Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
03/1989
03/28/1989US4816732 Robotic hand for transporting semiconductor wafer carriers
03/28/1989US4816702 CMOS logic circuit
03/28/1989US4816692 Pattern splicing system and method for scanning of electron beam system
03/28/1989US4816666 Apparatus and methods for inspection of electrical materials and components
03/28/1989US4816638 Vacuum processing apparatus
03/28/1989US4816427 Process for connecting lead frame to semiconductor device
03/28/1989US4816426 Process for manufacturing plastic pin grid arrays and the product produced thereby
03/28/1989US4816424 Refractory metal nitride barrier
03/28/1989US4816423 Forming oxide, patterning; forming tefractory metal silicide and doping
03/28/1989US4816422 Fabrication of large power semiconductor composite by wafer interconnection of individual devices
03/28/1989US4816421 Method of making a heteroepitaxial structure by mesotaxy induced by buried implantation
03/28/1989US4816420 Method of producing tandem solar cell devices from sheets of crystalline material
03/28/1989US4816383 Method for forming fine patterns of conjugated polymers
03/28/1989US4816380 Water soluble contrast enhancement layer method of forming resist image on semiconductor chip
03/28/1989US4816323 Ceramic substrate, electroconductive metal and fluoropolymer dielectric overcoating
03/28/1989US4816126 As conductor in integrated circuit, aluminum or alloy
03/28/1989US4816120 Electrodeposited doped II-VI semiconductor films and devices incorporating such films
03/28/1989US4816116 Semiconductor wafer transfer method and arm mechanism
03/28/1989US4816115 Process of making via holes in a double-layer insulation
03/28/1989US4816112 Planarization process through silylation
03/28/1989US4816098 Apparatus for transferring workpieces
03/28/1989US4816081 Especially semiconductor wafers
03/28/1989US4815912 Box door actuated retainer
03/28/1989US4815854 Method of alignment between mask and semiconductor wafer
03/28/1989US4815601 Carrier for flat panel displays
03/28/1989US4815595 Uniform leadframe carrier
03/28/1989US4815583 Device for the handling of small-sized semi-conductor chips
03/28/1989US4815208 Method of joining substrates for planar electrical interconnections of hybrid circuits
03/28/1989CA1251680A1 Formation of etch-resistant resists through preferential permeation
03/23/1989WO1989002697A1 Induced metallization process by way of dissociating aluminum nitride ceramic
03/23/1989WO1989002695A1 Multiple electrode plasma reactor power distribution system
03/23/1989WO1989002655A1 Integrated circuit trench cell
03/23/1989WO1989002654A2 Resonant tunneling transistor utilizing upper resonance
03/23/1989WO1989002653A1 Bonding of aligned conductive bumps on adjacent surfaces
03/23/1989WO1989002652A1 Processes for preparing t-gate and transistor, and t-gate and transistor fabricated thereby
03/23/1989EP0333851A1 Resonant tunneling transistor utilizing upper resonance
03/22/1989EP0308347A1 Test head robot having a modified suspension
03/22/1989EP0308316A1 Process for self-aligning the floating gates of non-volatile memory floating gate transistors, and memory obtained by this process
03/22/1989EP0308308A1 Apparatus for czochralski single crystal growing
03/22/1989EP0308295A1 Process for manufacturing CMOS devices
03/22/1989EP0308275A2 Sputter module for modular wafer processing machine
03/22/1989EP0308166A2 Polycrystalline film formation
03/22/1989EP0308152A2 MIS integrated circuit device and method of manufacturing the same
03/22/1989EP0308134A2 Specular machining apparatus for peripheral edge portion of wafer
03/22/1989EP0308128A1 Method of manufacturing thin film transistors
03/22/1989EP0307995A2 Process and device for gas delivery to an epitaxy apparatus
03/22/1989EP0307951A2 Light-sensitive resin composition
03/22/1989EP0307946A2 Method of manufacturing a resin insulated type semiconductor device
03/22/1989EP0307906A1 Compensating eddy current effects in charged particle beam systems
03/22/1989EP0307878A2 Method for fabricating multilayer circuits
03/22/1989EP0307849A2 Application of deep-junction non-self-aligned transistors for suppressing hot carriers
03/22/1989EP0307844A2 Semiconductor integrated circuit having interconnection with improved design flexibility
03/22/1989EP0307726A2 Semiconductor manufacturing process which compensates for the distortion between a pattern on a semiconductor body and the mask from which the pattern is derived
03/22/1989EP0307722A1 Semiconductor device having improved multilayered wirings
03/22/1989EP0307671A2 Method of making an electrically programmable integrated circuit with meltable contact bridges
03/22/1989EP0307608A1 Apparatus and process for annealing semiconductor wafers
03/22/1989EP0307598A2 Method of fabricating a bipolar semiconductor device with silicide contacts
03/22/1989EP0307596A2 Method of producing conductor networks
03/22/1989EP0307591A2 Method and apparatus for aligning solder balls
03/22/1989EP0307509A2 Sticking and cutoff device for adhesive tape for thin articles
03/22/1989EP0307444A1 Thin film deposition process
03/22/1989EP0307409A1 Method and apparatus for cleaning semiconductor wafers
03/22/1989EP0187826B1 Fabrication of devices with a silicon oxide region
03/22/1989EP0177561A4 Chip selection in automatic assembly of integrated circuit.
