Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
03/2013
03/19/2013US8399327 Methods of manufacturing a semiconductor device
03/19/2013US8399326 Method of manufacturing memory devices
03/19/2013US8399325 Method for producing an electrode structure
03/19/2013US8399324 Semiconductor device and method of fabricating the same
03/19/2013US8399323 Method for fabricating vertical channel type nonvolatile memory device
03/19/2013US8399322 Non-volatile semiconductor memory device and method of manufacturing the same
03/19/2013US8399321 Method for manufacturing memory device
03/19/2013US8399320 Electronic apparatus containing lanthanide yttrium aluminum oxide
03/19/2013US8399319 Semiconductor device and method for manufacturing the same
03/19/2013US8399318 Method of forming an electrical fuse and a metal gate transistor and the related electrical fuse
03/19/2013US8399317 Transistor having an etch stop layer including a metal compound that is selectively formed over a metal gate, and method therefor
03/19/2013US8399316 Method for making asymmetric double-gate transistors
03/19/2013US8399315 Semiconductor structure and method for manufacturing the same
03/19/2013US8399314 p-FET with a strained nanowire channel and embedded SiGe source and drain stressors
03/19/2013US8399313 Method of manufacturing semiconductor device having first conductive layer including aluminum
03/19/2013US8399312 Methods of forming radiation-hardened semiconductor structures
03/19/2013US8399311 Thin film transistor array panel and method of manufacture
03/19/2013US8399310 Non-volatile memory and logic circuit process integration
03/19/2013US8399309 Semiconductor device manufacturing method
03/19/2013US8399308 Method for forming semiconductor device having metallization comprising select lines, bit lines and word lines
03/19/2013US8399307 Interconnects for stacked non-volatile memory device and method
03/19/2013US8399306 Integrated circuit packaging system with transparent encapsulation and method of manufacture thereof
03/19/2013US8399305 Semiconductor device and method of forming dam material with openings around semiconductor die for mold underfill using dispenser and vacuum assist
03/19/2013US8399304 Thin film capacitor and method of fabrication thereof
03/19/2013US8399303 Method for manufacturing modularized integrated circuit
03/19/2013US8399302 Method of manufacturing semiconductor device
03/19/2013US8399301 Mounting structures for integrated circuit modules
03/19/2013US8399300 Semiconductor device and method of forming adjacent channel and DAM material around die attach area of substrate to control outward flow of underfill material
03/19/2013US8399299 Cavity structure comprising an adhesion interface composed of getter material
03/19/2013US8399298 Rule-based semiconductor die stacking and bonding within a multi-die package
03/19/2013US8399297 Methods of forming and assembling pre-encapsulated assemblies and of forming associated semiconductor device packages
03/19/2013US8399296 Airgap micro-spring interconnect with bonded underfill seal
03/19/2013US8399295 Semiconductor device and its manufacture method
03/19/2013US8399294 Semiconductor package for discharging heat and method for fabricating the same
03/19/2013US8399293 Method for packaging electronic devices and integrated circuits
03/19/2013US8399292 Fabricating a semiconductor chip with backside optical vias
03/19/2013US8399291 Underfill device and method
03/19/2013US8399290 Organic transistor with fluropolymer banked crystallization well
03/19/2013US8399287 Method of manufacturing solar cell
03/19/2013US8399286 Semiconductor device and method of making thereof
03/19/2013US8399284 Method of manufacturing the organic light-emitting display
03/19/2013US8399282 Method for forming pad in wafer with three-dimensional stacking structure
03/19/2013US8399281 Two beam backside laser dicing of semiconductor films
03/19/2013US8399280 Method for protecting an integrated circuit chip against laser attacks
03/19/2013US8399279 Fabrication method of carbon nanotube film and sensor based on carbon nanotube film
03/19/2013US8399278 Capacitive micromachined ultrasonic transducer and manufacturing method
03/19/2013US8399277 Compound semiconductor light-emitting diode and method for fabrication thereof
03/19/2013US8399276 Electro-optic device and method for manufacturing the same
03/19/2013US8399275 Method for manufacturing semiconductor light emitting device
