Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
03/2013
03/14/2013WO2013036016A2 Vacuum drying apparatus
03/14/2013WO2013035983A1 Apparatus and method for plasma ion implantation
03/14/2013WO2013035900A1 Method for manufacturing graphene film and pattern thereof
03/14/2013WO2013035876A1 Chemical bath deposition apparatus, method of forming buffer layer and method of manufacturing photoelectric conversion device
03/14/2013WO2013035871A1 Sealant composition for electronic device
03/14/2013WO2013035869A1 Underfill composition
03/14/2013WO2013035868A1 Composition for electronic device
03/14/2013WO2013035845A1 Ga2o3 semiconductor element
03/14/2013WO2013035844A1 Ga2o3 semiconductor element
03/14/2013WO2013035843A1 Ga2O3 SEMICONDUCTOR ELEMENT
03/14/2013WO2013035842A1 Ga2O3 SEMICONDUCTOR ELEMENT
03/14/2013WO2013035841A1 Ga2O3 HEMT
03/14/2013WO2013035839A1 Transparent film having micro-convexoconcave structure on surface thereof, method for producing same, and substrate film used in production of transparent film
03/14/2013WO2013035817A1 Semiconductor device and method for manufacturing semiconductor device
03/14/2013WO2013035787A1 Polymer and composition including same, and adhesive composition
03/14/2013WO2013035768A1 Semiconductor device and method for manufacturing semiconductor device
03/14/2013WO2013035761A1 Imprint apparatus, imprint method, and manufacturing method of commodities
03/14/2013WO2013035759A1 Fluid pressure imprinting device provided with rigid stage, and pressurizing stage
03/14/2013WO2013035749A1 Dicing die bonding film packing structure and packing method
03/14/2013WO2013035731A1 Liquid treatment apparatus for substrate, and method for controlling liquid treatment apparatus for substrate
03/14/2013WO2013035696A1 Substrate transfer apparatus and substrate processing apparatus
03/14/2013WO2013035691A1 Sic epitaxial wafer and method for manufacturing same
03/14/2013WO2013035672A1 Film-forming material, group iv metal oxide film and vinylene diamide complex
03/14/2013WO2013035642A1 Method for manufacturing imprint mold, and resist developing device
03/14/2013WO2013035621A1 Joining method, computer storage medium and joining system
03/14/2013WO2013035620A1 Joining method and joining system
03/14/2013WO2013035599A1 Joining method, computer storage medium, and joining system
03/14/2013WO2013035590A1 Separation method, computer storage medium, and separation system
03/14/2013WO2013035561A1 Semiconductor device manufacturing method and substrate treatment system
03/14/2013WO2013035558A1 Film-forming material, sealing film using same, and use of sealing film
03/14/2013WO2013035539A1 Polishing agent and polishing method
03/14/2013WO2013035510A1 Plasma etching method
03/14/2013WO2013035499A1 Thermosetting crosslinked cyclic olefin resin film and method for producing same
03/14/2013WO2013035480A1 Catalyst adsorption method and adsorption device
03/14/2013WO2013035476A1 Dry etching method
03/14/2013WO2013035472A1 Substrate for epitaxial growth, and crystal laminate structure
03/14/2013WO2013035466A1 Joining method, computer recording medium, and joining system
03/14/2013WO2013035465A1 Method for controlling concentration of donor in ga2o3-based single crystal
03/14/2013WO2013035464A1 Crystal laminate structure and method for producing same
03/14/2013WO2013035438A1 Coolant regeneration method
03/14/2013WO2013035430A1 Defect inspection device and method for tft substrate
03/14/2013WO2013035421A1 Region setting device, observation device or inspection device, region setting method, and observation method or inspection method using region setting method
03/14/2013WO2013035419A1 Defect inspection method and defect inspection device
03/14/2013WO2013035415A1 Reticle chuck cleaner and reticle chuck cleaning method
03/14/2013WO2013035394A1 Active matrix display device
03/14/2013WO2013035377A1 Plasma generation device, cvd device and plasma treatment particle generation divice
03/14/2013WO2013035375A1 Plasma generator and cvd device
03/14/2013WO2013035373A1 Saw wire, and method for producing iii-nitride crystal substrate using same
03/14/2013WO2013035364A1 Pattern measurement device and pattern measurement method
03/14/2013WO2013035335A1 Sputtering target
03/14/2013WO2013035325A1 Nitride semiconductor structure and method of fabricating same
03/14/2013WO2013035300A1 Semiconductor element, semiconductor device, and semiconductor element manufacturing method
