| Patents for C08G 59 - Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by reaction of epoxy polycondensates with monofunctional low-molecular-weight compounds; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups (30,286) |
|---|
| 03/27/2013 | CN101580580B 热固化性组合物 Heat-curable composition |
| 03/27/2013 | CN101321790B Phenol resin composition, cured product thereof, resin composition for copper clad laminate, copper clad laminate and novel phenol resin |
| 03/26/2013 | US8404777 Thermoplastic-toughened cyanate ester resin composites with low heat release properties |
| 03/26/2013 | US8404311 Gelator-stabilized crystalline resins |
| 03/26/2013 | US8404161 Hydroxyphenyl phosphine oxide mixtures and their use as flame retardant's for epoxy resins |
| 03/21/2013 | WO2013038945A1 Triepoxy compound and method for producing same |
| 03/21/2013 | WO2013038602A1 Epoxy resin composition and printed board obtained using same |
| 03/21/2013 | WO2013038571A1 Sealant composition |
| 03/21/2013 | WO2012161490A3 Epoxy resin compound and radiant heat circuit board using the same |
| 03/20/2013 | EP2569384A2 Improvements in or relating to structural adhesives |
| 03/20/2013 | EP2569362A1 Insulation for rotating electrical machines |
| 03/20/2013 | CN202803040U Dust collection device used in brominated epoxy resin production |
| 03/20/2013 | CN102985485A Thermosetting resin composition, cured product thereof, active ester resin, semiconductor sealing material, prepreg, printed circuit board, and build-up film |
| 03/20/2013 | CN102985463A Polycarboxylic acid condensate, thermosetting resin composition, substrate for mounting semiconductor element and process for producing same, and semiconductor device |
| 03/20/2013 | CN102985461A 固化性树脂组合物 The curable resin composition of the |
| 03/20/2013 | CN102985460A Curing agent composition for epoxy resin, curable resin composition, and cured product thereof |
| 03/20/2013 | CN102985459A Curable resin compositions |
| 03/20/2013 | CN102985458A Method for producing cured product and cured product |
| 03/20/2013 | CN102981362A Method using 4 and 5-cyclohexene oxide-1 and 2-dioctyl phthalate glycidyl ester as prepolymer to prepare three-dimensional lithography fast forming photosensitive resin and application |
| 03/20/2013 | CN102977670A Cashew phenolic aldehyde amide epoxy hardener for four-season-general type anticorrosive paint and preparation method of cashew phenolic aldehyde amide epoxy hardener |
| 03/20/2013 | CN102977557A Room temperature curing epoxy resin composition and preparation method thereof |
| 03/20/2013 | CN102977556A High-performance epoxy resin composition for vacuum infusion molding and preparation method thereof |
| 03/20/2013 | CN102977555A Light epoxy grouting material as well as preparation method and application thereof |
| 03/20/2013 | CN102977554A Epoxy/organosilicon co-curing composite material for LED packaging and preparation method |
| 03/20/2013 | CN102977551A Halogen-free resin composition and method for preparing copper-clad plate from the halogen-free resin composition |
| 03/20/2013 | CN102977376A Nonionic self-emulsifying waterborne epoxy resin and preparation method and application thereof |
| 03/20/2013 | CN102977340A A curable epoxy resin composition having a mixed catalyst system and laminates made therefrom |
| 03/20/2013 | CN102977339A Diethylenetriamine amido low molecular weight 650 epoxy hardener used for epoxy polyamide coating and preparation method and application thereof |
| 03/20/2013 | CN102977338A Waterborne epoxy resin and preparation method thereof, and method for preparing varnish |
| 03/20/2013 | CN102977337A C-grade modified bismaleimide glass fiber reinforced mould plastic |
