Patents for C08G 59 - Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by reaction of epoxy polycondensates with monofunctional low-molecular-weight compounds; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups (30,286) |
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06/13/2013 | DE102011056295A1 Epoxidharzsystem, Verwendung des Epoxidharzsystems, alterungsbeständiger Epoxidharzformstoff und Bauelement mit dem Epoxidharzformstoff Epoxy resin, using epoxy resin, epoxy resin molded and age-resistant component with the epoxy resin molded |
06/13/2013 | CA2858549A1 Surfacing film for composite structures and method of making the same |
06/13/2013 | CA2858186A1 Structural adhesive compositions |
06/12/2013 | EP2602289A2 Epoxy resin composition for electronic parts encapsulation and electronic parts-equipped device using the same |
06/12/2013 | EP2602274A1 Epoxy resin composition having monocyclic aliphatic hydrocarbon ring |
06/12/2013 | EP2602257A1 Epoxy compound with nitrogen-containing ring |
06/12/2013 | EP2601235A1 Epoxidized composition and methods for making the same |
06/12/2013 | CN103154090A Epoxy silicone condensate, curable composition comprising epoxy silicone condensate, and cured product thereof |
06/12/2013 | CN103154074A Cationic polymerization initiator and thermosetting epoxy resin composition |
06/12/2013 | CN103154073A 固化性环氧树脂组合物 Curable epoxy resin composition |
06/12/2013 | CN103154072A 固化性环氧树脂组合物 Curable epoxy resin composition |
06/12/2013 | CN103154071A Coating compositions |
06/12/2013 | CN103154070A Filler composition for space between layers of three-dimensional integrated circuit, coating fluid, and process for producing three-dimensional integrated circuit |
06/12/2013 | CN103146331A 4,4'-bis(2,4-diamidophenoxy)biphenyl high-temperature-resistant epoxy adhesive and preparation method thereof |
06/12/2013 | CN103146330A 2,2-bis[4-(2,4-diamidophenoxy)phenyl]hexafluoropropane high-temperature-resistant epoxy adhesive and preparation method thereof |
06/12/2013 | CN103146295A Matte cathode electrophoresis coating as well as preparation method and use method for same |
06/12/2013 | CN103146150A Novel epoxy resin curing agent |
06/12/2013 | CN103146149A Curing agent composition, and preparation method and application thereof |
06/12/2013 | CN103146148A Halogen-free flame retardant epoxy resin composition and dry type transformer poured by same |
06/12/2013 | CN103146147A Toughened epoxy resin/glass fiber prepreg and preparation method |
06/12/2013 | CN103146146A Epoxy nanocomposite with controllable phase structure and based on polyhedral oligomeric silsesquioxanes (POSS) |
06/12/2013 | CN103146141A Low dielectric constant polyhedral oligomeric silsesquioxane (POSS)/ epoxy resin hybrid material and preparation method |
06/12/2013 | CN103146139A Epoxy resin composition for electronic parts encapsulation and electronic parts-equipped device using the same |
06/12/2013 | CN103145989A Sealant composition comprising polythioether |
06/12/2013 | CN103145955A Non-ionic self-emulsifying epoxy resin curing agent and preparation method thereof |
06/12/2013 | CN103145954A Anacardol glycidyl ether modified aliphatic amine hardener and preparation method thereof |
06/12/2013 | CN103145953A Anacardol glycidyl ether modified mixed amine hardener and preparation method thereof |
06/12/2013 | CN103145952A Cashew nut shell oil-modified mixed-amine curing agent and preparation method |
06/12/2013 | CN103145951A Viscosity-reduction toughness-increasing and in-situ synthesizing method of low VOC (Volatile Organic Compound) cathode electrophoretic paint resin |
06/12/2013 | CN103145950A Method for curing epoxy resin by utilizing gold nanoparticle photothermal effect |
06/12/2013 | CN103145949A Cristalline epoxy resin |
06/12/2013 | CN103145924A Insulating impregnating resin for drawing groove wedge and its curing method |
06/12/2013 | CN103145646A Sulfur-containing epoxide resin and preparation method thereof |
06/12/2013 | CN102516714B Preparation method of nano epoxy resin composite material |
06/12/2013 | CN102504494B Single-component epoxy resin potting compound and preparation method thereof |
06/12/2013 | CN102399365B Steady state solution of polymer prepared from nitrogen-oxygen heterocyclic compound, preparation method, and use thereof |
06/12/2013 | CN102337005B Resin composition, method of its composition, and cured formulation |
06/12/2013 | CN102304273B Thermosetting epoxy resin composition and epoxy fiberglass cloth-based copper clad laminate prepared from same |
06/12/2013 | CN102209741B Divinylarene dioxide formulations for vacuum resin infusion molding |
06/12/2013 | CN102153729B Semi-enclosed organic amine curing agent and application thereof to anti-corrosive coating |
06/12/2013 | CN102070874B High-permeability and high-strength epoxy grouting material, preparation method thereof and application thereof |
06/12/2013 | CN101484434B Alicyclic diepoxy compound, epoxy resin composition, and cured product |
06/12/2013 | CN101389683B Epoxy resin composition, hardening product thereof, novel epoxy resin, novel phenolic resin and semiconductor sealing material |
06/11/2013 | US8461286 Process for manufacturing liquid epoxy resins |
06/11/2013 | US8461281 Insulating polymer material composition |
06/11/2013 | US8461265 Triblock copolymer having biodegradable polymer blocks and method of producing the same |
06/11/2013 | US8461231 Rapid dry fiberglass stain |
