Patents
Sitemap › H05 - Electric techniques not otherwise provided for › H05K - Printed circuits; Casings or constructional details of electric apparatus; Manufacture of assemblages of electrical components › H05K 3 - Apparatus or processes for manufacturing printed circuits
Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
12/2014
12/24/2014CN204046959U 一种简易的锡膏先进先出防呆装置 A simple paste FIFO Goggles
12/24/2014CN204046958U 电路板刷锡简易工装 Simple tin circuit scrubbing clothes
12/24/2014CN204046957U 电源模块限高治具 Power Module fixture height limit
12/24/2014CN204046956U 一种引脚装配模具 One kind of pin assembly mold
12/24/2014CN204046955U 一种贴片机的供料装置 A patch machine feeding device
12/24/2014CN204046954U 一种防止贴装元件在贴片机上产生反片的工装结构 Prevent a counter-mount components on a chip placement machine tooling structure
12/24/2014CN204046953U 一种用于贴片机的吸嘴结构 A nozzle structure for placement machine
12/24/2014CN204046952U 表面贴装用治具 Surface mount fixture with
12/24/2014CN204046951U Led贴片机基座结构 Led Mounter base structure
12/24/2014CN204046950U 蝶装物料的固定装置及贴片机 Fixtures and equipment materials Mounter butterfly
12/24/2014CN204046949U Pcb湿制程水平机组的机体结构 Body structure Pcb wet process unit level
12/24/2014CN204046948U 一种高阶高密度电路板蚀刻装置 One kind of high-order high-density circuit board etching equipment
12/24/2014CN204046947U 一种多功能数控电路板刻制机中控装置 A multifunctional CNC circuit board engraving machine control device
12/24/2014CN204046946U 一种电动批量生产式pcb板基层材料加工塔 An electric production type pcb board base material processing tower
12/24/2014CN204046945U 通电铜柱 Powered Tongzhu
12/24/2014CN204046944U 一种线路板的定位保护板 A circuit board positioning protection board
12/24/2014CN204046943U 软性电路板贴片治具 SMD flexible circuit board fixture
12/24/2014CN204046942U 柔性电路板的装载结构 Load structure of the flexible circuit board
12/24/2014CN204046941U 一种用于柔性电路板的胶片自动贴敷设备 A flexible circuit board of the automatic film sticking apparatus
12/24/2014CN204046939U 具有电路板的电子单元 A circuit board having electronic unit
12/24/2014CN204046938U 一种pcb板以及压接装置 One kind pcb board and crimping device
12/24/2014CN204044638U 一种挠性线路板药液添加装置 A flexible circuit board liquid adding device
12/24/2014CN204039507U 湿制程系统 Wet process systems
12/24/2014CN104247584A 印刷电路板及其制造方法 A printed circuit board and manufacturing method thereof
12/24/2014CN104247583A 多层配线基板及其制造方法以及探针卡 Multilayer wiring board and its manufacturing method, and a probe card
12/24/2014CN104247582A 印刷电路板及其制造方法 A printed circuit board and manufacturing method thereof
12/24/2014CN104247581A 表面安装基板 Surface mount base
12/24/2014CN104247580A 机器人系统 Robot system
12/24/2014CN104247579A 光伏背板的激光图案化 PV backplane laser patterning
12/24/2014CN104247578A 电路板组件 Circuit board assembly
12/24/2014CN104247576A 2层挠性配线用基板及挠性配线板及其制造方法 2 layer flexible wiring substrate and flexible wiring board and its manufacturing method
12/24/2014CN104246997A 安装结构体及其制造方法 Mounting structure and manufacturing method thereof
12/24/2014CN104246615A 无掩模曝光装置 Maskless exposure device
12/24/2014CN104246523A 绝缘检查方法以及绝缘检查装置 Insulation inspection methods and insulation inspection device
12/24/2014CN104245554A 箔片加工装置 Foil processing device
12/24/2014CN104245317A 丝网印刷装备的补正方法及利用该方法的基板检测系统 Correction method and screen printing equipment, the method utilizing the detection system of the substrate
12/24/2014CN104245256A 钻孔用盖板及钻孔方法 Drilling and drilling methods cover
