Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
04/2014
04/02/2014CN103700619A Copper interconnection electroplating filling method
04/02/2014CN103695974A Circuit board of copper-bearing metal composite layer
04/02/2014CN102970835B Manufacturing method for blind hole on high density interconnect (HDI) circuit board
04/02/2014CN102796487B Adhesive composition, circuit connecting material, connection structure of circuit member, and semiconductor device
04/02/2014CN102573329B Method for fabricating conductive column of circuit board, system and circuit board
04/02/2014CN102448251B Multilayer single-face aluminum-based circuit board and manufacturing method thereof
04/02/2014CN102438413B Second-order ladder groove bottom graphical printed board and processing method thereof
04/02/2014CN102427682B Method for manufacturing gold finger circuit board
04/02/2014CN102361532B Multilayer printed circuit board and manufacturing process thereof
04/02/2014CN102340929B Single-sided circuit board made by respectively hot-pressing insulating layers on two sides of flat wires
04/02/2014CN102291974B Cutting side positioning type welding structure and method for preventing pins from shifting
04/02/2014CN101717613B High-temperature resistant copper foil glue and preparation and application thereof
04/02/2014CN101684190B Composition for forming layer to be plated, method of producing metal pattern material, metal pattern material
04/02/2014CN101384136B Surface mounting process for flexible circuit board and used magnetic tool and steel mesh
04/01/2014US8686826 Surface mountable PPTC device with integral weld plate
04/01/2014US8686572 Apparatus for stacking integrated circuits
04/01/2014US8686313 System and methods for forming apertures in microfeature workpieces
04/01/2014US8686299 Electronic element unit and reinforcing adhesive agent
04/01/2014US8685529 Surface coating for electronic systems
04/01/2014US8685221 Enhanced electrochemical deposition filling
04/01/2014US8683684 Method of manufacturing component embedded printed circuit board
04/01/2014US8683683 Method for positioning and mounting an LED assembly as well as a positioning body for this purpose
04/01/2014US8683682 Method for the production of a metal-ceramic substrate
04/01/2014CA2652107C Solder void reduction on circuit boards
03/2014
03/27/2014WO2014046921A1 Dispensing machine automatically dispensing fluid to predetermined locations
03/27/2014WO2014046536A1 Atmospheric plasma sintering
03/27/2014WO2014046387A1 Solder paste supply device
03/27/2014WO2014046323A1 Package module and manufacturing method thereof
03/27/2014WO2014046291A1 Metallic foil having carrier, layered product comprising resin sheet-shaped carrier and metallic foil, and uses for same
03/27/2014WO2014046259A1 Metallic foil having carrier
03/27/2014WO2014046256A1 Metallic foil having carrier
03/27/2014WO2014046167A1 Double-sided adhesive sheet for electronic part
03/27/2014WO2014046150A1 Photocurable composition and method of manufacturing film using the composition
03/27/2014WO2014046128A1 Adhesive for electronic components and method for producing semiconductor chip mounter
03/27/2014WO2014046089A1 Method for producing connection structure and anisotropic conductive adhesive
03/27/2014WO2014046074A1 Wiring board and wiring board production method
03/27/2014WO2014046014A1 Circuit board and method for manufacturing same
03/27/2014WO2014045862A1 Flexible multilayer substrate
03/27/2014WO2014045792A1 Circuit substrate and electronic device
03/27/2014WO2014045775A1 Substrate with embedded circuit and composite module
03/27/2014WO2014045721A1 Wiring board and wiring board manufacturing method
03/27/2014WO2014045491A1 Wiring board and method for manufacturing same
03/27/2014WO2014045436A1 Viscous fluid-supplying device and viscous fluid-supplying method
03/27/2014WO2014045370A1 Work machine for printed circuit boards and mounting method
03/27/2014WO2014045088A1 A method for making partially metallized precision synthetic thread square mesh fabrics for aesthetic or marking applications
03/27/2014WO2014044918A1 Versatile and reliable intelligent package
03/27/2014WO2014044515A1 Method for producing a circuit board element, and circuit board element
03/27/2014WO2014044448A1 Contact arrangement for a multi-layer circuit carrier and method for contacting a multi-layer circuit carrier
03/27/2014WO2014044447A1 Contact arrangement for a multi-layer circuit carrier and method for contacting a multi-layer circuit carrier