03/22/1989EP0177558A4 Manipulation and handling of integrated circuit dice.
03/22/1989EP0099878B1 Method for reducing oxygen precipitation in silicon wafers
03/22/1989CN1031910A Single-temp-zone open-tube diffusion technology of gallium for producing thyristors
03/22/1989CN1031900A Method of manufacturing a mask for radiation lithography
03/21/1989US4815037 Bipolar type static memory cell
03/21/1989US4814855 Balltape structure for tape automated bonding, multilayer packaging, universal chip interconnection and energy beam processes for manufacturing balltape
03/21/1989US4814854 Integrated circuit device and process with tin-gate transistor
03/21/1989US4814852 Controlled voltage drop diode
03/21/1989US4814851 High transconductance complementary (Al,Ga)As/gas heterostructure insulated gate field-effect transistor
03/21/1989US4814850 Density intensive non-self-aligned stacked CMOS
03/21/1989US4814849 Monolithically integrated semiconductor circuit
03/21/1989US4814843 Charge transfer device with pn junction gates
03/21/1989US4814842 Thin film transistor utilizing hydrogenated polycrystalline silicon
03/21/1989US4814841 Semiconductor device
03/21/1989US4814840 High-density reprogrammable semiconductor memory device
03/21/1989US4814838 Semiconductor device and method of manufacturing the same
03/21/1989US4814835 Active load type of current source and method of making it
03/21/1989US4814799 Method and apparatus for creating a photomask for projecting an image
03/21/1989US4814686 FET reference voltage generator which is impervious to input voltage fluctuations
03/21/1989US4814682 Drive apparatus for specimen stage of microscope
03/21/1989US4814639 Super integration circuit device having a plurality of IC-chip equivalent regions formed on a single semiconductor substrate
03/21/1989US4814626 Method for high precision position measurement of two-dimensional structures
03/21/1989US4814625 Exposure apparatus having gas supplying means for air blow off
03/21/1989US4814621 Lead detection by variable pressure lead-contacting optical interposers
03/21/1989US4814615 Method and apparatus for detecting defect in circuit pattern of a mask for X-ray exposure
03/21/1989US4814596 Detection of surface particles by dual semiconductor lasers having stable illumination intensities
03/21/1989US4814578 Planarization of metal films for multilevel interconnects
03/21/1989US4814303 Anorthite-cordierite based ceramics from zeolites
03/21/1989US4814296 Method of fabricating image sensor dies for use in assembling arrays
03/21/1989US4814295 Mounting of semiconductor chips on a plastic substrate
03/21/1989US4814294 Cobalt carbonyls, silicon compounds
03/21/1989US4814293 Titanium-tungsten layer eteched with buffered hydrogen peroxide solution
03/21/1989US4814292 Large grains
03/21/1989US4814291 Silicon dioxide
03/21/1989US4814290 Method for providing increased dopant concentration in selected regions of semiconductor devices
03/21/1989US4814288 Method of fabricating semiconductor devices which include vertical elements and control elements
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