Patents for H05K 1 - Printed circuits (98,583)
02/2008
02/20/2008CN101126168A Surface treatment electrolysis copper foil, method for manufacturing the same , and circuit board
02/20/2008CN100370889C Positioning structure of welding-free light-emitting diode
02/20/2008CN100370887C Improved structure of stacked vias in multiple layer electronic device carriers
02/20/2008CN100370886C A printed wiring board and production method thereof
02/20/2008CN100370547C System and method for improving lead wire connection for hard disk driver actuator
02/20/2008CN100370348C Flexible electronic device and its manufacturing method
02/20/2008CN100370325C Double-sided LCD device
02/20/2008CN100370225C Circuit board device for information apparatus, multilayered module board, and navigator
02/20/2008CN100369964C Resin composition, prepreg and laminate using the composition
02/20/2008CN100369939C Coated particles
02/19/2008USRE40068 Multi-layer circuit board having signal, ground and power layers
02/19/2008US7334244 Flexible flat cable and disk drive using the same
02/19/2008US7333606 Splitter architecture for a telecommunications system
02/19/2008US7333346 Circuit board having test coupon and method for evaluating the circuit board
02/19/2008US7333344 Flexible printed circuit board
02/19/2008US7333324 Latch assembly that facilitates the insertion and removal of a battery module from an electronic device
02/19/2008US7333164 Liquid crystal module
02/19/2008US7332816 Method of fabricating crossing wiring pattern on a printed circuit board
02/19/2008US7332805 Electronic package with improved current carrying capability and method of forming the same
02/19/2008US7332800 Semiconductor device
02/19/2008US7332799 Packaged chip having features for improved signal transmission on the package
02/19/2008US7332402 Method for optically trimming electronic components
02/19/2008US7332371 Semiconductor device and method of manufacture thereof, circuit board and electronic instrument
02/19/2008US7332231 Ceramic substrate for thin film electronic component, production method for the same and thin film electronic component using the same
02/19/2008US7332212 Immersion of polytetrafluoroethylene dielectric layers in solutions comprising electroconductive polymers and intermetallic seeding materials, then rinsing, drying and coppering to form printed circuits or laminated chip carriers; electronics; printed circuit boards (PCBs), laminated chip carriers
02/19/2008US7331528 Smartcard and method for production of a smartcard
02/19/2008CA2461037C Differential signal electrical connectors
02/19/2008CA2311962C Non-woven fibre webs
02/19/2008CA2311874C Non-woven fibre webs
02/14/2008WO2008018875A1 Integral charge storage basement and wideband embedded decoupling structure for integrated circuit
02/14/2008WO2008018483A1 Thermosetting resin composition and unhardened film composed of the same
02/14/2008WO2008018227A1 Method of producing multilayer ceramic substrate
02/14/2008WO2008018160A1 Method and apparatus for connecting printed wiring boards
02/14/2008WO2008017795A1 Method of forming an electronic component
02/14/2008WO2007146546A3 Single or multi-layer printed circuit board with improved edge via design
02/14/2008WO2007145741A3 Encapsulated multi-phase electronics heat sink
02/14/2008US20080039137 Circuit Board with Adaptive, Electromagnetic Coupler
02/14/2008US20080038942 Modular power distribution system
02/14/2008US20080038941 Circuit board having configurable ground link and with coplanar circuit and ground traces
02/14/2008US20080038940 Coaxial cable connecting apparatus
02/14/2008US20080038568 Method for Producting Synthetic Resin Film and Synthetic Resin Film
02/14/2008US20080038512 Perforated Functional Textile Structures
02/14/2008US20080038506 Luminous mesh and method of manufacturing same
02/14/2008US20080037238 Structure for electromagnetically shielding a substrate
02/14/2008US20080037237 Low noise multilayer printed circuit board
02/14/2008US20080037233 Printed wiring board and process for manufacturing the same
02/14/2008US20080037232 Reconfigurable control panel
02/14/2008US20080037229 Electronic Module And Method For The Production Thereof
02/14/2008US20080036568 Method for pcb fusing trace arrangement for motor drive applications
02/14/2008US20080036557 Compact bandpass filter for double conversion tuner
02/14/2008US20080036548 Resonator For A Voltage Controlled Oscillator And Manufacturing Method Thereof
02/14/2008US20080036093 Method for embedding a component in a base
02/14/2008US20080036085 Circuit board including solder ball land having hole and semiconductor package having the circuit board