| 03/20/2013 | CN102977336A Thermosetting resin composition, epoxy resin molding material, and polyvalent carboxylic acid condensate |
| 03/20/2013 | CN102504202B Liquid crystal epoxy resin with shape memory effect and preparation method and application thereof |
| 03/20/2013 | CN102492149B Preparation method of nonionic aqueous epoxy resin curing agent |
| 03/20/2013 | CN102352089B Vegetable fiber reinforced biomass resin lamellar material and preparation method thereof |
| 03/20/2013 | CN101759857B Biomass-derived epoxy compound and manufacturing method thereof |
| 03/19/2013 | US8399596 Epoxy resin compositions and process for preparing them |
| 03/19/2013 | US8399533 Photocurable compositions containing N-oxyazinium salt photoinitiators |
| 03/19/2013 | CA2660875C Thermosetting resin composition, and prepreg, laminated board for wiring board and printed wiring board using the same |
| 03/14/2013 | WO2013035808A1 Epoxy resin, epoxy resin composition, and cured product thereof |
| 03/14/2013 | WO2013035787A1 Polymer and composition including same, and adhesive composition |
| 03/14/2013 | WO2013035740A1 Curable resin composition for sealing optical semiconductor element and cured product thereof |
| 03/14/2013 | WO2013035542A1 Resin composition for sealing optical semiconductor, and optical semiconductor device using same |
| 03/14/2013 | WO2013035350A1 Resin film |
| 03/14/2013 | WO2013034867A1 Improvement of the physical properties of polyurethane polymers |
| 03/14/2013 | WO2013034193A1 Method of producing high voltage electrical insulation |
| 03/14/2013 | US20130066026 Hardeners for thermosettable resin compositions |
| 03/14/2013 | DE102011113264A1 Auskleidungsschlauch für die Sanierung von fluidführenden Leitungssystemen Liner bag for the rehabilitation of fluid carrying conduit systems |
| 03/13/2013 | EP2566922A1 1c epoxy resin composition with reduced toxicity |
| 03/13/2013 | EP2566908A2 Potting for electronic components |
| 03/13/2013 | CN102971677A Photosensitive composition for recording volume hologram, and method for manufacturing medium |
| 03/13/2013 | CN102971355A Polyvalent carboxylic acid composition, curing agent composition, and curable resin composition containing polyvalent carboxylic acid composition or curing agent composition as curing agent for epoxy resin |
| 03/13/2013 | CN102971354A Potting for electronic components |
| 03/13/2013 | CN102964781A Production method of epoxy resin electronic potting material |
| 03/13/2013 | CN102964780A Epoxy resin composition for vacuum introduction formation of fibre reinforced composite material and preparation method of epoxy resin composition |
| 03/13/2013 | CN102964777A Phosphorus-containing and halogen-free flame retardant resin adhesive as well as preparation method and application thereof |
| 03/13/2013 | CN102964776A Packaging resin composition |
| 03/13/2013 | CN102964775A Thermosetting resin composition and use thereof |
| 03/13/2013 | CN102964568A Modified di-imidazole latent curing agent for epoxy resin and preparation method for same |
| 03/13/2013 | CN102964567A Epoxy resin curing agent |
| 03/13/2013 | CN102964534A Solvent-free resin composition for vacuum impregnation |
| 03/13/2013 | CN102964531A Gradient conductive material and preparation method thereof |
| 03/13/2013 | CN102408677B SiC/epoxy resin composite material and method for manufacturing pump components with it |
| 03/13/2013 | CN102391472B Epoxy resin microcapsule latent curing agent and preparation method thereof |
| 03/13/2013 | CN102382282B Flexible curing agent applicable to electronic packaging material and synthesis method thereof |
| 03/13/2013 | CN102336891B Nonisocyanate polyurethane-epoxy resin material, preparation method thereof, and application thereof |
| 03/13/2013 | CN102186898B Curable resin composition and cured product thereof, printed circuit board, and epoxy resin and method for producing same |
