Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
01/1989
01/10/1989US4797054 Apparatus for loading and unloading a vacuum processing chamber
01/10/1989US4797053 Manipulator for vacuum applications
01/10/1989US4796562 Rapid thermal cvd apparatus
01/10/1989CA1248641A1 Method for producing coplanar multi-level metal/insulator films on a substrate and for forming patterned conductive lines simultaneously with stud vias
01/10/1989CA1248597A1 Special interconnect for configurable logic array
01/10/1989CA1248403A1 Bilevel resist
01/10/1989CA1248402A1 Method of making articles using gas functionalized plasma developed layer
01/04/1989EP0297963A1 Method of connecting a lead to a doped region of an integrated circuit substrate by laser,and integrated circuit made by this method
01/04/1989EP0297898A2 Method of dry etching
01/04/1989EP0297886A2 Heterojunction bipolar transistor
01/04/1989EP0297825A1 Light-sensitive 1,2-naphthoquinone-2-diazide-4-sulfonic acid monoesters and their use in light-sensitive mixtures
01/04/1989EP0297821A2 Semiconductor integrated circuit device having gate array and memory
01/04/1989EP0297799A1 Manufacture of Solar Cells
01/04/1989EP0297778A2 Apparatus including resonant-tunneling device having multiple-peak current-voltage characteristics
01/04/1989EP0297777A2 Ferroelectric shadow ram
01/04/1989EP0297655A1 Semiconductor device provided with a charge transfer device
01/04/1989EP0297648A2 Method of shaping the edges of slices of semiconductor material and corresponding apparatus
01/04/1989EP0297559A2 Photosensor
01/04/1989EP0297521A1 High temperature heating sputtering process
01/04/1989EP0297511A2 Connection structure between components for semiconductor apparatus
01/04/1989EP0297508A2 Complementary heterostructure semiconductor device
01/04/1989EP0297506A2 Removal of particles from solid-state surfaces by laser bombardement
01/04/1989EP0297502A2 Method of and apparatus for sputtering
01/04/1989EP0297350A2 Static ram cell with trench pull-down transistors and buried-layer ground plate
01/04/1989EP0297348A1 Method for chemical vapor deposition of copper, silver, and gold using a cyclopentadienyl metal complex
01/04/1989EP0297335A2 Single tub transistor and method for its fabrication
01/04/1989EP0297325A2 Gate turn-off thyristor and manufacturing method thereof
01/04/1989EP0297247A1 Electron beam writing method and system using large range deflection in combination with a continuously moving table
01/04/1989EP0297244A2 Single lead automatic clamping and bonding system
01/04/1989EP0297161A1 Projection exposure system
01/04/1989EP0297153A1 Novel photosensitive resin compositions
01/04/1989EP0162061B1 Fabrication of group iii-v compound semiconductor devices having high and low resistivity regions
01/04/1989EP0162057B1 Method of fabricating algaas semiconductor devices having high and low resistivity regions
01/04/1989CN1030158A Method of manufacturing superconductor and superconductive circuit
01/04/1989CN1030129A Process for treating gaseous effluents coming from manufacture of electronic components and incineration apparatus for carrying out said process
01/04/1989CN1030094A Determination of ions in fluids
01/03/1989USH569 Silicon substrate doped with oxygen-shields
01/03/1989US4796228 Erasable electrically programmable read only memory cell using trench edge tunnelling
01/03/1989US4796194 Real world modeling and control process
01/03/1989US4796156 Self packaging chip mount
01/03/1989US4796084 Semiconductor device having high resistance to electrostatic and electromagnetic induction using a complementary shield pattern
01/03/1989US4796082 Thermally stable ohmic contact for gallium-arsenide
01/03/1989US4796081 Low resistance metal contact for silicon devices
01/03/1989US4796077 Blend with silicon carbide
01/03/1989US4796074 Method of fabricating a high density masked programmable read-only memory
01/03/1989US4796073 Front-surface N+ gettering techniques for reducing noise in integrated circuits
01/03/1989US4796071 Charge coupled device delay line
01/03/1989US4796068 Semiconductor device having ultrahigh-mobility
01/03/1989US4796067 Semiconductor device having a superlattice structure
