Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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04/02/2014 | CN103700619A Copper interconnection electroplating filling method |
04/02/2014 | CN103695974A Circuit board of copper-bearing metal composite layer |
04/02/2014 | CN102970835B Manufacturing method for blind hole on high density interconnect (HDI) circuit board |
04/02/2014 | CN102796487B Adhesive composition, circuit connecting material, connection structure of circuit member, and semiconductor device |
04/02/2014 | CN102573329B Method for fabricating conductive column of circuit board, system and circuit board |
04/02/2014 | CN102448251B Multilayer single-face aluminum-based circuit board and manufacturing method thereof |
04/02/2014 | CN102438413B Second-order ladder groove bottom graphical printed board and processing method thereof |
04/02/2014 | CN102427682B Method for manufacturing gold finger circuit board |
04/02/2014 | CN102361532B Multilayer printed circuit board and manufacturing process thereof |
04/02/2014 | CN102340929B Single-sided circuit board made by respectively hot-pressing insulating layers on two sides of flat wires |
04/02/2014 | CN102291974B Cutting side positioning type welding structure and method for preventing pins from shifting |
04/02/2014 | CN101717613B High-temperature resistant copper foil glue and preparation and application thereof |
04/02/2014 | CN101684190B Composition for forming layer to be plated, method of producing metal pattern material, metal pattern material |
04/02/2014 | CN101384136B Surface mounting process for flexible circuit board and used magnetic tool and steel mesh |
04/01/2014 | US8686826 Surface mountable PPTC device with integral weld plate |
04/01/2014 | US8686572 Apparatus for stacking integrated circuits |
04/01/2014 | US8686313 System and methods for forming apertures in microfeature workpieces |
04/01/2014 | US8686299 Electronic element unit and reinforcing adhesive agent |
04/01/2014 | US8685529 Surface coating for electronic systems |
04/01/2014 | US8685221 Enhanced electrochemical deposition filling |
04/01/2014 | US8683684 Method of manufacturing component embedded printed circuit board |
04/01/2014 | US8683683 Method for positioning and mounting an LED assembly as well as a positioning body for this purpose |
04/01/2014 | US8683682 Method for the production of a metal-ceramic substrate |
04/01/2014 | CA2652107C Solder void reduction on circuit boards |
03/27/2014 | WO2014046921A1 Dispensing machine automatically dispensing fluid to predetermined locations |
03/27/2014 | WO2014046536A1 Atmospheric plasma sintering |
03/27/2014 | WO2014046387A1 Solder paste supply device |
03/27/2014 | WO2014046323A1 Package module and manufacturing method thereof |
03/27/2014 | WO2014046291A1 Metallic foil having carrier, layered product comprising resin sheet-shaped carrier and metallic foil, and uses for same |
03/27/2014 | WO2014046259A1 Metallic foil having carrier |
03/27/2014 | WO2014046256A1 Metallic foil having carrier |
03/27/2014 | WO2014046167A1 Double-sided adhesive sheet for electronic part |
03/27/2014 | WO2014046150A1 Photocurable composition and method of manufacturing film using the composition |
03/27/2014 | WO2014046128A1 Adhesive for electronic components and method for producing semiconductor chip mounter |
03/27/2014 | WO2014046089A1 Method for producing connection structure and anisotropic conductive adhesive |
03/27/2014 | WO2014046074A1 Wiring board and wiring board production method |
03/27/2014 | WO2014046014A1 Circuit board and method for manufacturing same |
03/27/2014 | WO2014045862A1 Flexible multilayer substrate |
03/27/2014 | WO2014045792A1 Circuit substrate and electronic device |
03/27/2014 | WO2014045775A1 Substrate with embedded circuit and composite module |
03/27/2014 | WO2014045721A1 Wiring board and wiring board manufacturing method |
03/27/2014 | WO2014045491A1 Wiring board and method for manufacturing same |
03/27/2014 | WO2014045436A1 Viscous fluid-supplying device and viscous fluid-supplying method |
03/27/2014 | WO2014045370A1 Work machine for printed circuit boards and mounting method |
03/27/2014 | WO2014045088A1 A method for making partially metallized precision synthetic thread square mesh fabrics for aesthetic or marking applications |
03/27/2014 | WO2014044918A1 Versatile and reliable intelligent package |
03/27/2014 | WO2014044515A1 Method for producing a circuit board element, and circuit board element |
03/27/2014 | WO2014044448A1 Contact arrangement for a multi-layer circuit carrier and method for contacting a multi-layer circuit carrier |
03/27/2014 | WO2014044447A1 Contact arrangement for a multi-layer circuit carrier and method for contacting a multi-layer circuit carrier |