| 03/13/2013 | CN102174244B Insulating water-proof epoxy resin composition, adhesive tape and preparation methods thereof |
| 03/13/2013 | CN102079810B Synthesis and application of light-cured polyurethane-acrylic acid-epoxy resin adhesive |
| 03/13/2013 | CN102010574B Flame-retardant molding compositions |
| 03/13/2013 | CN101880507B Expanded water-based fireproof varnish and preparation method |
| 03/13/2013 | CN101688051B Epoxy resin-forming liquid preparation containing inorganic particle |
| 03/13/2013 | CN101643539B Alkylated aminopropylated methylene-di-(cyclohexylamine) and uses thereof |
| 03/12/2013 | US8394869 Photopolymerizable compositions useful as a dental restorative material |
| 03/12/2013 | CA2509087C Castor oil/epoxidized soybean oil based elastomeric compositions |
| 03/07/2013 | WO2013032238A2 Epoxy resin compound and radiant heat circuit board using the same |
| 03/07/2013 | WO2013032190A1 Photopolymerizable unsaturated resin, photosensitive resin composition comprising the same, and light shielding spacer and liquid crystal display device formed therefrom |
| 03/07/2013 | WO2013030998A1 Resin composition, resin sheet, resin sheet with metal foil, hardened resin sheet, structure, and semiconductor device for power or light source |
| 03/07/2013 | WO2013029832A1 Process for the impregnation of air core reactors, impregnated air core reactor and use of an impregnation system |
| 03/07/2013 | WO2013008072A3 A process for preparing polymer composition of functionalized epoxy resist, polymer composition and applications thereof |
| 03/07/2013 | WO2012110193A4 Curable polymer materials |
| 03/07/2013 | US20130060002 Process for working up reaction outputs from the hydrogenation of eddn or edmn |
| 03/07/2013 | US20130059988 Remendable interfaces for polymer composites |
| 03/07/2013 | US20130059138 Systems and methods for drilling holes in printed circuit boards |
| 03/07/2013 | US20130056266 Anticorrosive, coated electric wire with terminal, and wiring harness |
| 03/07/2013 | DE10321536B4 Aminoalkohol-basierte Tenside mit geringer Oberflächenspannung und deren Verwendung Aminoalcohol-based surfactants with low surface tension and their use |
| 03/07/2013 | CA2845151A1 Process for the impregnation of air core reactors, impregnated air core reactor and use of an impregnation system |
| 03/06/2013 | EP2563835A1 Epoxy polycyclopentadiene compounds |
| 03/06/2013 | CN102959005A B stage sheet, metal foil with applied resin, metal substrate and led substrate |
| 03/06/2013 | CN102959004A Acrylic rubber composition, vulcanizate, hose part, and sealing part |
| 03/06/2013 | CN102958974A Curable resin composition |
| 03/06/2013 | CN102958973A Color indicating epoxy resins and methods thereof |
| 03/06/2013 | CN102958972A 聚合物混凝土组合物 Polymer concrete compositions |
| 03/06/2013 | CN102958971A Epoxy polycyclopentadiene compounds |
| 03/06/2013 | CN102958966A Novel phenol resin, curable resin composition, cured article thereof, and printed wiring board |
| 03/06/2013 | CN102952454A Modified phenol aldehyde amine epoxy primer composition and preparation method thereof |
| 03/06/2013 | CN102952453A Modified phenol aldehyde amine low-surface-treatment paint composition and preparation method thereof |
| 03/06/2013 | CN102952375A Modified thermosetting ultrahigh-molecular epoxy resin screw spike special for railway |
| 03/06/2013 | CN102952374A Modified thermosetting ultrahigh-molecular epoxy resin composite material |
| 03/06/2013 | CN102952372A Special modified thermoset ultrahigh-molecular epoxy resin electric-strip fastener ruled baffle for railway track |
| 03/06/2013 | CN102952371A Modified thermosetting ultrahigh-molecular epoxy resin marine board |