Patents for H05K 1 - Printed circuits (98,583)
05/2006
05/31/2006CN1780530A Method of forming a wiring pattern, method of manufacturing a device, device, and electro-optic device
05/31/2006CN1780528A Prepreg and laminate and printed wiring board using the same
05/31/2006CN1780527A Electric circuit substrate and its manufacture
05/31/2006CN1780526A Electronic assembly with a heat sink
05/31/2006CN1780525A Modular printed board assembly, plasma display apparatus having the same, and method of fabricating the assembly
05/31/2006CN1780524A Multi-layer printed circuit board
05/31/2006CN1779907A Electronic part and method for manufacturing the same
05/31/2006CN1779868A Conducting material with anisotropy
05/31/2006CN1779568A Hardenable resin composition, hardened body thereof, and printed wiring board
05/31/2006CN1779453A Apparatus for measuring heat conductivity coefficient and production thereof
05/31/2006CN1258308C Printed circuit board, its manufacturing method and semiconductor device
05/31/2006CN1258307C Flexible printed circuit board and producing method thereof
05/31/2006CN1258306C Through hole processing and structure for HF circuit board
05/31/2006CN1258304C High frequency circuit connection structure having good high frequency performance
05/30/2006US7054671 Antenna arrangement in a mobile station
05/30/2006US7054179 Double-high memory system compatible with termination schemes for single-high memory systems
05/30/2006US7054165 Placement structure of an integrated motherboard for small form factor computer
05/30/2006US7054159 Printed wiring board having heat radiating means and method of manufacturing the same
05/30/2006US7054141 Capacitor, capacitor-embedded board, and method for manufacturing the capacitor
05/30/2006US7053735 Waveguide in multilayer structures and resonator formed therefrom
05/30/2006US7053729 Impedence matching along verticle path of microwave vias in multilayer packages
05/30/2006US7053496 Hybrid package with non-insertable and insertable conductive features, complementary receptacle, and methods of fabrication, assembly, and operation therefor
05/30/2006US7053491 Sperical core of high melting metal; connector of low melting eutectic
05/30/2006US7053485 Microelectronic packages with self-aligning features
05/30/2006US7053484 Miniature broadband switched filter bank
05/30/2006US7053483 Semiconductor package using terminals formed on a conductive layer of a circuit board
05/30/2006US7053481 High capacitance package substrate
05/30/2006US7053478 Pitch change and chip scale stacking system
05/30/2006US7053466 High-speed signaling interface with broadside dynamic wave coupling
05/30/2006US7053416 LED display apparatus
05/30/2006US7053315 Junction structure and junction method for conductive projection
05/30/2006US7053314 Methods and apparatus for providing a signal to a circuit board component
05/30/2006US7053313 Transparent substrate provided with electroconductive strips
05/30/2006US7053312 Flexible wiring boards
05/30/2006US7052987 Method for fabricating a low capacitance wiring layout
05/30/2006US7052825 Substrate having fine lines, method for manufacturing the same, electron-source substrate, and image display apparatus
05/30/2006US7052824 Process for thick film circuit patterning
05/30/2006US7052823 Method of manufacturing an electroconductive film, and method of manufacturing an image forming apparatus including the electroconductive film
05/30/2006US7052781 Flexible copper foil structure and fabrication method thereof
05/30/2006US7052285 Electrode mounting structure and flat panel display employing the same
05/30/2006US7051434 Designing a ball assignment for a ball grid array package
05/30/2006US7051433 Multilayer circuit board
05/30/2006US7051430 Method of manufacturing a printed board assembly
05/30/2006CA2148040C Polyester shaped articles having an excellent heat stability
05/26/2006WO2006055478A2 Rfid tag in a printed circuit board
05/26/2006WO2006054791A1 Resin cured film for flexible printed wiring board and production process thereof
05/26/2006WO2006054684A1 Printed wiring board and production method of printed wiring borad
05/26/2006WO2006054637A1 Wiring board, method for manufacturing same and semiconductor device
05/26/2006WO2006054569A1 Photo-electricity combined-circuit mounted board and transmitting apparatus using the same
05/26/2006WO2006053992A1 Improving the quality of analog wideband appliances
05/26/2006WO2006053891A1 Off-width pitch for improved circuit card routing
05/26/2006WO2006053880A1 Sensor with a deformation-dependent value of resistance
05/26/2006WO2006053795A1 Suppressor for suppressing high-frequency interference emissions of a direct-current motor that can be operated in a number of stages and/or directions
05/26/2006WO2005120823A3 Non-covalent bonding agent for carbon nanotube reinforced polymer composites