12/24/2014CN104245203A 接合方法、电子装置的制造方法和电子部件 Bonding method, and a method of manufacturing the electronic component of the electronic device
12/24/2014CN104245192A 抑制金属纳米颗粒具有氧化膜的合成方法及经由经处理的溶液制作导电性金属薄膜的方法 Method of inhibiting the synthesis of metal nanoparticles having an oxide film and the solution was treated by the production of a conductive metal thin film method
12/24/2014CN104244694A 表面贴装固定组件组 Fixed surface mount component group
12/24/2014CN104244616A 一种无芯板薄型基板的制作方法 No method of making a thin core substrate
12/24/2014CN104244615A 一种在pcb上制作多层阻焊层的方法 A method for making a solder resist layer in the multilayer method on pcb
12/24/2014CN104244614A 多层电路板及其制作方法 Multi-layer circuit board and its manufacturing method
12/24/2014CN104244613A 一种hdi板中金属化孔的制作方法 Production method hdi board metallized holes
12/24/2014CN104244612A 一种在ptfe电路板上制作金属化孔的方法 A method of making a circuit board in ptfe metalized holes
12/24/2014CN104244611A 一种复合基板微盲孔孔壁的凹蚀方法 A composite substrate micro-blind hole wall undercutting method
12/24/2014CN104244610A 一种降低connector过孔影响的设计方法 A connector vias method for reducing the impact of design
12/24/2014CN104244609A 基材双面塞孔装置 Substrate double-sided jack device
12/24/2014CN104244608A 一种具有钢质镀金插针组的电路板插接系统 Steel pins having a gold-plated circuit board connector system for group
12/24/2014CN104244607A 一种屏蔽模具的制备方法 A process for preparing a mold of shield
12/24/2014CN104244606A 全自动贴片机在贴片过程中自动拾取散装元器件的方法 Automatic placement machine automatically picks up the bulk components in the placement process method
12/24/2014CN104244605A 一种提高smt贴片生产效率和设备使用率的方法 An smt chip production efficiency and equipment utilization methods to improve
12/24/2014CN104244604A Smt贴片机 Smt Mounter
12/24/2014CN104244603A 部件内置型布线基板的制造方法及半导体装置 Method of manufacturing a component built-in wiring board and semiconductor device
12/24/2014CN104244602A 一种印制板镀铜除去环氧钻污的方法 Epoxy Smear method for removing copper PCB
12/24/2014CN104244601A 一种去钻污的方法 One kind of method Desmear
12/24/2014CN104244600A 一种笔记本电脑用柔性线路板板面平整度工艺 One kind of laptop with flexible circuit plate board surface flatness process
12/24/2014CN104244599A 印刷电路板的制作方法 The method of making a printed circuit board
12/24/2014CN104244598A 一种控制pcb上传输线的阻抗连续性的方法和装置 A method of controlling the continuity of the impedance of the transmission line on the pcb and means
12/24/2014CN104244597A 一种对称结构的无芯基板的制备方法 A process for preparing non-symmetrical structure of the core substrate
12/24/2014CN104244596A 一种pcb板的制作工艺 Production process for pcb board
12/24/2014CN104244595A 一种胶内缩补强片的制作方法 Production methods piece of a plastic reinforced inner shrink
12/24/2014CN104244594A 一种规则排版的矩形内缩补强片制作方法 Within a rectangular layout rules reinforcing shrink film production method
12/24/2014CN104244593A 一种规则排版的冲压补强片及其制作方法 A rule of punching reinforcement piece typesetting and production methods
12/24/2014CN104244592A 一种玻璃纤维补强片的制作方法 A method of making a glass fiber-reinforced sheet
12/24/2014CN104244591A 一种规则排布的带圆形孔补强片的制作方法 Reinforcement production methods with a circular piece of a rule arrangement
12/24/2014CN104244590A 电路板外层偏位的控制方法 Control methods board Outer Deviation
12/24/2014CN104244589A 一种提高hdi线路板曝光精度的方法 Hdi board a method for improving the accuracy of exposure
12/24/2014CN104244588A 立体电路的制作方法及改性激光烧结粉末材料 Circuit and method of making three-dimensional laser sintering the powder material modification
