Patents for H05K 1 - Printed circuits (98,583)
05/2006
05/24/2006CN1778154A Connection structure of printed wiring board
05/24/2006CN1778153A Printed wiring board connection structure
05/24/2006CN1778152A Connection structure for printed wiring board
05/24/2006CN1778151A Power delivery apparatus, systems, and methods
05/24/2006CN1778101A Imaging device and mobile terminal using this imaging device
05/24/2006CN1777948A System and method for improving lead wire connection for hard disk driver actuator
05/24/2006CN1777923A Display
05/24/2006CN1777827A Optical waveguide, optoelectric hybrid substrate, and optoelectric hybrid substrate producing method
05/24/2006CN1777826A High-density fiber-optic module with multi-fold flexible circuit
05/24/2006CN1777349A Method for forming wiring pattern, method for manufacturing device, device and electronic equipment
05/24/2006CN1776885A Electronic component and method for manufacturing the same
05/24/2006CN1776842A Dielectric structure
05/24/2006CN1776489A Liquid crystal display device with improved the printed circuit board error quantity
05/24/2006CN1257511C Resistance material and printed circuit board
05/23/2006US7051142 Electronic device with card interface
05/23/2006US7050716 Exposure device
05/23/2006US7050308 Power conditioning module
05/23/2006US7050307 Circuit board orientation in a computer system
05/23/2006US7050303 Semiconductor module with vertically mounted semiconductor chip packages
05/23/2006US7050285 Surge protector assembly with ground-connector status indicator circuitry
05/23/2006US7050284 Component carrier
05/23/2006US7049743 Plant cultivating method, cultivating device, and its lighting device
05/23/2006US7049742 Method and structure for substrate having inserted electrodes for flat display device and the device using the structure
05/23/2006US7049704 Flip-chip package integrating optical and electrical devices and coupling to a waveguide on a board
05/23/2006US7049696 IC package with electrically conductive heat-radiating mechanism, connection structure and electronic device
05/23/2006US7049692 Stacked semiconductor device
05/23/2006US7049528 Semiconductor chip mounting wiring board, manufacturing method for same, and semiconductor module
05/23/2006US7049527 Conductor-pattern testing method, and electro-optical device
05/23/2006US7049526 Microvia structure and fabrication
05/23/2006US7049371 Material for an insulating film, coating varnish for an insulating film, and insulating film and semiconductor device using the same
05/23/2006US7049258 Microwave dielectric composite composition
05/23/2006US7049253 Glass cloth and printed wiring board
05/23/2006US7049224 Manufacturing method of electronic components embedded substrate
05/23/2006US7049176 Method of forming thick-film wiring and method of producing laminated electronic component
05/23/2006US7049007 thin films comprising metallic carriers, barriers layers, a second metallic layer selected from zinc, copper and cobalt, and/or arsenic, manganese, tin, vanadium, molybdenum, antimony or tungsten, and electrodeposited overcoating, used for printed circuits; electrical and electronic apparatus; multilayer
05/23/2006US7049005 Thermosetting component, oligomer or polymer with cage structure, adhesion promoter; for use as dielectric substrate material, etch stop, hardmask, or air bridge in microchips, wafer coating; polyadamantanes
05/23/2006US7048993 Process for the constrained sintering of asymmetrically configured dielectric layers
05/23/2006US7048866 Metal/ceramic bonding article and method for producing same
05/23/2006US7048423 Integrated light and accessory assembly
05/23/2006US7048197 IC card
05/23/2006US7047637 Method of manufacture of ceramic composite wiring structures for semiconductor devices
05/23/2006US7047636 Method of connecting a connecting member and a flat circuit member
05/23/2006US7047634 Method of making a multilayer wiring board
05/23/2006US7047628 Impedance matching of differential pair signal traces on printed wiring boards
05/23/2006US7047624 Method for producing a tag or a chip card having a coil antenna
05/18/2006WO2006053206A1 Single or multi-layer printed circuit board with improved via design
05/18/2006WO2006052344A2 Voltage regulator and method using substrate board with insulator layer and conductive traces
05/18/2006WO2006051945A1 Digital television receiver circuit module
05/18/2006WO2006051881A1 Process for producing metallized aluminum nitride substrate and substrate obtained thereby
05/18/2006WO2006051864A1 Metal foil provided with adhesion auxiliary material and printed wiring board using same
05/18/2006WO2006051160A1 Antenna component
05/18/2006WO2006050656A1 A HEAT-DISPERSING STRUCTURE FOR THE LEDs LAMP
05/18/2006US20060105598 Conductive terminal and the electrical connector using the conductive terminal
05/18/2006US20060105597 Apparatus and method for improved connector layout
05/18/2006US20060105594 Method for package burn-in testing
