Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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12/24/1991 | US5075758 Semiconductor device |
12/24/1991 | US5075757 Ohmic contact electrodes for semiconductor diamonds |
12/24/1991 | US5075756 Thin film composed of at least tungsten and antimony |
12/24/1991 | US5075755 Epitaxial intermetallic contact for compound semiconductors |
12/24/1991 | US5075753 Semiconductor integrated circuit device |
12/24/1991 | US5075752 Bi-cmos semiconductor device having memory cells formed in isolated wells |
12/24/1991 | US5075747 Charge transfer device with meander channel |
12/24/1991 | US5075746 Thin film field effect transistor and a method of manufacturing the same |
12/24/1991 | US5075745 Capacitor cell for use in a semiconductor memory integrated circuit device |
12/24/1991 | US5075744 Gallium arsenide, gallium arsenide phosphide, indium gallium a rsenide channel layer |
12/24/1991 | US5075740 High speed, high voltage schottky semiconductor device |
12/24/1991 | US5075737 Thin film semiconductor device |
12/24/1991 | US5075667 Humidity sensor and method for producing the same |
12/24/1991 | US5075641 High frequency oscillator comprising cointegrated thin film resonator and active device |
12/24/1991 | US5075621 Capacitor power probe |
12/24/1991 | US5075579 Level shift circuit for achieving a high-speed processing and an improved output current capability |
12/24/1991 | US5075577 Tristate output circuit with input protection |
12/24/1991 | US5075571 PMOS wordline boost cricuit for DRAM |
12/24/1991 | US5075281 Rapid quenching |
12/24/1991 | US5075262 Bonding semiconductor to substrate |
12/24/1991 | US5075259 Method for forming semiconductor contacts by electroless plating |
12/24/1991 | US5075258 Method for plating tab leads in an assembled semiconductor package |
12/24/1991 | US5075257 Electrostatically charging silicon, polarity, grounding substr ate, coating charged silicon on substrate, heat treatment |
12/24/1991 | US5075256 Process for removing deposits from backside and end edge of semiconductor wafer while preventing removal of materials from front surface of wafer |
12/24/1991 | US5075255 Method of removing contaminants from a plated article with a clean burning hydrogen flame |
12/24/1991 | US5075253 Method of coplanar integration of semiconductor IC devices |
12/24/1991 | US5075252 Interdigitated trans-die lead method of construction for maximizing population density of chip-on-board construction |
12/24/1991 | US5075251 Tungsten silicide self-aligned formation process |
12/24/1991 | US5075250 Method of fabricating a monolithic integrated circuit chip for a thermal ink jet printhead |
12/24/1991 | US5075249 Breakdown of insulator for conduction, dopes, channels, gate i nsulator and electrode, insulating layers, inclined sidewall o n first penetrating opening, wiring electrodes |
12/24/1991 | US5075248 Method of making DRAM having a side wall doped trench and stacked capacitor structure |
12/24/1991 | US5075246 Semiconductor substrate, dopes, masking |
12/24/1991 | US5075245 Electrically programmable read-only memories, floating gate me mories, silicon nitride strips, dopes, oxide region growth, po lysilicon gate members |
12/24/1991 | US5075244 Metal gate electrodes of thin film transistor switching elemen ts, gate insulating layers, semiconductor active and ohmic con tact layers, drain and source electrodes, barrier metal, photo detect elements, photoconductor, contact holes, metal wiring |
12/24/1991 | US5075243 Cobalt silicide on silicon, forming amorphous or polycrystalli ne coating capable of controlled crystallization, exposure to focused electron beam, removing remaining coating while leavin g crystallized portion |
12/24/1991 | US5075242 Method of manufacturing CMOS semiconductor device having decreased diffusion layer capacitance |
12/24/1991 | US5075240 Semiconductor device manufactured by using conductive ion implantation mask |
12/24/1991 | US5075239 Two or more components, selective epitaxial deposition of semi -insulating indium phosphide layer, masking, etching |
12/24/1991 | US5075201 Method for aligning high density infrared detector arrays |
12/24/1991 | US5075200 Process of forming superconductive wiring strip |
12/24/1991 | US5075199 Radiation sensitive mixture and production of relief patterns |
12/24/1991 | US5074985 Film forming apparatus |
12/24/1991 | US5074969 Composition and coating to prevent current induced electrochemical dendrite formation between conductors on dielectric substrate |
12/24/1991 | US5074956 Pattern forming method |
12/24/1991 | US5074955 Process for the anisotropic etching of a iii-v material and application to the surface treatment for epitaxial growth |
12/24/1991 | US5074954 Process and apparatus for growing compound semiconductor monocrystal |
