Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
03/1992
03/03/1992US5093224 Electron-induced polymerization
03/03/1992US5093152 Process for protecting an optical substrate by plasma deposition
03/03/1992US5092978 Apparatus for fabricating piezoelectric films
03/03/1992US5092957 Carrier-lifetime-controlled selective etching process for semiconductors using photochemical etching
03/03/1992US5092937 Noncontamination by cleaning, rinsing and drying in inert gas of high purity
03/03/1992US5092729 Apparatus for transporting a wafer and a carrier used for the same
03/03/1992US5092557 Apparatus for holding and positioning a substrate cassette
03/03/1992US5092080 Apparatus for opening and closing core tube
03/03/1992US5092036 Filling metal tubes, then etching tubes away
03/03/1992US5092033 Method for packaging semiconductor device
03/03/1992US5092032 Manufacturing method for a multilayer printed circuit board
03/03/1992US5092031 Method and apparatus for bonding external leads
03/03/1992CA1296816C Process for producing a semiconductor article
03/03/1992CA1296814C Single wafer moated signal processor
03/03/1992CA1296802C Semiconductor device for charge-coupled device
03/03/1992CA1296560C Non-precipitating photoresist composition
03/01/1992WO1992003590A1 Method and apparatus for reducing wafer contamination
03/01/1992CA2194855A1 Process gas distribution system and method
03/01/1992CA2089646A1 Method and apparatus for reducing wafer contamination
02/1992
02/28/1992CA2049595A1 Borate coinitiators for photopolymerizable compositions
02/27/1992DE4026822A1 Surface mountable device carrier prodn. for reliability - esp. for mfg. tape-automated-bonding, by forming bond and contact elements on insulating polyimide film and resistance electroplating
02/27/1992DE4026797A1 Forming recombination centres in semiconductor component - irradiating semiconductor by ions of preset energy and diffusing recombination atoms
02/27/1992DE4026710A1 Thickening gold layer - on titanium-tungsten bond layer of ceramic circuit, by electroplating, with reduced blister formation
02/27/1992DE4026666A1 Mfg. monolithic semiconductor chip on substrate wafer - applying beam leads from contact windows to chip edge via insulating layer
02/26/1992EP0472465A2 Method of depositing insulating layer on underlaying layer using plasma-assisted CVD process using pulse-modulated plasma
02/26/1992EP0472452A1 Power transistor and its manufacturing process
02/26/1992EP0472451A1 Hybrid integrated circuit interconnection structure and method of fabrication
02/26/1992EP0472441A1 Two-step cleaning method for semiconductor devices
02/26/1992EP0472435A1 Carrier for film carrier type semiconductor device
02/26/1992EP0472357A2 A semiconductor integrated circuit
02/26/1992EP0472347A2 Method of making a contact on a group III-V compound semiconductor device
02/26/1992EP0472331A2 Integrated circuit resistor fabrication using focused ion beam
02/26/1992EP0472328A2 Method of making a polysilicon emitter bipolar transistor
02/26/1992EP0472316A2 Multichannel plate assembly for gas source molecular beam epitaxy
02/26/1992EP0472290A1 Resist materials
02/26/1992EP0472277A1 Method for laser scribing substrates
02/26/1992EP0472262A1 Heterojunction bipolar transistor
02/26/1992EP0472241A2 Electrically programmable and erasable semiconductor memory and its operation method
02/26/1992EP0472240A2 Electrically programmable and erasable semiconductor memory and its method of operation
02/26/1992EP0472217A1 Method of manufacturing semiconductor devices
02/26/1992EP0472199A1 Method of manufacturing plastic molded semiconductor device and apparatus for manufacturing the same
02/26/1992EP0472165A1 Low dielectric inorganic composition for multilayer ceramic package
02/26/1992EP0472135A1 Integrated circuit chip formed with a capacitor having a low voltage coefficient, and method of making such capacitor
02/26/1992EP0472112A2 Method and apparatus for covering an inner region of a vacuum chamber
02/26/1992EP0472065A1 User-proof post-assembly offset voltage trim
02/26/1992EP0472055A1 Misfet
02/26/1992EP0472045A1 Method and apparatus for controlling plasma processing
02/26/1992EP0472041A2 Method and apparatus for detecting deformations of leads of semiconductor device
02/26/1992EP0472029A1 Light-sensitive composition and process for the formation of relief pattern
02/26/1992EP0472012A2 Method of boron diffusion into semiconductor wafers
02/26/1992EP0471845A1 Method of forming silicon oxide film
02/26/1992EP0471844A1 Silicon oxide film and semiconductor device having the same
02/26/1992EP0471819A1 Apparatus for ion implantation
02/26/1992EP0471737A1 Semiconductor device.
