | WO2013068507A1 Hardeners for epoxy resins, which comprise aromatic amino groups |
| 05/16/2013 | WO2013068506A1 Hardeners for epoxy resins, which comprise pyridinyl groups |
| 05/16/2013 | WO2013068501A1 Hardeners for epoxy resin coatings |
| 05/16/2013 | WO2013009114A3 Epoxy resin compound and radiant heat circuit board using the same |
| 05/16/2013 | US20130123457 Low-k, Flame-Retardant, Bi-Functional Benzoxazine and Method for Making the Same |
| 05/16/2013 | US20130123401 Phosphorus-containing compounds useful for making halogen-free, ignition-resistant polymers |
| 05/16/2013 | DE102011118760A1 Verwendung von N,N'(-Dimethyl)-Uronen sowie Verfahren zur Härtung von Epoxidharz-Zusammensetzungen Use of N, N '(- dimethyl) -Uronen as well as methods for the curing of epoxy resin compositions |
| 05/16/2013 | DE102011118501A1 Alkyl- oder Dialkyl-Semicarbazone als Härter für Epoxidharze Alkyl or dialkyl semicarbazones as curing agents for epoxy resins |
| 05/16/2013 | CA2854944A1 Hardeners for epoxy resin coatings |
| 05/16/2013 | CA2854825A1 Structural adhesive and bonding application thereof |
| 05/15/2013 | EP2592101A1 Curing agent for epoxy resin coatings |
| 05/15/2013 | EP2592100A1 Curing agent for epoxy resin coatings |
| 05/15/2013 | EP2592099A1 Epoxy resin curing agent with aromatic amino groups |
| 05/15/2013 | EP2592098A1 Epoxy resin curing agent with pyridinyl groups |
| 05/15/2013 | CN1798786B Curing resin composition, sealing material for liquid crystal display device and liquid crystal display device |
| 05/15/2013 | CN103108898A Paper coating compositions |
| 05/15/2013 | CN103102742A Preparation method of nano graphite conductive ink |
| 05/15/2013 | CN103102643A Thermosetting epoxy resin composition and optical semiconductor device |
| 05/15/2013 | CN103102506A Novel accelerant and curing agent, preparation method and application thereof |
| 05/15/2013 | CN103102471A Phosphorus-containing phenolic resin and the producing method, phenolic resin composition and cured product thereof |
| 05/15/2013 | CN103102470A Flame-retardant epoxy resin, epoxy resin composition containing the epoxy resin as essential component and cured product thereof |
| 05/15/2013 | CN103101252A Method for manufacturing CEM (Composite Epoxy Material Grade)-3 copper-clad plate with high dielectric constant and low loss |
| 05/15/2013 | CN102391438B Vinyl resin and preparation method thereof |
| 05/15/2013 | CN101807000B Photosensitive resin composition and method for producing same |
| 05/14/2013 | US8440771 Phosphorus-containing compounds useful for making halogen-free, ignition-resistant polymers |
| 05/14/2013 | CA2592305C Fire-retardant low-density epoxy composition |
| 05/10/2013 | WO2013065759A1 Epoxy resin composition, partially-cured epoxy resin composition, cured epoxy resin composition, resin sheet, prepreg, laminate, metal substrate, circuit board, production method for partially-cured epoxy resin composition, and production method for cured epoxy resin composition |
| 05/10/2013 | WO2013065758A1 Resin composition, and resin sheet, prepreg, laminate, metal substrate, printed circuit board and power semiconductor device using same |
| 05/10/2013 | WO2013065694A1 Resin composition, prepreg, and laminated sheet |
| 05/10/2013 | WO2013065516A1 Two-pack type epoxy resin composition for fiber-reinforced composite materials, and fiber-reinforced composite material |
| 05/10/2013 | WO2013065433A1 Resin composition |
| 05/10/2013 | WO2013063753A1 Liquid epoxy resin formulations |
| 05/10/2013 | WO2013010788A3 Polyetheramines used as accelerating agents in epoxy systems |
| 05/09/2013 | US20130115440 Composites |
| 05/08/2013 | EP2589635A1 Interlaminar bonding agent and waterproof structure and waterproofing method |
| 05/08/2013 | EP2589625A1 Thermosetting resin composition, cured product thereof, active ester resin, semiconductor sealing material, prepreg, printed circuit board, and build-up film |
| 05/08/2013 | EP2588512A1 Color indicating epoxy resins and methods thereof |
| 05/08/2013 | CN103098561A Flexible printed circuit board integrated with reinforcing plate, and method for manufacturing flexible printed circuit board integrated with reinforcing plate |
| 05/08/2013 | CN103097436A 树脂组合物 Resin composition |
| 05/08/2013 | CN103097427A Liquid curable epoxy resin composition and adhesive agent containing same |
| 05/08/2013 | CN103097426A Epoxy compound, curable composition, and cured product thereof |
| 05/08/2013 | CN103093896A Manufacture method of carbon fiber composite cables |
| 05/08/2013 | CN103093889A Cable core |
| 05/08/2013 | CN103087607A Single-component curable waterborne epoxy insulating paint and preparation method of waterborne epoxy insulating paint |
| 05/08/2013 | CN103087476A Impregnating resin for manufacturing nano composite major insulator for high-voltage motors |
| 05/08/2013 | CN103087473A Composition for making seamless spherical screen, and application thereof |
| 05/08/2013 | CN103087472A Liquid resin composition for electronic component and electronic component device |
| 05/08/2013 | CN103087471A High thermal conductivity prepreg and manufacturing method thereof |
| 05/08/2013 | CN103087295A Latent hyperbranched polymer curing agent and its preparation method |
| 05/08/2013 | CN103087294A Modified epoxy acrylic acid resin, preparation method and uses thereof |
| 05/08/2013 | CN103087012A Epoxy compound and cationic polymer as well as preparation methods thereof |
| 05/08/2013 | CN102164981B Photocurable composition |
| 05/08/2013 | CN102093665B Heat conduction insulating casting glue and preparation method thereof |
| 05/08/2013 | CN102066453B Thermosetting resin containing irradiated thermoplastic toughening agent |
| 05/08/2013 | CN102040568B Synthesis method of low-molecular weight epoxy resin |
| 05/08/2013 | CN102030900B Method for preparing grease/rosin-based polyamide aqueous epoxy curing agent |
| 05/08/2013 | CN101903426B Copolymer, resin composition, spacer for display panel, planarization film, thermosetting protective film, microlens, and process for producing copolymer |
| 05/07/2013 | US8436127 Semiconductor materials based on diketopiperidinopiperidine copolymers |
| 05/07/2013 | US8436126 Resin composition for adhesive sheet and adhesive sheet using the composition for flexible printed circuit board |
| 05/07/2013 | US8436108 Phosphorus-containing compounds useful for making halogen-free, ignition-resistant polymers |
| 05/07/2013 | US8436079 Weather-resistant epoxy resin system |
| 05/07/2013 | US8436068 Composition and polymer |
| 05/07/2013 | US8435721 Resist underlayer film forming composition and forming method of resist pattern using the same |