12/24/1991 | US5074947 Flip chip technology using electrically conductive polymers and dielectrics |
12/24/1991 | US5074779 Mold for resin-sealing a semiconductor device |
12/24/1991 | US5074736 Semiconductor wafer carrier design |
12/24/1991 | US5074669 Method and apparatus for evaluating ion implant dosage levels in semiconductors |
12/24/1991 | US5074629 Integrated variable focal length lens and its applications |
12/24/1991 | US5074083 Cleaning device using fine frozen particles |
12/24/1991 | US5074037 Process for producing electrical connections on a universal substrate |
12/24/1991 | US5074036 Method of die bonding semiconductor chip by using removable frame |
12/24/1991 | US5074017 Susceptor |
12/24/1991 | CA1293488C Spin drying apparatus |
12/21/1991 | CA2044693A1 Stripping method for removing resist from a printed circuit board |
12/20/1991 | WO1991020095A1 Solder interconnections and methods for making same |
12/20/1991 | CA2044649A1 Method and apparatus for packaging a semiconductor device |
12/19/1991 | DE4119918A1 Fast dram construction with improved capacitor size - uses polycide bit-lines and diffusion contacts and capacitor stack overlying word-line |
12/19/1991 | DE4039536A1 Encapsulated semiconductor device - has bond formed by melting tip of thin wire and pressing onto contact spot |
12/19/1991 | DE4016236A1 Immersed body processing - has oscillation applied mechanically to fluid and body to give max. fluid contact at and through workpiece |
12/19/1991 | CA2043411A1 Rapid thermal process for obtaining silica coatings |
12/18/1991 | EP0462030A1 Container for semiconductor wafers |
12/18/1991 | EP0462029A1 Process of fabricating a bipolar transistor sustaining a reverse bias |
12/18/1991 | EP0461982A1 Method for extension of the life time of a circuit with MOS-components subject to "Gamma" radiation |
12/18/1991 | EP0461967A2 Schottky junction semiconductor device for microwave amplification and fast logic circuits, and method of making the same |
12/18/1991 | EP0461955A1 Method for autoaligning metal contacts on a semiconductor device and autoaligned semiconductor |
12/18/1991 | EP0461932A2 Apparatus for exposing peripheral portion of substrate |
12/18/1991 | EP0461908A2 Process for preparing a transparent electrode and transparent electrode prepared by it |
12/18/1991 | EP0461904A2 An improved semiconductor read-only VLSI memory |
12/18/1991 | EP0461879A2 Semiconductor device having an isolating groove and method of making the same |
12/18/1991 | EP0461807A2 MESFET and manufacturing method therefor |
12/18/1991 | EP0461782A2 Conversion of silica precursors to silica at low temperatures |
12/18/1991 | EP0461778A1 Method for producing a mask pattern |
12/18/1991 | EP0461769A1 Method for pulling up semiconductor single crystal |
12/18/1991 | EP0461766A2 Silicon-doped In y Ga 1-y As laser |
12/18/1991 | EP0461764A2 EPROM virtual ground array |
12/18/1991 | EP0461750A2 Interconnect for integrated circuits |
12/18/1991 | EP0461717A1 DC/DC voltage multiplier |
12/18/1991 | EP0461663A1 Method of manufacturing a semiconductor device, including a step of forming a pattern on a photo-resist film |
12/18/1991 | EP0461654A2 Radiation-sensitive positive resist composition |
12/18/1991 | EP0461650A1 Semiconductor manufacturing apparatus and method of manufacturing semiconductor device |
12/18/1991 | EP0461543A2 Method and device for coating substrates with molten materials |
12/18/1991 | EP0461498A2 Means of planarizing integrated circuits with fully recessed isolation dielectric |
12/18/1991 | EP0461476A2 Surface cleaning using a cryogenic aerosol |
12/18/1991 | EP0461458A1 Method & structure for forming vertical semiconductor interconnection |
12/18/1991 | EP0461414A2 Method of cutting interconnection pattern with laser and apparatus thereof |
12/18/1991 | EP0461406A1 Single ended ultra-high vacuum chemical vapor deposition (UHV/CVD) reactor |
12/18/1991 | EP0461376A1 Modulation doped base heterojunction bipolar transistor |
12/18/1991 | EP0461362A2 Process for preparing a thin film semiconductor device |
12/18/1991 | EP0461316A1 Die attachment |
12/18/1991 | EP0461254A1 Composite color illumination method and band light illumination in a double-focus detector utilizing chromatic aberration |
12/18/1991 | EP0461194A1 A high capacity epitaxial reactor |
12/18/1991 | EP0441905A4 Method and apparatus for processing materials |
12/18/1991 | EP0281597B1 Nonvolatile memory cell array |
12/18/1991 | EP0271508B1 Electron-beam probing of photodiodes |
12/18/1991 | EP0214229B1 Logic circuit having improved testability for defective via contacts |
12/18/1991 | EP0120918B1 An aluminum-metal silicide interconnect structure for integrated circuits and method of manufacture thereof |
12/18/1991 | CN1057131A Semiconductor device having improved insulator gate type transistor |