Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
03/2013
03/13/2013CN102969320A Flexible display substrate and preparation method thereof as well as flexible display device
03/13/2013CN102969319A Method of fabricating flexible substrate structure
03/13/2013CN102969318A P-type one-time programmable (OTP) device and manufacturing method thereof
03/13/2013CN102969317A Semiconductor device with damascene bit line and method for manufacturing the same
03/13/2013CN102969316A Anti-single-particle-radiation MOSFET (Metal-Oxide-Semiconductor Field Effect Transistor) apparatus and preparation method
03/13/2013CN102969315A Reverse conducting integrated gate commutated thyristor
03/13/2013CN102969314A Semiconductor device and method of manufacturing the same
03/13/2013CN102969313A Semiconductor device and method of manufacturing the same
03/13/2013CN102969311A Array substrate and manufacturing method thereof, and display device
03/13/2013CN102969306A Power module and manufacturing method thereof
03/13/2013CN102969303A Semiconductor packaging structure and production method thereof
03/13/2013CN102969302A Electron beam aligning mark based on hafnium oxide and manufacturing method of mark
03/13/2013CN102969301A Semiconductor devices with self-heating structures, methods of manufacture thereof, and testing methods
03/13/2013CN102969299A Wiring structure and manufacturing method thereof, and electronic apparatus and manufacturing method thereof
03/13/2013CN102969298A Method of processing at least one die and die arrangement
03/13/2013CN102969293A Common-anode small-power silicon-controlled module and manufacturing process thereof
03/13/2013CN102969291A Quad flat no-lead (QFN) device and lead frame thereof
03/13/2013CN102969289A Semiconductor device and method for manufacturing the same
03/13/2013CN102969286A Semiconductor chip packaging structure and method
03/13/2013CN102969285A Semiconductor device and method of manufacturing the same
03/13/2013CN102969284A Chip-housing module and a method for forming a chip-housing module
03/13/2013CN102969282A Array substrate and manufacturing method thereof, and display device
03/13/2013CN102969281A Method for coupling top source line of self-aligned separation gate flash memory
03/13/2013CN102969280A Method for improving scaling performance of semiconductor device
03/13/2013CN102969279A Semiconductor device and method for manufacturing the same
03/13/2013CN102969278A Process for manufacturing floating body dynamic random access memory cell capable of improving data retention ability
03/13/2013CN102969277A Mosfet integrated circuit with improved silicide thickness uniformity and methods for its manufacture
03/13/2013CN102969276A Semiconductor device and manufacturing method thereof
03/13/2013CN102969275A Manufacture method of contact hole
03/13/2013CN102969274A Method for forming copper Damascus structure
03/13/2013CN102969273A Forming method of copper Damascus interconnection structure with air gaps
03/13/2013CN102969272A Semiconductor device and production method thereof
03/13/2013CN102969271A Semiconductor device and production method thereof
03/13/2013CN102969270A Semiconductor device and production method thereof
03/13/2013CN102969269A Semiconductor device and production method thereof
03/13/2013CN102969268A Method for manufacturing silicon-on-insulator silicon slice and floating body dynamic random access memory unit
03/13/2013CN102969267A Method for manufacturing silicon-on-insulator silicon slice and floating body dynamic random access memory unit
03/13/2013CN102969266A Method for manufacturing isolation structure of shallow groove
03/13/2013CN102969265A Method for manufacturing isolation structure of shallow groove
03/13/2013CN102969264A Stacked semiconductor devices and fabrication method/equipment for the same
03/13/2013CN102969263A Device and method for placing scheduled elements on target platform
03/13/2013CN102969262A Silicon wafer back-winding device
03/13/2013CN102969261A Substrate processing apparatus
03/13/2013CN102969260A Dry method chemical pre-cleaning process machine platform
03/13/2013CN102969259A Device and method for processing substrate
03/13/2013CN102969258A Substrate processing device and substrate conveying device
03/13/2013CN102969257A Substrate processing apparatus
03/13/2013CN102969256A Detection method of black silicon on top electrode of etching machine platform
03/13/2013CN102969255A System and method for obtaining position information of silicon wafers through static scanning
03/13/2013CN102969254A Dual-interface card packaging method
03/13/2013CN102969253A Lead bonding machine base
03/13/2013CN102969252A Semiconductor device packaging having pre-encapsulation through via formation using lead frames with attached signal conduits