05/18/2006US20060105593 Electrical connector and system having contact array interface for engaging contacts at varying centerline spacing
05/18/2006US20060104563 Optical semiconductor bare chip, printed wiring board, lighting unit and lighting device
05/18/2006US20060104562 Printed circuit board comprising electrical conductor paths and means for electro-optical and/or opto-electrical conversion
05/18/2006US20060104042 Circuit board structure with embedded selectable passive components and method for fabricating the same
05/18/2006US20060104034 Heat-dissipating device
05/18/2006US20060103788 Method for mounting electronic element, method for producing electronic device, circuit board, and electronic instrument
05/18/2006US20060103483 Inductor and capacitor formed of build-up vias
05/18/2006US20060103005 Metal-ceramic substrate for electric circuits or modules, method for producing one such substrate and module comprising one such substrate
05/18/2006US20060102990 Carrier for substrate film
05/18/2006US20060102882 Flame retardant compositions with a phosphorated compound
05/18/2006US20060102386 Multi-layered flexible print circuit board and manufacturing method thereof
05/18/2006US20060102385 Printed board for electronic devices controlling a motor vehicle
05/18/2006US20060102384 Multilayer printed wiring board and manufacturing method of the multilayer printed wiring board
05/18/2006US20060102383 Method of fabricating high density printed circuit board
05/18/2006US20060102382 Manufacturing method of electronic part and wiring substrate
05/18/2006US20060102374 Component with ultra-high frequency connections in a substrate
05/18/2006US20060101639 Method of making innerlayer panels and printed wiring boards using X-ray identification of fiducials
05/18/2006DE4341691B4 Verfahren zum Einsetzen eines elektrischen Drahtverbindungsanschlusses in eine gedruckte Schaltungsplatte A method for inserting an electric wire connecting terminal into a printed circuit board
05/18/2006DE112005000014T5 Innenleiterverbindungsstruktur und Mehrschichtsubstrat Inner conductor connection structure and multi-layer substrate
05/18/2006DE10353042B4 Verfahren zur Verifizierung von Haarrissen in einer Lötstelle, die ein Bauteil mit einer Leiterplatte verbindet A method of verification of hairline cracks in a solder joint connecting a component to a circuit board
05/18/2006DE10347450B4 Keramiksubstrate mit integrierten mechanischen Strukturen zum direkten Fassen von optischen Bauelementen Ceramic substrates with integrated mechanical structures for direct grasp of optical components
05/18/2006DE102004055061A1 Verfahren zur Anordnung eines Flip-Chips auf einem Substrat A process for the assembly of a flip chip on a substrate
05/18/2006DE102004054965A1 Module unit for electrical circuit, has circuit board with electrical wrap connections that cooperate with wrap connections of socket to establish connection between inner and outer circuits, where board is arranged in housing
05/18/2006DE102004054622A1 Laminated module for circuit board for electronic circuit with stack of several layers, i.e. at least one conductive layer and at least one electrically insulating material
05/18/2006DE10134944B4 Elektrische Anschlußklemme The electrical terminal
05/17/2006EP1657971A1 Assembly of an electronic component and a flexible circuit board
05/17/2006EP1657963A1 Electrical printed circuit board heating component, printed circuit board and heating process
05/17/2006EP1657659A1 Printed circuit board return route check method and printed circuit board pattern design cad device
05/17/2006EP1656718A1 Improved method for crimping at least one connector contact on a flexible electronic circuit
05/17/2006EP1470528B1 Method for manufacturing rfid labels
05/17/2006EP1196463B1 Epoxy resin prepared from p-hydroxystyrene having high functionality, low melt viscosity with high glass transition temperature
05/17/2006CN1774965A Module component and method for manufacturing the same
05/17/2006CN1774962A Discharging solution, method for producing patterns and method for producing an electronic device using the discharging solution, and electronic device
05/17/2006CN1774961A Method for high-frequency tuning an electrical device, and a printed circuit board suitable therefor
05/17/2006CN1774960A Technique for accommodating electronic components on a multilayer signal routing device
05/17/2006CN1774959A Electomagnetic interference shielding for a printed circuit board
05/17/2006CN1774958A High frequency heating apparatus
05/17/2006CN1774835A Grouped element transmission channel link with pedestal aspects
05/17/2006CN1774804A EMI shielding for electronic component packaging
05/17/2006CN1774800A Metal-base circuit board and its manufacturing method
05/17/2006CN1774784A Electromagnetic relay
05/17/2006CN1774155A Printed wiring board for plasma display and process for producing the same
05/17/2006CN1773228A Electronic circuit device
05/17/2006CN1256861C Surface mounting base for printed circuit board assembly
05/17/2006CN1256856C Electronic elements and manufacture thereof