12/24/2014CN104244587A 立体电路的制作方法及热固性喷涂溶液 Circuit and method of making three-dimensional thermoset coating solution
12/24/2014CN104244586A 一种卷式ic卡线路板铜箔与基材的固化方法 A method of curing roll ic card board copper foil and the substrate
12/24/2014CN104244585A 一种卷式fpc线路基材与片式覆盖膜贴合的工艺方法 One kind of roll fpc circuit substrate and chip covering film laminating process method
12/24/2014CN104244584A 一种激光钻孔对位方法 A laser drilling method for position
12/24/2014CN104244582A 埋入式高密度互连印刷电路板及其制作方法 Embedded high density interconnect printed circuit board and its production method
12/24/2014CN104244579A 封装基板及其制造方法 Package substrate and manufacturing method thereof
12/24/2014CN104244576A 一种印刷电路板测试点的布局方法及其印刷电路板 A printed circuit board test points of a printed circuit board layout method and
12/24/2014CN104244573A 一种柔性电路板及该柔性线路板回流焊接方法 A flexible circuit board and the flexible circuit board reflow soldering method
12/24/2014CN104244571A 受到防护的印刷电路板岛 By protection of the printed circuit board island
12/24/2014CN104244570A 刚柔性印刷电路板及其制造方法 Rigid printed circuit board and its manufacturing method
12/24/2014CN104244567A 一种多层电路板制作方法及多层电路板 A multi-layer circuit board production methods and multi-layer circuit board
12/24/2014CN104244565A 用于印刷电路板中的增层材及其制法、可内埋元件的印刷电路板 Jiqizhifa by layer material for printed circuit boards can be buried in the printed circuit board components
12/24/2014CN104244564A 立体电路及其制作方法 Three-dimensional circuit and method of making
12/24/2014CN104244563A 电路板结构及其制作方法 Board structure and production methods
12/24/2014CN104241231A 芯片封装基板及其制作方法 Chip package substrate and manufacturing method thereof
12/24/2014CN104240795A 应用耐挠曲导电银浆制备柔性线路板的方法 Methods for preparing conductive silver resistance to deflection of the flexible circuit board
12/24/2014CN104231897A 线路板涂层剂 PCB coating agent
12/24/2014CN104231635A 单组分、无溶剂的有机硅氧烷组合物 One-component, solvent-free organosiloxane composition
12/24/2014CN103174718B 定位销钉、定位销钉的制作方法及电路板压合装置 Positioning pins, the positioning pin and method of manufacturing the circuit board lamination apparatus
12/24/2014CN102883556B 铜块棕化方法 Brown copper block method
12/24/2014CN102883540B 不等厚软硬结合板非真空压膜除气泡方法 Flex PCB thickness ranging from non-vacuum lamination method Bubble
12/24/2014CN102752959B 压合装置 Compression fittings
12/24/2014CN102573333B 制造印刷布线板的方法、印刷布线板和电子设备 The method of manufacturing a printed wiring board, printed wiring board and electronic equipment
12/24/2014CN102482795B 耐热性铜箔及其制备方法、电路板、覆铜箔层压板及其制备方法 Heat resistance of copper and its preparation method, circuit boards, copper clad laminates and its preparation method
12/24/2014CN102480848B 一种导电栅的制造系统和制造方法 A conductive grid manufacturing systems and manufacturing methods
12/24/2014CN102210198B 多片式基板的制造方法 The method of manufacturing a multi-piece substrate
12/24/2014CN102210022B 包括多个封装的半导体芯片的固态驱动器或者其它存储装置 Includes a plurality of encapsulated solid state drive of the semiconductor chip or other memory device
12/24/2014CN101646299B 带电路的悬挂基板、其制造方法及定位方法 Suspension board with the circuit, its manufacturing method and location method
12/23/2014USRE45297 Method for enhancing the solderability of a surface
12/23/2014US8917532 Stub minimization with terminal grids offset from center of package
12/23/2014US8917495 Circuit board production method and circuit board
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