03/14/2013WO2013035251A1 Vacuum thermal bonding device and vacuum thermal bonding method
03/14/2013WO2013035248A1 Method for calculating concentration of nitrogen and method for calculating shift amount of resistivity in silicon single crystal
03/14/2013WO2013035232A1 Material vaporization supply device equipped with material concentration detection mechanism
03/14/2013WO2013035206A1 Sealant composition for electronic device
03/14/2013WO2013035205A1 Underfill composition
03/14/2013WO2013035204A1 Composition for electronic device
03/14/2013WO2013035164A1 Adhesive composition and connection body
03/14/2013WO2013035044A1 Modular heater
03/14/2013WO2013035041A1 Heater elements with enhanced cooling
03/14/2013WO2013035037A1 Container storage add-on for bare workpiece stocker
03/14/2013WO2013035020A1 Method and apparatus for liquid treatment of wafer shaped articles
03/14/2013WO2013035019A2 Apparatus for treating surfaces of wafer-shaped articles
03/14/2013WO2013034493A1 Pressing tool and method for producing a silicone element
03/14/2013WO2013034409A1 Vacuum leadthrough, and vacuum coating device having vacuum leadthroughs
03/14/2013WO2013034394A1 Component and method for producing a component
03/14/2013WO2013033986A1 Method for manufacturing miniature fin-shaped structure
03/14/2013WO2013033956A1 Semiconductor device and manufacturing method thereof
03/14/2013WO2013033952A1 Semiconductor device and manufacturing method thereof
03/14/2013WO2013033943A1 Thin film transistor and manufacturing method thereof
03/14/2013WO2013033877A1 Semiconductor structure and manufacturing method thereof
03/14/2013WO2013033876A1 Semiconductor substrate, integrated circuit with the semiconductor substrate, and method for manufacturing same
03/14/2013WO2013033875A1 Method for manufacturing electrode and connection in back gate process
03/14/2013WO2013033810A1 Forming an oxide layer on a flat conductive surface
03/14/2013WO2013033768A1 Method of crystallising thin films
03/14/2013WO2013013204A3 Compliant interconnect pillars with orientation or geometry dependent on the position on a die or formed with a patterned structure between the pillar and a die pad for reduction of thermal stress
03/14/2013WO2013012536A3 Surface treatment and deposition for reduced outgassing
03/14/2013WO2013012210A3 Tray for loading substrates
03/14/2013WO2013012195A3 Method for manufacturing substrate and method or manufacturing electronic device using same
03/14/2013WO2013009064A3 Apparatus for filling a wafer via with solder and having a pressure unit, and method for filling a wafer via with solder using same
03/14/2013WO2013009026A3 Method for evaluating wafer defects
03/14/2013WO2013009000A3 Led production device
03/14/2013WO2013006494A3 Multi-channel de-applicator
03/14/2013WO2013006151A3 Transitioned film growth for conductive semiconductor materials
03/14/2013WO2013005975A3 Method of evaluating quality of wafer or single crystal ingot and method of controlling quality of single crystal ingot by using the same
03/14/2013WO2013004543A9 Method for producing structured sintering connection layers and semiconductor component comprising a structured sintering connection layer
03/14/2013WO2013003745A3 Method of stack patterning using a ion etching
03/14/2013WO2013002900A4 AlGaN/GaN HYBRID MOS-HFET
03/14/2013WO2012177789A3 Integrated process modulation for psg gapfill
03/14/2013WO2012177293A3 Transmission line rf applicator for plasma chamber
03/14/2013WO2012173824A3 Enhanced magnesium incorporation into gallium nitride films through high pressure or ald-type processing
03/14/2013WO2012173791A3 Wafer dicing using hybrid galvanic laser scribing process with plasma etch
03/14/2013WO2012173790A3 Hybrid laser and plasma etch wafer dicing using substrate carrier
03/14/2013WO2012170409A3 Techniques for providing a semiconductor memory device
03/14/2013WO2012170249A3 Use of spectrum to synchronize rf switching with gas switching during etch
03/14/2013WO2012170129A3 Semiconductor constructions having through-substrate interconnects, and methods of forming through-substrate interconnects
03/14/2013WO2012166313A4 Apparatus and methods for positioning a substrate using capacitive sensors
03/14/2013WO2012158966A3 Electrochemical processor
03/14/2013WO2012154747A4 High pressure bevel etch process
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