Patents
Sitemap › H05 - Electric techniques not otherwise provided for › H05K - Printed circuits; Casings or constructional details of electric apparatus; Manufacture of assemblages of electrical components › H05K 3 - Apparatus or processes for manufacturing printed circuits
Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
03/2014
03/20/2014WO2014041709A1 Circuit device manufacturing method, semiconductor component mounting structure, and circuit device
03/20/2014WO2014041697A1 Embedded component substrate and method for manufacturing same
03/20/2014WO2014041696A1 Embedded-component substrate and method for manufacturing same
03/20/2014WO2014041665A1 Printed board design verification system, printed board design verification method, and recording medium
03/20/2014WO2014041659A1 Method for manufacturing embedded component substrate
03/20/2014WO2014041628A1 Component-embedded substrate and method for producing same
03/20/2014WO2014041627A1 Component-embedded substrate manufacturing method
03/20/2014WO2014041602A1 Method for manufacturing substrate with built-in component and substrate with built-in component using same
03/20/2014WO2014041601A1 Method for manufacturing embedded component substrate, and embedded component substrate manufactured using this method
03/20/2014WO2014041057A1 Method for producing a coil integrated in a substrate or applied to a substrate, and electronic device
03/20/2014WO2014013463A3 Method of soldering an electronic component with a high lateral accuracy
03/20/2014WO2014005572A3 Electric component support with a self-sealing contact
03/20/2014WO2014005571A3 Electric component support for a motor vehicle and production thereof
03/20/2014US20140080133 Thermally controlled chamber with optical access for high-performance pcr
03/20/2014US20140079596 Fiberglass Dielectric Barrier Ionization Discharge Device
03/20/2014US20140079405 Overmoulding method and overmoulded electronic device
03/20/2014US20140078703 Printed Circuit Board and Method for Manufacturing the Same
03/20/2014US20140078699 Foldable Machines
03/20/2014US20140078690 Reconfigurable stretchable connector substrate
03/20/2014US20140078687 Device mounting board, semiconductor module, and method for fabricating the device mounting board
03/20/2014US20140078416 Transparent conductive polymer electrode formed by inkjet printing, display device including the electrode, and method of manufacturing the electrode
03/20/2014US20140078190 Display-driving structure and signal transmission method thereof and manufacturing method thereof
03/20/2014US20140076844 Method for Making a Biocompatible Hermetic Housing Including Hermetic Electrical Feedthroughs
03/20/2014US20140076623 Printed circuit board and method for manufacturing the same
03/20/2014US20140076619 Method for removing seed layer in manufacturing printed circuit board and printed circuit board manufactured by using the same
03/20/2014US20140076618 Method of forming gold thin film and printed circuit board
03/20/2014US20140076617 Passive Devices in Package-on-Package Structures and Methods for Forming the Same
03/20/2014US20140076613 Method of Electrophoretic Depositing (EPD) a Film on a System and System Thereof
03/20/2014US20140076611 Printed circuit board and method of manufacturing the same
03/20/2014US20140076610 Planarizing printed electronic device and method for manufacturing the same
03/20/2014US20140076489 Method for manufacturing touch panel
03/20/2014US20140076478 Plated Through Hole Void Detection in Printed Circuit Boards by Detecting A pH-Sensitive Component
03/20/2014US20140076461 Solution and process for the pre-treatment of copper surfaces using an n-alkoxylated adhesion-promoting compound
03/20/2014US20140075749 Implementing high-speed signaling via dedicated printed circuit-board media
03/20/2014US20140075747 Connecting component equipped with hollow inserts
03/20/2014DE112012002711T5 Siebdruckvorrichtung und Bilderkennungsverfahren in der Siebdruckvorrichtung Screen printing apparatus and image recognition methods in the screen printing apparatus
03/20/2014DE102012216926A1 Verfahren zur Herstellung eines Leiterplattenelements sowie Leiterplattenelement A process for producing a printed circuit board member and board member
03/20/2014DE102012216790A1 Kontaktanordnung für einen mehrlagigen Schaltungsträger und Verfahren zum Kontaktieren eines mehrlagigen Schaltungsträgers Contact arrangement for a multi-layer circuit substrate and method for contacting a multi-layer circuit substrate
03/20/2014DE102012216785A1 Kontaktanordnung für einen mehrlagigen Schaltungsträger und Verfahren zum Kontaktieren eines mehrlagigen Schaltungsträgers Contact arrangement for a multi-layer circuit substrate and method for contacting a multi-layer circuit substrate
03/20/2014DE102012108770A1 Elektronische Baugruppe mit einem räumlichen spritzgegossenen elektronischen Schaltungsträger Electronic assembly with a spatial molded electronic circuit board
03/20/2014DE102012018583A1 Verfahren und Vorrichtung zum Drucken von funktionalen Schichten für elektronische Bauteile Method and apparatus for printing of functional layers for electronic components
03/20/2014DE102008035056B4 Verfahren zur Herstellung einer Lötkontaktvorrichtung A process for preparing a Lötkontaktvorrichtung