01/03/1989US4795964 Method and apparatus for measuring the capacitance of complementary field-effect transistor devices
01/03/1989US4795722 Doping, forming silicide, and etching
01/03/1989US4795721 Walled slot devices and method of making same
01/03/1989US4795720 Method for producing semiconductor devices and cutting fuses
01/03/1989US4795719 Self-aligned split gate eprom process
01/03/1989US4795718 Self-aligned contact for MOS processing
01/03/1989US4795717 Multilayer-doping semiconductor before applying next layer
01/03/1989US4795716 Method of making a power IC structure with enhancement and/or CMOS logic
01/03/1989US4795694 Integrated circuits
01/03/1989US4795679 Monocrystalline silicon layers on substrates
01/03/1989US4795582 Surface treating composition for micro processing
01/03/1989US4795529 Plasma treating method and apparatus therefor
01/03/1989US4795518 Method using a multiple device vacuum chuck for an automatic microelectronic bonding apparatus
01/03/1989US4795497 Method and system for fluid treatment of semiconductor wafers
01/03/1989US4795299 Dial deposition and processing apparatus
01/03/1989US4795260 Apparatus for locating and testing areas of interest on a workpiece
01/03/1989US4795077 Bonding method and apparatus
01/03/1989CA1248231A1 High density memory
01/03/1989CA1248210A1 Upstream cathode assembly
01/03/1989CA1248047A1 Method of making amorphous semiconductor alloys and devices using microwave energy
01/03/1989CA1247947A1 Method of manufacturing semiconductor device
01/03/1989CA1247943A1 Electrically and thermally conductive adhesive transfer tape
01/03/1989CA1247840A1 Gauging method and apparatus for components having leads
12/1988
12/29/1988WO1988010513A1 Manufacture of solar cells
12/29/1988WO1988010510A1 Semiconductor field oxide formation process
12/29/1988WO1988010509A1 Method for fabricating a tape for electronic module circuits, and tape obtained according to such method
12/29/1988WO1988010506A1 Microwave plasma generator
12/29/1988WO1988010472A1 Moat router for integrated circuits
12/29/1988WO1988010324A1 Improved reaction chambers and methods for cvd
12/29/1988WO1988010322A1 Heating system for reaction chamber of chemical vapor deposition equipment
12/29/1988WO1988010224A1 Handler for ic packages
12/29/1988WO1988009599A3 Gold compression bonding
12/29/1988WO1988008965A3 Temperature-measurement device for semiconductors, process for its manufacture and process for measuring the temperature of semiconductors during annealing processes
12/29/1988DE3815569A1 Method for the selective deposition of a conductive material in the fabrication of integrated circuits
12/29/1988DE3720465A1 Adhesion promoter for negative resist for the purpose of etching deep trenches in silicon wafers having a smooth surface, and method for preparing the adhesion promoter
12/29/1988DE3720305A1 Semiconductor contact
12/29/1988DE3720304A1 Structured semiconductor body
12/29/1988DE3719746A1 Integrated logic circuit
12/29/1988DE3719742A1 Arrangement and method for separation of the semiconductor chips contained in a wafer whilst maintaining their order
12/28/1988EP0296997A1 Power mos transistors structure
12/28/1988EP0296944A1 Method of processing gaseous effluents coming from the production of electronic components and incinerator for carrying out this method
12/28/1988EP0296925A1 High cut-off frequency bipolar transistor
12/28/1988EP0296910A2 Method of improving the corrosion resistance of aluminium contacts on semiconductors
12/28/1988EP0296891A2 Process for self-cleaning of a reactor chamber
12/28/1988EP0296771A2 Semiconductor device with a buried layer, and method of manufacture
12/28/1988EP0296754A2 Method of manufacturing a semiconductor device having a trench isolation region,
12/28/1988EP0296747A1 Integrated circuit with tub tie
12/28/1988EP0296718A2 A coplanar and self-aligned contact structure
12/28/1988EP0296707A1 Incorporation of dielectric layers in a semiconductor
12/28/1988EP0296702A2 Method of forming semiconducting amorphous silicon films from the thermal decompositon of fluorohydridodisilanes
12/28/1988EP0296681A1 Integrated circuit comprising an on-chip supply voltage reducer