| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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| 02/25/1992 | US5091288 Method of forming detector array contact bumps for improved lift off of excess metal |
| 02/25/1992 | US5091285 Method of forming pattern by using an electroconductive composition |
| 02/25/1992 | US5091219 Chemical vapor deposition method |
| 02/25/1992 | US5091218 Method for producing a metallized pattern on a substrate |
| 02/25/1992 | US5091217 Irradiating with radio frequency |
| 02/25/1992 | US5091212 Applying electrode paste to selected portions of electronic surface through slit of specified width |
| 02/25/1992 | US5091210 Plasma CVD of aluminum films |
| 02/25/1992 | US5091209 Method of forming a thin copper film by low temperture CVD |
| 02/25/1992 | US5091207 Venting of waste gases |
| 02/25/1992 | US5091115 Semiconductor-containing glass and method for producing same |
| 02/25/1992 | US5091103 Removing hard, baked photoresist from a substrate using solutions of n-alkyl-a-pyrrolidone,, 1,2-propanediol and tetraalkylammonium hydroxide |
| 02/25/1992 | US5091061 Silicon substrate having porous oxidized silicon layers and its production method |
| 02/25/1992 | US5091050 Dry etching method |
| 02/25/1992 | US5091048 Transporting particles to surface at low angle of incidence |
| 02/25/1992 | US5091047 Plasma etching using a bilayer mask |
| 02/25/1992 | US5090900 Workpiece support for vacuum chamber |
| 02/25/1992 | US5090609 Method of bonding metals, and method and apparatus for producing semiconductor integrated circuit device using said method of bonding metals |
| 02/25/1992 | US5090432 Single wafer megasonic semiconductor wafer processing system |
| 02/25/1992 | US5090350 Method and apparatus for cleaning, coating and curing receptor substrates in an enclosed planetary array |
| 02/25/1992 | US5090119 Method of forming an electrical contact bump |
| 02/25/1992 | CA1296241C Method for epitaxial growth from the vapour phase of semiconductor materials |
| 02/25/1992 | CA1296180C Method for aligning photomasks |
| 02/24/1992 | CA2048558A1 Low dielectric inorganic composition for multilayer ceramic package |
| 02/20/1992 | WO1992003035A1 Ultra high density integrated circuit packages, method and apparatus |
| 02/20/1992 | WO1992003029A1 Device for heat treatment of substrate |
| 02/20/1992 | WO1992002956A1 Semiconductor device and its manufacturing method |
| 02/20/1992 | WO1992002954A1 High power, compound semiconductor device and fabrication process |
| 02/20/1992 | WO1992002951A1 Elimination of etch stop undercut |
| 02/20/1992 | WO1992002950A1 Arrangement for storing, transporting and enclosing substrates |
| 02/20/1992 | WO1992002949A1 Substrate whirling plate |
| 02/20/1992 | WO1992002948A1 Device for one-sidedly etching a semiconductor slice |
| 02/20/1992 | WO1992002858A1 Process for producing microstructures with locally different structural heights |
| 02/20/1992 | WO1992002306A1 Dispensing process particularly for a sealing/adhesive product |
| 02/20/1992 | WO1991015333A3 Ultrafast electro-dynamic x, y and theta positioning stage |
| 02/20/1992 | DE4124877A1 Integrated semiconductor circuit with standard cells - has one cell interconnection in internal region of standard cell(s) |
| 02/20/1992 | DE4101042C1 Contact and encapsulation of micro-circuits using solder laser - and laser transparent contact film segments with conductor sheets of solderable material, geometrically associated with solder protuberances |
| 02/20/1992 | DE4039037C1 Mfg. electronic components using conductor frame - providing retaining strips in parallel with connecting tags and encapsulating chip, solder metal and contact strap |
| 02/20/1992 | DE4026244A1 Versatile substrate holder for semiconductor wafer prodn. - uses deepened well with central mesa to support wafer |
| 02/20/1992 | DE4026132A1 Two=stage cutting or drilling process using laser beam - involves removing top upper brittle layer and cutting second layer to avoid edge cracking |
| 02/20/1992 | DE4025959A1 Negatively-working aq. alkali-developable radiation-sensitive mixt. - contains water-insol. binder sol. in aq. alkali, cpd. forming strong acid on irradiation, and gp. condensing in presence of acid |
| 02/19/1992 | EP0471628A1 Thin film transistor circuit and its manufacturing |
| 02/19/1992 | EP0471544A2 Semiconductor memory with a sequence of clocked access codes for test mode entry |
| 02/19/1992 | EP0471526A1 Vertical power MOSFET |
| 02/19/1992 | EP0471507A2 Plastic cavity package lid seal process |