03/19/2014EP2709430A1 Substrate structure, method of mounting semiconductor chip, and solid state realy
03/19/2014EP2709208A1 Antenna and communication apparatus as well as manufacturing method for antenna
03/19/2014EP2708099A1 Spring-to-board i/o-connector assembly, members thereof and board provided therewith
03/19/2014EP2708098A1 Load control device having an electrically isolated antenna
03/19/2014CN203492278U Welding tool for electronic components
03/19/2014CN203492277U Shifting mechanism of PCB electroless plating copper hanging basket
03/19/2014CN203492276U Circuit board punching fixed mount
03/19/2014CN203492275U connecting structure
03/19/2014CN203492274U Processing template special for I9200-type cellphone FPCB (flexible printed circuit board)
03/19/2014CN203492273U Special template for manufacturing 9500-type cellphone FPCB (flexible printed circuit board)
03/19/2014CN203492272U Processing template special for I9195-type cellphone FPCB (flexible printed circuit board)
03/19/2014CN203492271U Processing template special for I337-type cellphone FPCB (flexible printed circuit board)
03/19/2014CN203492270U Etching drying all-in-one machine of PCB
03/19/2014CN203492269U Baking box of PCB
03/19/2014CN203487264U Single-arm travelling crane
03/19/2014CN203487236U Inclined type circuit board chemical nickel immersion gold hanging basket
03/19/2014CN203484770U Harness welding auxiliary jig
03/19/2014CN103650657A 电子元件安装系统 An electronic component mounting system
03/19/2014CN103650653A Wiring board
03/19/2014CN103650652A The printed circuit board and the method for manufacturing the same
03/19/2014CN103650651A Flexible multilayer substrate
03/19/2014CN103650650A Method for manufacturing printed circuit board
03/19/2014CN103650649A Adhesive film, multilayer printed wiring board using adhesive film, and method for manufacturing multilayer printed wiring board
03/19/2014CN103650648A Multilayer ceramic substrate and manufacturing method therefor
03/19/2014CN103650647A Method for producing heat-dissipating multilayer material for mounting boards
03/19/2014CN103649832A Process for the production of a layered body and layered bodies obtainable therefrom
03/19/2014CN103649373A Etching liquid for copper or compound having copper as primary component
03/19/2014CN103649174A Cross-linked polyimide resin and method for producing same, adhesive resin composition and cured product thereof, cover lay film, circuit board, heat-conductive substrate, and heat-conductive polyimide film
03/19/2014CN103648779A Screen-printing system for a photovoltaic cell, and related methods
03/19/2014CN103648700A Device and method for reflow soldering
03/19/2014CN103648243A Method for preparing multilayer board in additive mode
03/19/2014CN103648242A Vacuum glue filling method of blind buried hole with high aspect ratio
03/19/2014CN103648241A Internal-arranged lead manufacturing technology of long and short printed plug circuit board
03/19/2014CN103648240A Method for manufacturing symmetrical rigid-flexible printed circuit board
03/19/2014CN103648239A Wave soldering production line with coating travel of soldering flux automatically adjustable based on width of PCB (Printed Circuit Board)
03/19/2014CN103648238A FPC irregularity positioning hot press
03/19/2014CN103648237A FPC appearance precision positioning mobile carrying platform
03/19/2014CN103648236A Method for improving PCB (Printed Circuit Board) metal binding local windowing
03/19/2014CN103648235A Manufacturing method of aluminum-based circuit board
03/19/2014CN103648234A Thin plate V groove manufacturing technology
03/19/2014CN103648233A Electronic circuit module and manufacturing method thereof
03/19/2014CN103643272A Device and method for vertically, continuously and straightly loading PCB (printed circuit board) electroplating thick plate
03/19/2014CN102821547B Fixing method for double-faced circuit board machining process
03/19/2014CN102523680B Organic solderability preservative (OSP) on surface of printed circuit board and presoaking stock and method for manufacturing OSP
03/19/2014CN102458052B Reinforcing and gluing method of flexible circuit board
03/19/2014CN102415226B Multilayer printed circuit board manufacture method
03/19/2014CN102342189B Chip component mounting structure, chip component mounting method and liquid crystal display device
03/19/2014CN102342187B Coverlay film, method for manufacturing coverlay film, and flexible printed wiring board
03/19/2014CN102037614B 粘接材料卷轴 Bonding-material reel
03/19/2014CN101686635B Electronic component mounting system and method
03/18/2014US8674236 Wiring substrate and method of manufacturing the same
03/18/2014US8674235 Microelectronic substrate for alternate package functionality
03/18/2014US8673391 Method of manufacturing a circuit board
03/18/2014US8671563 Method for printing a conductive pattern
03/18/2014US8671562 Method for manufacturing a circuit board
03/18/2014US8671561 Substrate manufacturing method
03/18/2014US8671560 In system reflow of low temperature eutectic bond balls
03/17/2014DE202014001330U1 Befestigungselement zur Festlegung zweier Bauteile aneinander Fastener for fixing two components together
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