Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
03/2013
03/06/2013CN102959714A Display device, thin-film transistor used in display device, and method for producing thin-film transistor
03/06/2013CN102959713A Semiconductor device
03/06/2013CN102959712A Thin-film transistor and method of manufacturing thin-film transistor
03/06/2013CN102959711A Semiconductor device and method for manufacturing same
03/06/2013CN102959710A Metal gate structures and methods for forming thereof
03/06/2013CN102959709A Silicon carbide substrate, semiconductor device, and method for manufacturing said silicon carbide substrate and semiconductor device
03/06/2013CN102959705A Semiconductor device
03/06/2013CN102959701A A heat sink and a method of making a cooled device with a heat sink
03/06/2013CN102959698A Chip elements mounted on wires having an incipient breaking point
03/06/2013CN102959697A Methods for in-situ passivation of silicon-on-insulator wafers
03/06/2013CN102959696A Manufacturing method for channel plate, channel plate, temperature adjustment plate, cold plate, and shower plate
03/06/2013CN102959695A Electronic component mounting apparatus and electronic component mounting method
03/06/2013CN102959694A Method for manufacturing silicon carbide semiconductor device
03/06/2013CN102959693A Ultrahigh density vertical NAND memory device and method of making thereof
03/06/2013CN102959692A 蚀刻方法和装置 Method and apparatus for etching
03/06/2013CN102959691A Liquid composition for cleaning semiconductor substrate and method for cleaning semiconductor substrate using same
03/06/2013CN102959690A Method for manufacturing silicon carbide semiconductor device and apparatus for manufacturing silicon carbide semiconductor device
03/06/2013CN102959689A Tape for wafer processing and production method for same
03/06/2013CN102959688A 粘接片 Adhesive sheet
03/06/2013CN102959687A Metallization processes, mixtures, and electronic devices
03/06/2013CN102959686A 氮化物半导体装置 The nitride semiconductor device
03/06/2013CN102959685A Fiber forwarding laser optical system
03/06/2013CN102959684A Impurities diffusion layer forming composition, n-type diffusion layer forming composition, method for manufacturing n-type diffusion layer, p-type diffusion layer forming composition, method for manufacturing p-type diffusion layer, and method for m
03/06/2013CN102959683A Customizable dispense system with smart controller
03/06/2013CN102959682A Epitaxial growth substrate, semiconductor device, and epitaxial growth method
03/06/2013CN102959681A Film-forming apparatus, and method for maintaining film-forming apparatus
03/06/2013CN102959680A Plasma-enhanced chemical vapor deposition of crystalline germanium
03/06/2013CN102959679A Composition for photocurable imprint, and method for formation of pattern using the composition
03/06/2013CN102959678A Method of manufacturing semiconductor device and system for manufacturing semiconductor device
03/06/2013CN102959677A Method for producing GaN film
03/06/2013CN102959417A 3d integrated circuit and test method for same
03/06/2013CN102959141A Group iii nitride crystal growing method
03/06/2013CN102959140A Epitaxial film formation method, vacuum treatment device, method for producing semiconductor light-emitting element, semiconductor light-emitting element, lighting device
03/06/2013CN102959126A Modification of silicon layers formed from silane-containing formulations
03/06/2013CN102959125A Vacuum processing apparatus and plasma processing method
03/06/2013CN102959030A Heat-peelable adhesive sheet
03/06/2013CN102958817A Module used for stacking thin plate panels
03/06/2013CN102958658A Temperature adjusting device, and imprinting device using same
03/06/2013CN102958646A Jig for measurement, wire saw, and workpiece mounting method
03/06/2013CN102958631A Low-temperature-sinterable bonding material, and bonding method using the bonding material
03/06/2013CN102956748A Diffusion method for one-step formation of selective emitter of solar cell
03/06/2013CN102956715A TFT (Thin Film Transistor), manufacturing method thereof, array substrate and display device
03/06/2013CN102956714A Oxide thin film transistor and manufacturing method thereof as well as array substrate and display device
03/06/2013CN102956713A Thin film transistor, manufacturing method thereof, array substrate and display device
03/06/2013CN102956712A Display, method of manufacturing the same and electric apparatus
03/06/2013CN102956711A Methods for manufacturing a metal-oxide thin film transistor
03/06/2013CN102956709A Bi-material railing nanowire tunneling field effect device and manufacturing method thereof
03/06/2013CN102956708A Shielded gate trench mosfet package
03/06/2013CN102956705A Semiconductor device and manufacturing method of semiconductor device
