Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
01/1989
01/31/1989US4801351 Method of manufacturing monocrystalline thin-film
01/31/1989US4801350 Semiconductor wafers, multilayer deposits, etching masking
01/31/1989US4801335 Rinsing in acid processing of substrates
01/31/1989US4801241 Modular article processing machine and method of article handling therein
01/31/1989US4801234 Vacuum pick and place mechanism for integrated circuit test handler
01/31/1989US4801208 Projection type exposing apparatus
01/31/1989US4801168 Device for transferring semiconductor wafers
01/31/1989US4801067 Forming copper buffer and nickel, palladium, or platinum barrier layer and brazing
01/31/1989CA1249669A1 Semiconductor die attach system
01/31/1989CA1249667A1 Buried hall element
01/26/1989WO1989000769A1 Substrate for highly bright led and method of epitaxially growing the same
01/26/1989WO1989000768A1 Rotatable pick and place vacuum sense head for die bonding apparatus
01/26/1989EP0249625A4 Ink jet barrier layer and orifice plate printhead and fabrication method.
01/25/1989EP0300904A1 Process for the epitaxial growth of layers of III-V or II-VI materials by rapid temperature modulation
01/25/1989EP0300873A1 Soldering furnace for integrated-circuit chips
01/25/1989EP0300864A2 Apparatus for the detection of integrated-circuit de-passivation
01/25/1989EP0300803A2 High-frequency bipolar transistor and its fabrication method
01/25/1989EP0300799A2 Photovoltaic element with a semiconductor layer comprising non-single crystal material containing at least Zn,Se and H in an amount of 1 to 4 atomic %
01/25/1989EP0300798A2 Functional ZnSe:H deposited films
01/25/1989EP0300728A2 Method of producing polydiacetylene thin film
01/25/1989EP0300720A1 Multilevel interconnect transfer process
01/25/1989EP0300590A2 Semiconductor device package structure
01/25/1989EP0300569A1 Method of manufacturing a semiconductor device having a planarized construction
01/25/1989EP0300567A2 Method of applying thin layers of oxidic superconductive material
01/25/1989EP0300563A2 Method of manufacturing semiconductor devices in which a surface of a semiconductor structure is selectively treated
01/25/1989EP0300514A1 Semiconductor device with a sidelong contact structure, and its manufacture
01/25/1989EP0300433A2 Method for manufacturing bonded semiconductor body
01/25/1989EP0300414A1 Method of connecting wirings through connection hole
01/25/1989EP0300226A2 Laminate for the formation of beam leads for IC chip bonding
01/25/1989EP0300217A2 Processing apparatus and method
01/25/1989EP0300191A1 Device for storing, isolating and feeding components loadable in bulk
01/25/1989EP0300186A1 Process for producing a multilayer ceramic substrate
01/25/1989EP0300157A2 Vertical transistor capacitor memory cell structure and fabrication method therefor
01/25/1989EP0300011A1 Method for producing electric insulation zones in a cmos integrated circuit.
01/25/1989EP0299987A1 Ball bonding process and device.
