Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
03/2013
03/06/2013CN102956583A Temperature equalization plate structure and manufacturing method thereof
03/06/2013CN102956576A Heat radiation device and manufacturing method thereof
03/06/2013CN102956575A Package structure and manufacture method thereof
03/06/2013CN102956572A Novel package of electronic device
03/06/2013CN102956566A Method for fabricating a damascene self-aligned ferroelectric random access memory (f-ram) device structure employing reduced processing steps
03/06/2013CN102956565A Method for fabricating a damascene self-aligned ferroelectric random access memory (f-ram) with simultaneous formation of sidewall ferroelectric capacitors
03/06/2013CN102956564A Non-volatile memory device and method for fabricating the same
03/06/2013CN102956563A Separated gate type memory embedded into logic circuit and manufacturing method of memory group
03/06/2013CN102956562A Memory device forming method
03/06/2013CN102956561A Forming method for embedded memory device
03/06/2013CN102956560A Semiconductor structure and method of forming the same
03/06/2013CN102956559A Method for manufacturing metal gate
03/06/2013CN102956558A Manufacturing method of semiconductor devices
03/06/2013CN102956557A Manufacturing method of semiconductor devices
03/06/2013CN102956556A Semiconductor structure and manufacturing method for same
03/06/2013CN102956555A Implant for performance enhancement of selected transistors in an integrated circuit
03/06/2013CN102956554A Separate gate type flash memory of embedded logic circuit and fabricating method thereof
03/06/2013CN102956553A Split gate flash memory embedded in logical circuit and method for manufacturing memory set
03/06/2013CN102956552A Preparation method for semiconductor device
03/06/2013CN102956551A Fabrication method of array substrate, array substrate and display device
03/06/2013CN102956550A Method for manufacturing active array substrate and active array substrate
03/06/2013CN102956549A Manufacturing method of active matrix backing plate of field sequential color liquid crystal display
03/06/2013CN102956548A Electric field aided silicon through hole etching process
03/06/2013CN102956547A Semiconductor package structure and manufacturing method thereof
03/06/2013CN102956546A Copper interconnection structure and forming method thereof
03/06/2013CN102956545A Metal interconnection line manufacturing method
03/06/2013CN102956544A Metal interconnection line manufacturing method
03/06/2013CN102956543A Manufacturing method for through silicon via
03/06/2013CN102956542A Manufacturing method of semiconductor devices
03/06/2013CN102956541A Copper interconnection forming method
03/06/2013CN102956540A Production method of interconnection structure with materials containing polymer and metal through holes
03/06/2013CN102956539A Copper interconnection structure and manufacturing method thereof
03/06/2013CN102956538A Trench filling method and method of manufacturing semiconductor integrated circuit device
03/06/2013CN102956537A Shallow slot isolation structure and manufacturing method
03/06/2013CN102956536A Manufacturing method for quasi SOI (silicon on insulator) structure
03/06/2013CN102956535A 半导体器件及其制造方法 Semiconductor device and manufacturing method thereof
03/06/2013CN102956534A Technical method for alleviating narrow channel effect
03/06/2013CN102956533A Electrostatic chuck and semiconductor/liquid crystal manufacturing equipment
03/06/2013CN102956532A System and method for aligning a wafer for fabrication
03/06/2013CN102956531A Processing system and processing method
03/06/2013CN102956530A Method and device for separating wafers
03/06/2013CN102956529A Wafer boat package
03/06/2013CN102956528A Female die inclination-adjustable separate strip-filing system
03/06/2013CN102956527A Composite heating rail for packaging semiconductor device
03/06/2013CN102956526A System and method for obtaining silicon wafer position information by static synchronous scanning
03/06/2013CN102956525A Apparatus and method for installing chip
03/06/2013CN102956524A Temperature control method, temperature control apparatus, and heat treatment apparatus
03/06/2013CN102956523A Ultra-precision movement system
03/06/2013CN102956522A Film crack detection apparatus and film forming apparatus
03/06/2013CN102956521A Apparatus and methods for real-time error detection in cmp processing
03/06/2013CN102956520A Method of testing stacked semiconductor device structure