03/06/2013CN102956704A Quasi-vertical power MOSFET and methods of forming the same
03/06/2013CN102956703A Semiconductor device and manufacture method thereof
03/06/2013CN102956702A Semiconductor apparatus and manufacturing method thereof
03/06/2013CN102956701A Structure and forming method of fin type field-effect tube
03/06/2013CN102956700A Semiconductor structure and manufacturing method thereof
03/06/2013CN102956698A Pressure strain p-MOSFET (metal-oxide-semiconductor field effect transistor) device structure and manufacturing method thereof
03/06/2013CN102956695A Semiconductor device having high-k gate dielectric layer and manufacturing method thereof
03/06/2013CN102956692A Buffered finFET device
03/06/2013CN102956691A Thin-film transistor and method for fabricating thereof, liquid crystal display device and method for fabricating the same
03/06/2013CN102956690A Semiconductor device and method of manufacturing the same
03/06/2013CN102956689A Power transistor device and fabricating method thereof
03/06/2013CN102956686A Silicon germanium nanostructure substrate and manufacturing method thereof
03/06/2013CN102956684A Buried field ring field effect transistor (BUF-FET) integrated with cells implanted with hole supply path
03/06/2013CN102956683A Thin film device and manufacturing method thereof
03/06/2013CN102956680A Semiconductor device and method for forming semiconductor device
03/06/2013CN102956679A Compound semiconductor device and method for manufacturing the same
03/06/2013CN102956678A Polysilicon film
03/06/2013CN102956676A Thin film transistor (TFT) array substrate, preparation method and quantum dot (QD) light emitting diode (LED) display device
03/06/2013CN102956673A Organic light emitting diode display and manufacturing method thereof
03/06/2013CN102956672A Display device and fabrication method thereof
03/06/2013CN102956668A Substrate and structure for manufacturing flexible display device and manufacturing method thereof
03/06/2013CN102956667A Organic light-emitting display device and method of manufacturing the same
03/06/2013CN102956649A Array baseplate, manufacturing method of array baseplate and display device
03/06/2013CN102956648A Active matrix rear panel with liquid crystal display
03/06/2013CN102956647A Semiconductor device and manufacture method thereof
03/06/2013CN102956645A Data storing devices and methods of fabricating the same
03/06/2013CN102956644A Non-volatile memory device with vertical memory cells and method for fabricating the same
03/06/2013CN102956643A Non-volatile floating gate storage unit manufacturing method and storage unit manufactured by same
03/06/2013CN102956642A FINFET based one-time programmable device and related method
03/06/2013CN102956640A Double-conduction semiconductor component and manufacturing method thereof
03/06/2013CN102956639A Trench-gate metal oxide semiconductor component and manufacture method thereof
03/06/2013CN102956638A One-piece IGBT (Insulated Gate Bipolar Translator) device and processing method thereof
03/06/2013CN102956637A Circuit structure with resistors or capacitors and operating method
03/06/2013CN102956635A Integrated copper fuse combined with esd/over- voltage/reverse polarity protection
03/06/2013CN102956631A Semiconductor structure and manufacture method thereof
03/06/2013CN102956630A Three-dimensional integrated semiconductor system and method for forming the same
03/06/2013CN102956629A Back-to-back stacked dies
03/06/2013CN102956623A Controlling device performance by forming a stressed backside dielectric layer
03/06/2013CN102956617A Method for manufacturing zero-layer photoetching alignment marks
03/06/2013CN102956616A Semiconductor chip, packages, and method of fabricating semiconductor chip and packages
03/06/2013CN102956614A Semiconductor device and method of manufacturing same
03/06/2013CN102956611A Air gap/graphene interconnection structure and preparation method thereof
03/06/2013CN102956609A Structure and method for bump to landing trace ratio
03/06/2013CN102956605A Semiconductor component and manufacturing method thereof
03/06/2013CN102956604A Thin nickel-palladium-gold layer, packaging structure thereof with leads, and making method thereof
03/06/2013CN102956603A Semiconductor apparatus, method of manufacturing semiconductor apparatus, and electronic apparatus
03/06/2013CN102956601A Base plate structure with elastic lugs and manufacturing method of base plate structure
03/06/2013CN102956592A Chip packaging piece and chip packaging method
03/06/2013CN102956591A Semiconductor device and method for manufacturing the same
03/06/2013CN102956589A Semiconductor packaging structure and method of fabricating same
03/06/2013CN102956588A Semiconductor device having through-substrate via