Patents
Patents for H01L 29 - Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having at least one potential-jump barrier or surface barrier; Capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. pn-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof (218,143)
07/2014
07/16/2014CN103928329A Mos晶体管及其形成方法 Mos transistor and method of forming
07/16/2014CN103928327A 鳍式场效应晶体管及其形成方法 Fin-type field effect transistor and method of forming
07/16/2014CN103928308A 具有不同长度的晶体管栅极阵列及其制作方法 Transistor gate array and its production methods have different lengths
07/16/2014CN103928307A 晶体管的形成方法、高k栅介质层的形成方法 The method for forming a transistor, a method of forming high-k gate dielectric layer,
07/16/2014CN103928306A 双金属栅极结构的形成方法及cmos晶体管 The method of forming a dual metal gate transistor structure and cmos
07/16/2014CN103926768A 一种阵列基板、显示面板和显示装置 One kind of array substrate, a display panel and a display device
07/16/2014CN103922321A 石墨烯的制备方法、薄膜晶体管、阵列基板及显示面板 Preparation of graphene thin film transistor array substrate and a display panel
07/16/2014CN102859702B 半导体元件及其制造方法、有源矩阵基板及显示装置 Semiconductor device and manufacturing method of the active matrix substrate and a display device
07/16/2014CN102655152B 存储装置、其制造方法与操作方法 A storage device, its manufacturing method and operating method
07/16/2014CN102651310B 利用多缓冲层制备宽禁带单晶薄膜及方法 Preparation of a buffer layer using multiple wide-bandgap single crystal thin film and method
07/16/2014CN102637725B 采用Bipolar低压工艺实现的器件及其制造方法 Using the device and method of manufacturing the low pressure Bipolar process to achieve the
07/16/2014CN102569409B 双层隔离纵向堆叠式半导体纳米线mosfet Double isolation longitudinal stackable semiconductor nanowires mosfet
07/16/2014CN102544010B 双层隔离三维阵列式半导体纳米线mosfet Double isolation dimensional array type semiconductor nanowires mosfet
07/16/2014CN102487066B 级联的高压结型场效应晶体管 High voltage cascade junction field effect transistor
07/16/2014CN102479821B 半导体器件及其形成方法 Semiconductor device and method of forming
07/16/2014CN102456574B 一种自对准金属硅化物的沟槽型半导体器件及制造方法 A self-aligned trench-type semiconductor device and manufacturing method of the metal silicide
07/16/2014CN102412132B 电子可擦除式只读存储器单元 Electronic erasable read-only memory unit
07/16/2014CN102354531B 识别具有较差的亚阈斜率或较弱的跨导的非易失存储器元件的方法 The method of identification has poor subthreshold slope or weak transconductance of the non-volatile memory element of
07/16/2014CN102341865B Nand闪存装置的编程方法 Nand flash memory device programming
07/16/2014CN102280478B 可堆栈式功率mosfet、功率mosfet堆栈及其制备工艺 Stackable power mosfet, power mosfet stack and its preparation process
07/16/2014CN102194699B 带有改良型源极传感布局的屏蔽栅极沟槽mos Mos shielded gate trench with a source of improved sensor layouts
07/16/2014CN102163575B 显示装置及显示装置的制造方法 The method of manufacturing a display device and a display device
07/16/2014CN102099848B 有源矩阵基板、显示面板、显示装置及有源矩阵基板的制造方法 The active matrix substrate, a display panel, apparatus, and method for manufacturing the active matrix substrate, a display
07/16/2014CN102082168B 交错柱超级结 Super Junction staggered column
07/16/2014CN102074481B 制造半导体器件的方法 The method of manufacturing a semiconductor device
07/16/2014CN102067318B 用于锑化物基反向二极管毫米波探测器的方法和装置 Methods and apparatus for antimonide based reverse diode millimeter-wave detectors
07/16/2014CN101740631B 半导体装置及该半导体装置的制造方法 Semiconductor device and method of manufacturing the semiconductor device
07/15/2014USRE45017 Method for separating a device-forming layer from a base body
07/15/2014US8780629 Semiconductor device and driving method thereof
07/15/2014US8779848 Two terminal memcapacitor device
07/15/2014US8779749 Circuit for controlling an A.C. switch
07/15/2014US8779606 Package-on-package electronic devices including sealing layers and related methods of forming the same
07/15/2014US8779605 Method and apparatus providing integrated circuit having redistribution layer with recessed connectors
07/15/2014US8779603 Stacked semiconductor device with heat dissipation
07/15/2014US8779601 Embedded wafer level package for 3D and package-on-package applications, and method of manufacture
07/15/2014US8779600 Interlevel dielectric stack for interconnect structures
07/15/2014US8779595 Semiconductor device having high-frequency interconnect
07/15/2014US8779594 Semiconductor device having multi-layered interconnect structure
07/15/2014US8779593 Semiconductor integrated circuit device
07/15/2014US8779592 Via-free interconnect structure with self-aligned metal line interconnections
07/15/2014US8779572 On-chip heat spreader