05/25/2006US20060111008 Method for patterning carbon nanotube coating and carbon nanotube wiring
05/25/2006US20060110976 Terminal having a protrusion for preventing incorrect insertion
05/25/2006US20060110952 Systems for interchip communication
05/25/2006US20060110951 Edge mount electrical connector
05/25/2006US20060110838 Multilayered circuit substrate, semiconductor device and method of producing same
05/25/2006US20060110580 Article comprising conductive conduit channels
05/25/2006US20060110099 Hybrid circuit substrate with optical and electrical interconnects, hybrid circuit module with optical and electrical interconnects and manufacturing methods thereof
05/25/2006US20060109636 Method and apparatus for mounting a card in an information handling system
05/25/2006US20060109062 High frequency component
05/25/2006US20060108717 Method for producing a ceramic substrate
05/25/2006US20060108690 Circuit board with reduced simultaneous switching noise
05/25/2006US20060108680 Multi-layer printed circuit board wiring layout and method for manufacturing the same
05/25/2006US20060108607 Integrated circuit component and mounting method thereof
05/25/2006US20060108147 Printed wiring board
05/25/2006US20060108146 Structure of electronic package and method for fabricating the same
05/25/2006US20060108145 Method for producing printed wiring board
05/25/2006US20060108144 Circuit board with embedded component and method of manufacturing same
05/25/2006US20060108143 Signal transmission structure and circuit substrate thereof
05/25/2006US20060108142 Vents with signal image for signal return path
05/24/2006EP1659841A2 Printed circuit board
05/24/2006EP1659840A1 Rigid-flex wiring board and method for producing same
05/24/2006EP1659839A2 Thermal management of surface-mount circuit devices on laminate ceramic substrate
05/24/2006EP1659838A2 Electronic part-mounted substrate, thermal conductive member for electronic part-mounted substrate, and liquid-jetting head
05/24/2006EP1659837A1 Contact between a component and a busbar grid
05/24/2006EP1659822A1 Earphone antenna connecting device and portable wireless device
05/24/2006EP1658661A2 Lamp base for a high-pressure discharge lamp, and corresponding high-pressure discharge lamp
05/24/2006EP1658658A2 A flexible flat cable termination structure for a clockspring
05/24/2006EP1658327A1 Moulding materials and use thereof
05/24/2006EP1579745B1 Layered structure with electric leads for a body worn device
05/24/2006EP1293110B1 Electronic ballast for a discharge lamp
05/24/2006EP0936852B1 Console panel for equipment
05/24/2006EP0902990B1 High density connector arrangement for a circuit board module
05/24/2006DE202006001499U1 Contact for rapid and reversible assembly of prototype or experimental circuitry, comprises strong, surface-conductive, neodymium-based magnet
05/24/2006DE19815291B4 Beschichtungszusammensetzung zur Herstellung von elektrisch leitfähigen Schichten A coating composition for producing electrically conductive layers
05/24/2006DE19737787B4 Anzeigeeinrichtung Display device
05/24/2006DE19527611B4 Verfahren zum Herstellen eines Substrats für elektrische Schaltkreise A method for producing a substrate for electrical circuits
05/24/2006DE112004001018T5 Hohe Wärmeleitfähigkeit aufweisendes Masseneinsatzmaterial und Verfahren zum Herstellen desselben Thereof exhibiting high thermal conductivity mass feedstock and process for producing
05/24/2006DE102005053117A1 Verfahren zur Potentialsteuerung und Abschirmung für eine Hochspannungskomponente auf einer gedruckten Schaltung und in einem Röntgengerät A method of potential control and for shielding a high-voltage component on a printed circuit, and in an X-ray device
05/24/2006DE102005046132A1 Flammhemmende Zusammensetzungen The flame-retardant compositions
05/24/2006DE102004055955A1 Anordnung zum Kontaktieren einer in einem Gehäuse integrierten Schaltung Arrangement for contacting an integrated circuit contained in a housing
05/24/2006DE102004055534A1 Power semiconductor module, has wiring layer internally connected with sprayed layer, coated on insulating layer and formed by spraying particle on particle area of heat-sink in stream of hot gas
05/24/2006DE102004004741A1 Vorrichtung zur schüttelfesten Aufnahme von elektrischen Sonderbauelementen und/oder elektrischen Schaltungen Device for mounting electrical schüttelfesten special devices and / or electrical circuits
05/24/2006DE10063251B4 Kontaktanordnung zur Verbindung eines Steckers mit hoher Kontaktdichte mit einer Leiterplatte Contact arrangement for connecting a connector with high contact density with a circuit board
05/24/2006CN2783711Y Ruffer material structure
05/24/2006CN2783709Y Radio frequency connection board
05/24/2006CN2783708Y Synthetic base board for SMT production line