03/27/2014 | US20140087586 Securing opposing components to a circuit board |
03/27/2014 | US20140087063 Method for manufacturing ion optical device |
03/27/2014 | US20140085994 Integrated circuitry, chip, method for testing a memory device, method for manufacturing an integrated circuit and method for manufacturing a chip |
03/27/2014 | US20140085857 Electronic module and method for same |
03/27/2014 | US20140085854 Circuit board incorporating semiconductor ic and manufacturing method thereof |
03/27/2014 | US20140085851 Small form factor stacked electrical passive devices that reduce the distance to the ground plane |
03/27/2014 | US20140085850 Printed circuit board with compact groups of devices |
03/27/2014 | US20140085845 Thick-film hybrid circuit structure and method of manufacture the same |
03/27/2014 | US20140085843 Method for producing multi-layer substrate and multi-layer substrate |
03/27/2014 | US20140085840 Electronic circuit and method of fabricating the same |
03/27/2014 | US20140085833 Chip packaging substrate, method for manufacturing same, and chip packaging structure having same |
03/27/2014 | US20140085317 Transparent multi-layer structure with transparent electrical routing |
03/27/2014 | US20140085072 Led strobe light |
03/27/2014 | US20140085031 Planar litz wire coil and method of making same |
03/27/2014 | US20140084956 Probe head test fixture and method of using the same |
03/27/2014 | US20140083858 Heterogeneous integration of microfluidic devices in package structures |
03/27/2014 | US20140083757 Printed circuit board and method for manufacturing same |
03/27/2014 | US20140083754 Blind via printed circuit board fabrication supporting press fit connectors |
03/27/2014 | US20140083753 Method of forming copper wiring, method of manufacturing wiring board, and wiring board |
03/27/2014 | US20140083750 Raw glass plate for manufacturing touch panel and method of manufacturing touch panel using raw glass plate |
03/27/2014 | US20140083748 Conductive pattern formation |
03/27/2014 | US20140083747 Printed wiring board and method for manufacturing printed wiring board |
03/27/2014 | US20140083746 Printed wiring board and method for manufacturing printed wiring board |
03/27/2014 | US20140083744 Printed circuit board and method for manufacturing same |
03/27/2014 | US20140083743 Manufacturing method for printed circuit board |
03/27/2014 | US20140083359 Screen printing machine |
03/27/2014 | US20140082937 Method of manufacturing rigid flexible printed circuit board |
03/27/2014 | DE102012019573A1 Druckvorrichtung, Drucksystem, Verfahren A printing apparatus, printing system, method |
03/27/2014 | DE102009004346B4 Adapter zur Montage von ein- und mehrpoligen Überspannungsschutzgeräten Adapter for mounting of single and multi-pole surge protection devices |
03/27/2014 | DE102006037070B4 Verfahren zur Herstellung einer Platine A process for producing a printed circuit board |
03/26/2014 | EP2712284A1 Method for producing transparent printed wiring board, and method for producing transparent touch panel |
03/26/2014 | EP2712281A1 Wiring substrate, multi-pattern wiring substrate, and manufacturing method therefor |
03/26/2014 | EP2711972A1 Method for manufacturing pattern structure |
03/26/2014 | EP2711971A1 Method for producing a structured thin film |
03/26/2014 | EP2711399A1 Thermoplastic resin composition, resin molding product, and method for producing resin molding product having plating layer |
03/26/2014 | EP2711184A1 Printing device |
03/26/2014 | EP2711183A1 Printing apparatus, printing system, method |
03/26/2014 | EP2710864A1 Circuit carrier |
03/26/2014 | EP2710630A1 Method and device for transporting solder spheres |
03/26/2014 | EP2709851A1 Resin composition for laser direct structuring, resin-molded article, and method for manufacturing molded article with plated layer |
03/26/2014 | CN203504893U Position adjusting mechanism of chip mounter vacuum drinking straw assembly |
03/26/2014 | CN203504892U Tin-guiding template |
03/26/2014 | CN203504891U Material gripping mechanism of high speed chip mounter |
03/26/2014 | CN203504890U Magnetic printing jig of FPC circuit board |
03/26/2014 | CN203504889U Nail bed applicable to printed circuit boards |
03/26/2014 | CN203504888U Impedance controlling apparatus of PCB batch production plate |
03/26/2014 | CN203504887U Automatic reinforcing machine |
03/26/2014 | CN203504886U Metal mask plate screw sleeve fixing structure |
03/26/2014 | CN203504885U Flexible circuit board outline punching mould |
03/26/2014 | CN203495371U Tin paste temperature returning device |
03/26/2014 | CN103688607A Novel conductive layer integrated flexible printed circuit (FPC)f |