02/14/2008US20080036068 Stacked Module Systems and Methods
02/14/2008US20080035371 Circuit board with embedded components and manufacturing and measuring method thereof
02/14/2008US20080035370 Device applications for voltage switchable dielectric material having conductive or semi-conductive organic material
02/14/2008US20080035369 Shielded circuit board and method for shielding a circuit board
02/14/2008US20080035368 Chip holder board
02/14/2008US20080035362 Method and structure for controlled impedance wire bonds using co-dispensing of dielectric spacers
02/14/2008DE112006000519T5 Integrierter Dünnschicht-Kondensator mit optimierter Temperaturkennlinie Integrated thin-film capacitor with optimized temperature characteristic
02/14/2008DE10205704B4 Filteranordnung für eine ADSL-Frequenzweiche Filter assembly for an ADSL crossover
02/14/2008DE102006038356A1 Insertion element for circuit boards comprises a housing having an opening for inserting a plug connector, a metallic element for clamping the plug connector and attachments protruding from the housing
02/14/2008DE102006038354A1 Connection element e.g. for mounting of supply conductors on circuit board, uses contact element having number of contact feet
02/14/2008DE102006037691A1 Moldgehäuse in Einpresstechnik In press-fit molded housing
02/13/2008EP1887848A2 Methods and apparatus for installing a feed through filter
02/13/2008EP1887844A2 Wired electro-mechanical components and method for their manufacture
02/13/2008EP1887843A1 Method for oxide dielectric layer formation, and capacitor layer forming material comprising oxide dielectric layer formed by said formation method
02/13/2008EP1887842A1 Case for housing electronic unit
02/13/2008EP1887031A1 White prepreg, white laminated plate, and metal foil clad white laminated plate
02/13/2008EP1886544A1 Method and arrangement for protecting sensitive components by textile and product including said arrangement
02/13/2008EP1886543A1 Shielding film, shielded printed circuit board, shielded flexible printed circuit board, method of manufacturing shielding film, and method of manufacturing shielded printed circuit board
02/13/2008EP1721498B1 Electronic module and method for the production thereof
02/13/2008CN201022241Y Gold finger and flexible printed circuit board with this gold finger structure
02/13/2008CN201022240Y Printed circuit board and electromotor with grounding conductor for electromotor
02/13/2008CN201022239Y 隔离罩 Caging
02/13/2008CN201022074Y Improved circuit board structure for contact image sensor
02/13/2008CN201021789Y LED plate lamp
02/13/2008CN201021764Y A combined lighting source
02/13/2008CN101124858A Printed wiring board with conductive constraining core including resin filled channels
02/13/2008CN101124857A Package mounting module and package base plate module
02/13/2008CN101124697A High speed, high density electrical connector
02/13/2008CN101124675A Stacked electronic component, electronic device and method for manufacturing stacked electronic component
02/13/2008CN101123852A Circuit substrate and manufacturing method thereof
02/13/2008CN101123848A Circuit module and its making method
02/13/2008CN101123847A Circuit board module
02/13/2008CN101123846A Blind hole structure of printed circuit board and its manufacturing method
02/13/2008CN101123845A Laminate for wiring board
02/13/2008CN101122715A Display device and its backlight module and its assembly method
02/13/2008CN101122625A Printing circuit, printing circuit board and on-line real-time earthing monitor
02/13/2008CN100369536C Method and apparatus for fabricating circuit board, with three dimensional surface mounted array of semiconductor chips
02/13/2008CN100369532C Module and method of manufacturing module
02/13/2008CN100369531C Connector holding structure
02/13/2008CN100369530C Semiconductor chip mounting substrate, a method of producing the same, and a method of mounting a semiconductor chip
02/13/2008CN100369330C Plate-plate connector able to easily electrically connect two parallel plantes
02/13/2008CN100368873C Electro-optical device and electronic apparatus
02/13/2008CN100368869C Electrooptical device,flexible wiring substrate,manufacturing method of electrooptical device and electronic device
02/13/2008CN100368475C Curable flame retardant epoxy resin compositions
02/13/2008CN100368340C Non-lead glass for forming dielectric, glass ceramic composition for forming dielectric, dielectric, and process for producing laminated dielectric
02/12/2008US7330691 Image forming apparatus
02/12/2008US7330612 Material for substrate mounting optical circuit-electric circuit mixedly and substrate mounting optical circuit-electric circuit mixedly