01/24/1989US4800579 Charge transfer device provided with charge detection circuit of a floating gate system
01/24/1989US4800528 Non-volatile memory having charge correction circuitry
01/24/1989US4800527 Semiconductor memory device
01/24/1989US4800421 Glass bonding means and method
01/24/1989US4800420 Two-terminal semiconductor diode arrangement
01/24/1989US4800419 Support assembly for integrated circuits
01/24/1989US4800418 Integrated circuit with improved monitoring function by use of built-in elements
01/24/1989US4800417 Improved semiconductor device having a polycrystalline isolation region
01/24/1989US4800416 Bipolar power transistor having bypassable incorporated-base ballast resistance
01/24/1989US4800268 Method and apparatus for scanning a laser beam to examine the surface of semiconductor wafer
01/24/1989US4800251 Apparatus for forming a resist pattern
01/24/1989US4800179 Contact hole, multilayer films, wires, lasers
01/24/1989US4800178 Electrodeposition, tapes, passivation
01/24/1989US4800177 Dopes, multilayer structure
01/24/1989US4800176 Multilayer, dopes
01/24/1989US4800175 Boron ceramic
01/24/1989US4800174 Method for producing an amorphous silicon semiconductor device using a multichamber PECVD apparatus
01/24/1989US4800173 Process for preparing Si or Ge epitaxial film using fluorine oxidant
01/24/1989US4800172 Manufacturing method for cascaded junction field effect transistor
01/24/1989US4800171 Method for making bipolar and CMOS integrated circuit structures
01/24/1989US4800170 Process for forming in a silicon oxide layer a portion with vertical side walls
01/24/1989US4800152 Negative resist compositions
01/24/1989US4800002 Method of making a diamond heat sink
01/24/1989US4799993 Removing unhardened portions in electronic parts; forming vias
01/24/1989US4799992 Interlevel dielectric fabrication process
01/24/1989US4799991 Semiconductors
01/24/1989US4799990 Method of self-aligning a trench isolation structure to an implanted well region
01/24/1989US4799984 Method for fabricating multilayer circuits
01/24/1989US4799983 Multilayer ceramic substrate and process for forming therefor
01/24/1989US4799968 Photovoltaic device
01/24/1989US4799958 Tungsten, frit, binder, high temperature firing
01/24/1989US4799854 Rotatable pick and place vacuum sense head for die bonding apparatus
01/24/1989US4799615 Collet holder
01/24/1989US4799454 Apparatus for forming a thin film
01/24/1989US4799451 Chemical vapor processing apparatus
01/24/1989CA1249379A1 Integrated circuit device having stacked conductive layers connecting circuit elements therethrough
01/24/1989CA1249361A1 Electrodeposition of photovoltaic layer utilizing cadmium rich hg1-xcdxte
01/19/1989EP0167589A4 Method of fabricating solar cells.
01/19/1989EP0134232A4 Method of fabricating solar cells.
01/18/1989EP0299951A2 Process and apparatus for mask inspection
01/18/1989EP0299894A1 Process for making a connection to an integrated circuit contact stud, and contact structure
01/18/1989EP0299887A1 Test appliance and process for an integrated circuit so as to measure surface layer effects
01/18/1989EP0299853A1 Process for producing a memory cell
01/18/1989EP0299775A2 Method of assembling a tab bonded semiconductor chip package
01/18/1989EP0299633A2 Programmable capacitance divider
01/18/1989EP0299605A2 Iron-copper-chromium alloy for high-strength lead frame or pin grid array and process for preparation thereof
01/18/1989EP0299576A2 X-ray lithography system
01/18/1989EP0299570A1 Process for preparing oriented wafer substrates, from massive III-V semiconductor ingots
01/18/1989EP0299525A2 Semiconductor memory device with improved capacitor structure
01/18/1989EP0299505A2 Semiconductor device and manufacturing method thereof
01/18/1989EP0299452A2 Polyquinoxaline polymers, and articles comprising same
01/18/1989EP0299427A2 Voltage detector
01/18/1989EP0299252A2 Integrated circuit lead frame assembly containing voltage bussing and distribution to an integrated circuit die using tape automated bonding with two metal layers
01/18/1989EP0299249A1 Processing apparatus and method
01/18/1989EP0299248A1 Processing apparatus and method
01/18/1989EP0299246A1 Processing apparatus and method
01/18/1989EP0299245A1 Processing apparatus and method
01/18/1989EP0299244A1 Processing apparatus and method
01/18/1989EP0299243A1 Processing apparatus and method
01/18/1989EP0299216A1 Device for storing, isolating and feeding components loadable in bulk
01/18/1989EP0299163A2 Interconnection method for semiconductor device
01/18/1989EP0299087A1 Semiconductor device and method of fabricating the same
01/18/1989EP0299062A1 Process for producing thin single crystal silicon islands on insulator
01/18/1989EP0299037A1 Method for producing electric insulation zones in a cmos integrated circuit.
01/18/1989EP0198040B1 Nonvolatile memory cell