03/27/2014US20140087586 Securing opposing components to a circuit board
03/27/2014US20140087063 Method for manufacturing ion optical device
03/27/2014US20140085994 Integrated circuitry, chip, method for testing a memory device, method for manufacturing an integrated circuit and method for manufacturing a chip
03/27/2014US20140085857 Electronic module and method for same
03/27/2014US20140085854 Circuit board incorporating semiconductor ic and manufacturing method thereof
03/27/2014US20140085851 Small form factor stacked electrical passive devices that reduce the distance to the ground plane
03/27/2014US20140085850 Printed circuit board with compact groups of devices
03/27/2014US20140085845 Thick-film hybrid circuit structure and method of manufacture the same
03/27/2014US20140085843 Method for producing multi-layer substrate and multi-layer substrate
03/27/2014US20140085840 Electronic circuit and method of fabricating the same
03/27/2014US20140085833 Chip packaging substrate, method for manufacturing same, and chip packaging structure having same
03/27/2014US20140085317 Transparent multi-layer structure with transparent electrical routing
03/27/2014US20140085072 Led strobe light
03/27/2014US20140085031 Planar litz wire coil and method of making same
03/27/2014US20140084956 Probe head test fixture and method of using the same
03/27/2014US20140083858 Heterogeneous integration of microfluidic devices in package structures
03/27/2014US20140083757 Printed circuit board and method for manufacturing same
03/27/2014US20140083754 Blind via printed circuit board fabrication supporting press fit connectors
03/27/2014US20140083753 Method of forming copper wiring, method of manufacturing wiring board, and wiring board
03/27/2014US20140083750 Raw glass plate for manufacturing touch panel and method of manufacturing touch panel using raw glass plate
03/27/2014US20140083748 Conductive pattern formation
03/27/2014US20140083747 Printed wiring board and method for manufacturing printed wiring board
03/27/2014US20140083746 Printed wiring board and method for manufacturing printed wiring board
03/27/2014US20140083744 Printed circuit board and method for manufacturing same
03/27/2014US20140083743 Manufacturing method for printed circuit board
03/27/2014US20140083359 Screen printing machine
03/27/2014US20140082937 Method of manufacturing rigid flexible printed circuit board
03/27/2014DE102012019573A1 Druckvorrichtung, Drucksystem, Verfahren A printing apparatus, printing system, method
03/27/2014DE102009004346B4 Adapter zur Montage von ein- und mehrpoligen Überspannungsschutzgeräten Adapter for mounting of single and multi-pole surge protection devices
03/27/2014DE102006037070B4 Verfahren zur Herstellung einer Platine A process for producing a printed circuit board
03/26/2014EP2712284A1 Method for producing transparent printed wiring board, and method for producing transparent touch panel
03/26/2014EP2712281A1 Wiring substrate, multi-pattern wiring substrate, and manufacturing method therefor
03/26/2014EP2711972A1 Method for manufacturing pattern structure
03/26/2014EP2711971A1 Method for producing a structured thin film
03/26/2014EP2711399A1 Thermoplastic resin composition, resin molding product, and method for producing resin molding product having plating layer
03/26/2014EP2711184A1 Printing device
03/26/2014EP2711183A1 Printing apparatus, printing system, method
03/26/2014EP2710864A1 Circuit carrier
03/26/2014EP2710630A1 Method and device for transporting solder spheres
03/26/2014EP2709851A1 Resin composition for laser direct structuring, resin-molded article, and method for manufacturing molded article with plated layer
03/26/2014CN203504893U Position adjusting mechanism of chip mounter vacuum drinking straw assembly
03/26/2014CN203504892U Tin-guiding template
03/26/2014CN203504891U Material gripping mechanism of high speed chip mounter
03/26/2014CN203504890U Magnetic printing jig of FPC circuit board
03/26/2014CN203504889U Nail bed applicable to printed circuit boards
03/26/2014CN203504888U Impedance controlling apparatus of PCB batch production plate
03/26/2014CN203504887U Automatic reinforcing machine
03/26/2014CN203504886U Metal mask plate screw sleeve fixing structure
03/26/2014CN203504885U Flexible circuit board outline punching mould
03/26/2014CN203495371U Tin paste temperature returning device
03/26/2014CN103688607A Novel conductive layer integrated flexible printed circuit (FPC)f
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