03/13/2013CN102969251A Component substrate and manufacture method thereof
03/13/2013CN102969250A Preparation method of LTPS (Low Temperature Poly Silicon) thin film and thin film transistor, array substrate and display device
03/13/2013CN102969249A Method for manufacturing power device
03/13/2013CN102969248A Manufacturing method for fin type field effect transistor
03/13/2013CN102969247A Semiconductor structure and forming method thereof, transistor and transistor forming method
03/13/2013CN102969246A Planar thyristor manufacturing method
03/13/2013CN102969245A Manufacturing method of reverse-conducting integrated gate-commutated thyristor
03/13/2013CN102969244A SJ-insulated gate bipolar transistor (SJ-IGBT) device structure and manufacturing method thereof
03/13/2013CN102969243A Plane gate type IGBT (Insulated Gate Bipolar Translator) chip production method
03/13/2013CN102969242A Method for manufacturing embedding type epitaxy external base region bipolar transistor
03/13/2013CN102969241A Annealing method to reduce defects of epitaxial films and epitaxial films formed therewith
03/13/2013CN102969240A Method of controlling etch microloading for a tungsten-containing layer
03/13/2013CN102969239A Process and special device for improving isolating oxide chemical mechanical planarization (CMP) uniformity
03/13/2013CN102969238A Process for improving isolating oxide chemical mechanical planarization (CMP) uniformity
03/13/2013CN102969237A Method for forming grid electrode and method for flattening interlayer medium layer
03/13/2013CN102969236A 晶片的分割方法 Segmentation of the wafer
03/13/2013CN102969235A Method for forming space between small-sized line ends
03/13/2013CN102969234A Method for manufacturing metal gate electrode
03/13/2013CN102969233A Semiconductor device and method for forming the same
03/13/2013CN102969232A Manufacture method of false gate of back gate process
03/13/2013CN102969231A Manufacturing method of metal gate
03/13/2013CN102969230A System and method for critical dimension reduction and pitch reduction
03/13/2013CN102969229A High-density silica back sealing process for heavily-doped-phosphorous monocrystalline silicon wafer
03/13/2013CN102969228A Polycrystalline silicon resistor structure and manufacturing method thereof
03/13/2013CN102969227A Vacuum device capable of integrating ultraviolet light chemistry and chemical vapor dry surface treatment
03/13/2013CN102969226A Device and system for processing edge of wafer
03/13/2013CN102969225A Halbleiterbauelement mit einer amorphen halb-isolierenden schicht, temperatursensor und verfahren zur herstellung eines halbleiterbauelements
03/13/2013CN102969224A Substrate processing method and substrate processing apparatus
03/13/2013CN102969223A Substrate processing device and substrate processing method
03/13/2013CN102969222A Production method for silicon nanowire (SINW) device compatible with complementary metal oxide semiconductor (CMOS) technology
03/13/2013CN102969221A Wafer cleaning method capable of reducing water mark defects and manufacturing method of semiconductor devices
03/13/2013CN102969220A Technical processing method through furnace tube
03/13/2013CN102969215A Low sloped edge ring for plasma processing chamber
03/13/2013CN102969214A Subtrate processing device and substrate processing system equipped with the same
03/13/2013CN102968003A Method for removing photoresist
03/13/2013CN102967978A Array substrate, manufacture method thereof and display device
03/13/2013CN102967976A Mirror surface display substrate and manufacturing method thereof as well as liquid crystal mirror surface display substrate
03/13/2013CN102967972A Capacitive touch array substrate and manufacturing method thereof and liquid crystal panel
03/13/2013CN102967970A Array substrate, liquid display element, and method for manufacturing array subsrtate
03/13/2013CN102965643A Substrate processing apparatus and film deposition apparatus
03/13/2013CN102965025A Polishing agent for silicon oxide, liquid additive, and method of polishing
03/13/2013CN102962760A Device for maintaining stable grinding rate and method thereof
03/13/2013CN102962588A Method for fabricating invisibly structured substrate
03/13/2013CN102375350B Detection layout and detection method of development technology
03/13/2013CN102332421B Multipurpose series suction pen of solar battery
03/13/2013CN102315246B Relaxation SiGe virtual substrate and preparation method thereof
03/13/2013CN102294648B Method for chemically and mechanically polishing metals
03/13/2013CN102290332B Method for preparing high-density silicon nanopore array
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