03/19/2013US8399274 Organic light emitting display and method of manufacturing the same
03/19/2013US8399273 Light-emitting diode with current-spreading region
03/19/2013US8399272 Method of manufacturing semiconductor light emitting element
03/19/2013US8399271 Display apparatus with storage electrodes having concavo-convex features
03/19/2013US8399269 LED flip-chip package structure with dummy bumps
03/19/2013US8399268 Deposition of phosphor on die top using dry film photoresist
03/19/2013US8399267 Methods for packaging light emitting devices and related microelectronic devices
03/19/2013US8399265 Device for releasably receiving a semiconductor chip
03/19/2013US8399264 Alignment inspection
03/19/2013US8399263 Method for measuring expansion/contraction, method for processing substrate, method for producing device, apparatus for measuring expansion/contraction, and apparatus for processing substrate
03/19/2013US8399095 Solar cells modules comprising low haze encapsulants
03/19/2013US8399082 High-clarity blended ionomer compositions and articles comprising the same
03/19/2013US8399081 Solar cell modules comprising encapsulant sheets with low haze and high moisture resistance
03/19/2013US8398874 Methods of manufacturing semiconductors using dummy patterns
03/19/2013US8398868 Directed self-assembly of block copolymers using segmented prepatterns
03/19/2013US8398816 Method and apparatuses for reducing porogen accumulation from a UV-cure chamber
03/19/2013US8398815 Plasma processing apparatus
03/19/2013US8398814 Tunable gas flow equalizer
03/19/2013US8398813 Processing apparatus and processing method
03/19/2013US8398811 Polishing apparatus and polishing method
03/19/2013US8398777 System and method for pedestal adjustment
03/19/2013US8398775 Electrode and arrangement with movable shield
03/19/2013US8398771 Substrate processing apparatus
03/19/2013US8398770 Deposition system for thin film formation
03/19/2013US8398769 Chemical vapor deposition apparatus
03/19/2013US8398725 Light exposure apparatus and manufacturing method of semiconductor device using the same
03/19/2013US8398456 Polishing method, polishing apparatus and method of monitoring a substrate
03/19/2013US8398355 Linearly distributed semiconductor workpiece processing tool
03/19/2013US8398320 Non-transitory storage medium for rinsing or developing sequence
03/19/2013US8397668 Plasma processing apparatus
03/19/2013US8397667 Process and apparatus for the plasma coating of workpieces with spectral evaluation of the process parameters
03/19/2013CA2505593C Semiconductor substrate having copper/diamond composite material and method of making same
03/19/2013CA2499965C Large-area nanoenabled macroelectronic substrates and uses therefor
03/14/2013WO2013036953A2 Multiple frequency sputtering for enhancement in deposition rate and growth kinetics dielectric materials
03/14/2013WO2013036948A1 Soldering relief method and semiconductor device employing same
03/14/2013WO2013036806A2 Methods for manufacturing integrated circuit devices having features with reduced edge curvature
03/14/2013WO2013036667A2 Flowable silicon-carbon-nitrogen layers for semiconductor processing
03/14/2013WO2013036660A2 Passive position compensation of a spindle, stage, or component exposed to a heat load
03/14/2013WO2013036638A2 Use of megasonic energy to assist edge bond removal in a zonal temporary bonding process
03/14/2013WO2013036619A2 Method and apparatus for gas distribution and plasma application in a linear deposition chamber
03/14/2013WO2013036615A1 Linear stage for reflective electron beam lithography
03/14/2013WO2013036593A1 Semiconductor device with low-conducting field-controlling element
03/14/2013WO2013036589A1 Patterned substrate design for layer growth
03/14/2013WO2013036565A1 Direct metalization of electrical circuit structures
03/14/2013WO2013036555A1 Block copolymers and lithographic patterning using same
03/14/2013WO2013036395A1 Solder mask with anchor structures
03/14/2013WO2013036376A2 Methods for the epitaxial growth of silicon carbide
03/14/2013WO2013036371A2 Pulsed plasma chamber in dual chamber configuration
03/14/2013WO2013036230A1 Patterned adhesive tape for backgrinding processes
03/14/2013WO2013036206A1 An apparatus and a method for controlling temperature of a heating element in a thermocompression bonding process
03/14/2013WO2013036018A2 Substrate processing apparatus
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