06/11/2013 | US8460855 Composition for forming underlayer coating for litography containing epoxy compound and carboxylic acid compound |
06/11/2013 | CA2683826C Pentacyclic anion salts or tetrazapentalene derivatives and their uses as ionic conducting materials |
06/06/2013 | WO2013082396A1 Epoxy curative composition and compositions therefrom |
06/06/2013 | WO2013081081A1 Insulating material using epoxy resin composition |
06/06/2013 | WO2013081060A1 Epoxy resin composition, prepreg, fiber-reinforced composite material, and method for producing same |
06/06/2013 | WO2013081058A1 Prepreg, fiber-reinforced composite material, method for producing same, and epoxy resin composition |
06/06/2013 | WO2013080936A1 Phenol novolak resin and epoxy resin composition using same |
06/06/2013 | WO2013080741A1 Photopolymerizable composition and pattern forming method using same |
06/06/2013 | WO2013080732A1 One-pack type epoxy resin composition |
06/06/2013 | WO2013079563A1 Dual cure system |
06/06/2013 | WO2013032238A9 Epoxy resin compound and radiant heat circuit board using the same |
06/06/2013 | US20130144015 Epoxy resin adducts and thermosets therefrom |
06/06/2013 | CA2857026A1 Epoxy curative composition and compositions therefrom |
06/06/2013 | CA2856956A1 Dual cure system |
06/05/2013 | EP2599815A1 Polycarboxylic acid condensate, thermosetting resin composition, substrate for mounting semiconductor element and process for producing same, and semiconductor device |
06/05/2013 | EP2599812A1 Curing resin composition, cured product thereof, phenolic resin, epoxy resin, and semiconductor sealing material |
06/05/2013 | CN103140800A Novel photosensitive resin composition production kit, and use thereof |
06/05/2013 | CN103140538A Thermosetting resin composition, thermosetting products thereof, phenol resin, epoxy resin, and semiconductor sealing material |
06/05/2013 | CN103140537A Resin composition, cured resin product, wiring board, and manufacturing method for wiring board |
06/05/2013 | CN103140536A Epoxy resin composition, prepreg and fiber enforced complex material |
06/05/2013 | CN103140535A Epoxy resin of low leachability and partially esterified epoxy resin thereof, production method therefor, and curable resin composition comprising same |
06/05/2013 | CN103140534A Coating compositions |
06/05/2013 | CN103140533A Epoxy resin compositions |
06/05/2013 | CN103140532A Epoxy resin adducts and thermosets thereof |
06/05/2013 | CN103140531A Process for preparing epoxy resins |
06/05/2013 | CN103140523A Polyhydric hydroxy resin, epoxy resin, production method therefor, epoxy resin composition and cured product thereof |
06/05/2013 | CN103131136A Formula and preparation method of high-molecular LED (Light Emitting Diode) radiation material |
06/05/2013 | CN103131132A Hot solidification type component used for filling printed circuit board punched hole |
06/05/2013 | CN103131130A Epoxy resin composition and low dielectric constant insulating material employing same |
06/05/2013 | CN103130984A Epoxy resin modified acrylic resin and preparation method thereof |
06/05/2013 | CN103130983A Environment-friendly plate material compounded by organic silicon modified epoxy resin and waste circuit board non-metallic powder |
06/05/2013 | CN103130982A Composite method and solidifying method of fluorine-containing high temperature resisting organosilicon epoxy resin |
06/05/2013 | CN103130971A Novel benzaldehyde novolac resin, preparation method thereof and epoxy resin prepared by same |
06/05/2013 | CN103130964A Solvent-free impregnating resin for low voltage motor and medium voltage motor and solidification method |
06/05/2013 | CN102408675B Epoxy resin crack filling material and preparation method thereof |
06/05/2013 | CN102307924B Homogeneous bismaleimide - triazine - epoxy compositions useful for the manufacture of electrical laminates |
06/05/2013 | CN102292372B Method of separating solid salt from epoxy resin solutions |
06/05/2013 | CN102286139B Toughened epoxy resin composition containing dicyclopentadiene ester ring structure |
06/05/2013 | CN101962436B High-temperature-resistant modified polyfunctional epoxy matrix resin for advanced composite material and preparation thereof |
06/05/2013 | CN101920597B Liquid discharge head and method for manufacturing the same |
06/05/2013 | CN101910275B Additive for polymerizable composition, polymerizable composition containing the same, and use of the polymerizable composition |
06/05/2013 | CN101809056B Epoxy resin composition, cured object obtained therefrom, and light-emitting diode |
06/05/2013 | CN101613458B Method for preparing bisphenol-A liquid epoxy resin |
06/04/2013 | US8455573 Curable composition comprising imidazolium monocarboxylate salt |
06/04/2013 | US8455061 Optically active compound having polymerizable group and its polymer |
06/04/2013 | US8454815 Plating bath and method |
05/30/2013 | WO2013077365A1 Resin composition for display substrates |
05/30/2013 | WO2013077364A1 Resin composition for display substrates |
05/30/2013 | WO2013077351A1 Epoxy resin mixture, epoxy resin composition, prepreg, and cured products thereof |
05/30/2013 | WO2013075938A1 Curable polyisocyanate composition comprising an epoxy resin |
05/30/2013 | WO2013043363A3 Epoxy-functional resin compositions |
05/30/2013 | CA2854689A1 Curable polyisocyanate composition comprising an epoxy resin |
05/29/2013 | CN103124758A Advanced poly epoxy ester resin compositions |