02/26/1992EP0471664A1 Electrochemical planarization
02/26/1992EP0460106A4 Novel glass deposition viscoelastic flow process
02/26/1992EP0144444B1 Method of manufacturing semiconductor device
02/26/1992CN1059066A Stripping method for removing resist from printed circuit board
02/26/1992CN1059050A 高度集成的半导体存储器件及其制造方法 Highly integrated semiconductor memory device and manufacturing method thereof
02/25/1992WO1992003902A1 Method and device for hermetic encapsulation of electronic components
02/25/1992US5091979 Sub-micron imaging
02/25/1992US5091922 Charge transfer device type solid state image sensor having constant saturation level
02/25/1992US5091882 Nonvolatile semiconductor memory device and method of operating the same
02/25/1992US5091825 Orthogonal bonding method and equipment
02/25/1992US5091772 Semiconductor device and package
02/25/1992US5091770 Semiconductor device having a ceramic package
02/25/1992US5091768 Semiconductor device having a funnel shaped inter-level connection
02/25/1992US5091767 Article comprising a lattice-mismatched semiconductor heterostructure
02/25/1992US5091766 Thyristor with first and second independent control electrodes
02/25/1992US5091763 Self-aligned overlap MOSFET and method of fabrication
02/25/1992US5091762 Semiconductor memory device with a 3-dimensional structure
02/25/1992US5091760 Semiconductor device
02/25/1992US5091744 Illumination optical system
02/25/1992US5091692 Probing test device
02/25/1992US5091689 Constant current circuit and integrated circuit having said circuit
02/25/1992US5091660 Semiconductor logic circuit
02/25/1992US5091657 High speed multiplex switch circuit and method
02/25/1992US5091655 Reduced path ion beam implanter
02/25/1992US5091342 Multilevel resist plated transfer layer process for fine line lithography
02/25/1992US5091341 Method of sealing semiconductor device with resin by pressing a lead frame to a heat sink using an upper mold pressure member
02/25/1992US5091340 Flatness, accuracy
02/25/1992US5091339 Etching, patterning
02/25/1992US5091338 Process for forming heat resistant ohmic electrode
02/25/1992US5091337 Method of manufacturing amorphous-silicon thin-film transistors
02/25/1992US5091335 MBE growth technology for high quality strained III-V layers
02/25/1992US5091334 Semiconductor device
02/25/1992US5091333 Multilayer; interrupting growth temperature control
02/25/1992US5091332 Concurrent forming channel stops and dielectrics
02/25/1992US5091331 Ultra-thin circuit fabrication by controlled wafer debonding
02/25/1992US5091330 Bonding wafer containing grooves
02/25/1992US5091329 Gate oxidation, partial shielding of substrate, doping
02/25/1992US5091328 Method of late programming MOS devices
02/25/1992US5091327 Fabrication of a high density stacked gate eprom split cell with bit line reach-through and interruption immunity
02/25/1992US5091326 EPROM element employing self-aligning process
02/25/1992US5091324 Boron doping to adjust threshold voltage
02/25/1992US5091323 Forming patterned oxidation resistant film, then silicon oxide, removal oxidation resistant film, forming emitters
02/25/1992US5091322 Semiconductor device and method of manufacturing the same
02/25/1992US5091321 Second doping step through emitter contact hole
02/25/1992US5091320 Optical method for controlling thickness of semiconductor
02/25/1992US5091289 Process for forming multi-level coplanar conductor/insulator films employing photosensitive polyimide polymer compositions