07/15/2014US8779571 Integrated circuit having a three dimensional stack package structure
07/15/2014US8779560 Semiconductor device and manufacturing method thereof
07/15/2014US8779555 Partial SOI on power device for breakdown voltage improvement
07/15/2014US8779554 MOSFETs with channels on nothing and methods for forming the same
07/15/2014US8779553 Stress-aware design for integrated circuits comprising a stress inducing structure and keep out zone
07/15/2014US8779552 Integrated circuit chip protected against laser attacks
07/15/2014US8779545 Semiconductor structure with dispersedly arranged active region trenches
07/15/2014US8779538 Magnetic tunneling junction seed, capping, and spacer layer materials
07/15/2014US8779535 Packaged integrated device die between an external and internal housing
07/15/2014US8779533 MEMS with single use valve and method of operation
07/15/2014US8779530 Metal gate structure of a field effect transistor
07/15/2014US8779528 SRAM cell comprising FinFETs
07/15/2014US8779527 FinFET drive strength modification
07/15/2014US8779526 Semiconductor device
07/15/2014US8779524 Semiconductor device
07/15/2014US8779523 Semiconductor device
07/15/2014US8779522 Semiconductor device and method of manufacturing same
07/15/2014US8779521 Auto switch MOSFET
07/15/2014US8779520 Erasable programmable single-ploy nonvolatile memory
07/15/2014US8779514 Transistor and method for manufacturing the same
07/15/2014US8779513 Non-planar semiconductor structure
07/15/2014US8779510 Semiconductor power devices manufactured with self-aligned processes and more reliable electrical contacts
07/15/2014US8779508 Semiconductor device and method for manufacturing the same
07/15/2014US8779507 Insulated gate semiconductor device
07/15/2014US8779505 Quasi-vertical structure for high voltage MOS device
07/15/2014US8779504 Semiconductor device
07/15/2014US8779503 Nonvolatile semiconductor memory
07/15/2014US8779502 Nonvolatile semiconductor memory
07/15/2014US8779501 Diode-based flash memory device cell string and fabricating method therefor
07/15/2014US8779499 Nonvolatile semiconductor memory device and method of manufacturing the same
07/15/2014US8779498 Nonvolatile semiconductor memory device
07/15/2014US8779497 Electrical erasable programmable read-only memory and manufacturing method thereof
07/15/2014US8779496 Spin FET, magnetoresistive element and spin memory
07/15/2014US8779495 Stacked SONOS memory
07/15/2014US8779494 High-k metal gate random access memory
07/15/2014US8779493 Semiconductor device with increased channel length and method for fabricating the same
07/15/2014US8779492 Semiconductor device and method of forming the same
07/15/2014US8779490 DRAM with dual level word lines
07/15/2014US8779479 Semiconductor device and manufacturing method thereof
07/15/2014US8779478 Thin film transistor
07/15/2014US8779477 Enhanced dislocation stress transistor
07/15/2014US8779476 Asymmetric wedge JFET, related method and design structure
07/15/2014US8779475 Semiconductor device and method of manufacturing the same
07/15/2014US8779474 Electric device comprising phase change material
07/15/2014US8779473 SiGe HBT device and manufacturing method of the same
07/15/2014US8779471 Field-effect transistor, semiconductor wafer, method for producing field-effect transistor and method for producing semiconductor wafer
07/15/2014US8779466 ESD protection device and method for manufacturing the same
07/15/2014US8779464 Starting structure and protection component comprising such a starting structure
07/15/2014US8779462 High-ohmic semiconductor substrate and a method of manufacturing the same
07/15/2014US8779452 Chip package
07/15/2014US8779445 Stress-alleviation layer for LED structures
07/15/2014US8779444 LED light engine with applied foil construction
07/15/2014US8779441 Semiconductor light emitting element with first and second electrode openings arranged at a constant distance
07/15/2014US8779440 Semiconductor structure and a method of forming the same
07/15/2014US8779439 Silicon carbide Schottky-barrier diode device and method for manufacturing the same
07/15/2014US8779438 Field-effect transistor with nitride semiconductor and method for fabricating the same
07/15/2014US8779437 Wafer, crystal growth method, and semiconductor device
07/15/2014US8779435 Semiconductor device structure and method of manufacturing semiconductor device structure
07/15/2014US8779434 Thin film transistor array and displaying apparatus