03/06/2013CN102956519A Sound-wave detection device and sound-wave detection method for detecting solar cell panel
03/06/2013CN102956518A Method for detecting wafer
03/06/2013CN102956517A Method for testing transmission fatigue of wafer
03/06/2013CN102956516A XY workbench structure of lead bonder
03/06/2013CN102956515A Silver-silicon eutectic soldering method of chips
03/06/2013CN102956514A Method for manufacturing semiconductor device and semiconductor device
03/06/2013CN102956513A Method, system and fixture for ball attachment in ball grid array devices
03/06/2013CN102956512A Flip-chip type semiconductor full-wave rectifying element and production method thereof
03/06/2013CN102956511A Semiconductor package structure and manufacturing method thereof
03/06/2013CN102956510A Method for manufacturing combination and power semiconductor module
03/06/2013CN102956509A Power device and method for packaging same
03/06/2013CN102956508A Laminating process and positioning tool of ceramic packaging shell with boss structure
03/06/2013CN102956507A Method of manufacturing metallized ceramic substrate
03/06/2013CN102956506A Heat radiation fin having rough surface and manufacturing method thereof
03/06/2013CN102956505A Manufacture method for switching tube and array substrate
03/06/2013CN102956504A Improved polycrystalline silicon exhausting method and MOS (Metal Oxide Semiconductor) transistors
03/06/2013CN102956503A Semiconductor dievices and methods of manufacturing same
03/06/2013CN102956502A Method of fabricating recessed channel access transistor device
03/06/2013CN102956501A Method of forming self-aligned contact opening in mosfet
03/06/2013CN102956500A Preparation method of polysilicon thin-film transistor
03/06/2013CN102956499A Preparation method of polysilicon film
03/06/2013CN102956498A Semiconductor device and manufacture method thereof
03/06/2013CN102956497A Transistor and forming method thereof
03/06/2013CN102956496A Fin type field effect transistor and manufacturing method thereof
03/06/2013CN102956495A Transistor structure, shallow groove isolation structure and manufacturing method thereof
03/06/2013CN102956494A Semiconductor device and manufacture method thereof
03/06/2013CN102956493A Transistor and forming method thereof
03/06/2013CN102956492A Semiconductor structure and manufacture method thereof and MOS (metal oxide semiconductor) transistor and manufacture method thereof
03/06/2013CN102956491A Method for manufacturing power transistor
03/06/2013CN102956490A Semiconductor device and manufacturing method for same
03/06/2013CN102956489A Manufacture method of trench transistor
03/06/2013CN102956488A Power transistor manufacture method
03/06/2013CN102956487A Manufacture method of isolation type power transistor
03/06/2013CN102956486A Semiconductor device structure and manufacturing method for same
03/06/2013CN102956485A Semiconductor device structure and manufacturing method for same
03/06/2013CN102956484A Manufacturing method of semiconductor devices
03/06/2013CN102956483A Semiconductor device structure and manufacturing method for same
03/06/2013CN102956482A Manufacturing method of semiconductor devices
03/06/2013CN102956481A Manufacturing method of trench power semiconductor elements with source-electrode trenches
03/06/2013CN102956480A Manufacturing method and device for reducing collector resistance through germanium-silicon HBT (Heterojunction Bipolar Transistor) with spuriously buried layer
03/06/2013CN102956479A Insulated gate bipolar transistor structure and manufacturing method thereof
03/06/2013CN102956478A Compensation method for increase of amplification times of direct current caused by thinning of germanium-silicon edge
03/06/2013CN102956477A Method for optimizing photoetching registration accuracy of emitting electrode of silicon germanium HBT (heterojunction bipolar transistor)
03/06/2013CN102956476A Rapid thermal annealing of gallium nitride light emitting diode
03/06/2013CN102956475A Preparation method of cross-polycrystalline silicon layer of Si-Ge bi-polar CMOS (complementary metal oxide semiconductor)
03/06/2013CN102956474A Manufacturing method of semiconductor devices
03/06/2013CN102956473A Method of depositing highly conformal amorphous carbon films over raised features
03/06/2013CN102956472A Zero mark formation method applicable to EPI (epitaxy) process
03/06/2013CN102956471A Silicon epitaxial filling method for deep trenches
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