| 02/19/1992 | EP0471475A2 Organopolysiloxane composition and its gel cured product |
| 02/19/1992 | EP0471391A2 Determination of ions in fluids |
| 02/19/1992 | EP0471381A2 Non-volatile memory and method for fabricating the same |
| 02/19/1992 | EP0471376A2 Electrode structure of monolithically-formed heavy-current element and small signal element and method of manufacturing the same |
| 02/19/1992 | EP0471365A1 Semiconductor wafer processing apparatus |
| 02/19/1992 | EP0471350A2 Measuring electrode |
| 02/19/1992 | EP0471337A1 DRAM with trench capacitor and improved bit line contact |
| 02/19/1992 | EP0471326A1 Positive type photoresist composition |
| 02/19/1992 | EP0471243A1 Manufacturing method for capacitor device with large capacity |
| 02/19/1992 | EP0471202A2 Laser machining device with selectability of beam shape |
| 02/19/1992 | EP0471185A2 Process for forming refractory metal silicide layers in an integrated circuit |
| 02/19/1992 | EP0471131A1 Process for obtaining an N-channel single polysilicon level EPROM cell and cell obtained with said process |
| 02/19/1992 | EP0471126A2 Static random access memory cell |
| 02/19/1992 | EP0471034A1 Twisted wire jumper electrical interconnector |
| 02/19/1992 | EP0471018A1 Floating-gate charge-balance ccd |
| 02/19/1992 | EP0471003A1 Method of grounding an ultra high density pad array chip carrier. |
| 02/19/1992 | CN2096818U Transistor gate device |
| 02/19/1992 | CN2096817U Quick screening instrument for three-terminal regulated block |
| 02/19/1992 | CN1015585B Self-centering electrode for power devices |
| 02/19/1992 | CN1015584B Electronic parts |
| 02/18/1992 | US5090036 Two-phase-clocked shift register is bipolar technology |
| 02/18/1992 | US5089991 Non-volatile memory cell |
| 02/18/1992 | US5089986 Mushroom double stacked capacitor |
| 02/18/1992 | US5089881 Fine-pitch chip carrier |
| 02/18/1992 | US5089879 Resin seal type semiconductor device |
| 02/18/1992 | US5089875 Semiconductor device with mis capacitor |
| 02/18/1992 | US5089873 Integrated circuit having a vertical transistor |
| 02/18/1992 | US5089872 Selective germanium deposition on silicon and resulting structures |
| 02/18/1992 | US5089870 Soi mos transistor with a substrate-source connection |
| 02/18/1992 | US5089868 Semiconductor memory device with improved groove capacitor |
| 02/18/1992 | US5089867 High control gate/floating gate coupling for EPROMs, E2 PROMs, and Flash E2 PROMs |
| 02/18/1992 | US5089866 Two-transistor type non-volatile semiconductor memory |
| 02/18/1992 | US5089865 Mis semiconductor device |
| 02/18/1992 | US5089863 Field effect transistor with T-shaped gate electrode |
| 02/18/1992 | US5089862 Monocrystalline three-dimensional integrated circuit |
| 02/18/1992 | US5089772 Device for testing semiconductor integrated circuits and method of testing the same |
| 02/18/1992 | US5089750 Lead connection structure |
| 02/18/1992 | US5089710 Ion implantation equipment |
| 02/18/1992 | US5089443 Method of making a semiconductor heat sink |
| 02/18/1992 | US5089442 Silicon dioxide deposition method using a magnetic field and both sputter deposition and plasma-enhanced cvd |
| 02/18/1992 | US5089441 Low-temperature in-situ dry cleaning process for semiconductor wafers |
| 02/18/1992 | US5089440 Solder interconnection structure and process for making |
| 02/18/1992 | US5089439 Process for attaching large area silicon-backed chips to gold-coated surfaces |
| 02/18/1992 | US5089438 Method of making an article comprising a TiNx layer |
| 02/18/1992 | US5089436 Doping through barrier layer so maximum ion density is within barrier layer |
| 02/18/1992 | US5089435 Method of making a field effect transistor with short channel length |
| 02/18/1992 | US5089434 Mask surrogate semiconductor process employing dopant-opaque region |
| 02/18/1992 | US5089433 Bipolar field-effect electrically erasable programmable read only memory cell and method of manufacture |
| 02/18/1992 | US5089432 Polycide gate MOSFET process for integrated circuits |
| 02/18/1992 | US5089431 Forming rectifying junction pattern which can be easily contacted and provides low resistance path |
| 02/18/1992 | US5089430 Method of manufacturing semiconductor integrated circuit bipolar transistor device |
| 02/18/1992 | US5089429 Self-aligned emitter bicmos process |
| 02/18/1992 | US5089428 Method for forming a germanium layer and a heterojunction bipolar transistor |
| 02/18/1992 | US5089427 Semiconductor device and method |
| 02/18/1992 | US5089361 Mask making process |
| 02/18/1992 | US5089289 Method of forming thin films |