Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
05/1992
05/06/1992EP0483517A2 Gas delivery for ion beam deposition and etching
05/06/1992EP0483487A1 Self-aligned epitaxial base transistor and method for fabricating same
05/06/1992EP0483365A1 Silicon single crystal manufacturing apparatus
05/06/1992EP0483349A1 Method for control of photoresist develop processes
05/06/1992EP0483319A1 Etching indium tin oxide
05/06/1992EP0256053B1 Matrix of interconnected transistors in thin layers and production method thereof
05/06/1992CN1060923A Production method for rectifier diode
05/06/1992CN1060861A Enhancement of polyimide adhesion on reactive metals
05/06/1992CN1060830A Chemically stabilized cristobalite
05/05/1992US5111491 X-ray lithography mask and method for producing same
05/05/1992US5111435 Bipolar-CMOS semiconductor memory device
05/05/1992US5111434 Semiconductor memory device
05/05/1992US5111404 Method for managing production line processes
05/05/1992US5111355 Thin films, high capacitance
05/05/1992US5111279 Apparatus for isolation of flux materials in "flip-chip" manufacturing
05/05/1992US5111276 Thick bus metallization interconnect structure to reduce bus area
05/05/1992US5111275 Multicell semiconductor memory device
05/05/1992US5111272 Semiconductor device having element regions electrically isolated from each other
05/05/1992US5111271 Semiconductor device using standard cell system
05/05/1992US5111270 Three-dimensional contactless non-volatile memory cell
05/05/1992US5111269 Bipolar transistor structure containing a resistor which assures reduction in layout area
05/05/1992US5111267 Semiconductor device having a multilayer electrode structure and method for fabricating the same
05/05/1992US5111265 Collector-top type transistor causing no deterioration in current gain
05/05/1992US5111261 Silicon thin film transistor with an intrinsic silicon active layer formed within the boundary defined by the edges of the gate electrode and the impurity containing silicon layer
05/05/1992US5111259 Trench capacitor memory cell with curved capacitors
05/05/1992US5111258 Semiconductor device with a multi-stepped source region and method for producing the same
05/05/1992US5111257 Electronic integrated circuit having an electrode layer for element isolation
05/05/1992US5111256 High speed semiconductor device and an optelectronic device
05/05/1992US5111255 Buried channel heterojunction field effect transistor
05/05/1992US5111240 Method for forming a photoresist pattern and apparatus applicable therewith
05/05/1992US5111068 Diffusion resistor circuit
05/05/1992US5111063 Integrated clock driver circuit
05/05/1992US5110766 Method of manufacturing a semiconductor device including forming a flattening layer over hollows in a contact hole
05/05/1992US5110765 Selective etch for GaAs-containing group III-V compounds
05/05/1992US5110764 Method of making a beveled semiconductor silicon wafer
05/05/1992US5110763 Glass coating
05/05/1992US5110762 Manufacturing a wiring formed inside a semiconductor device
05/05/1992US5110761 Formed top contact for non-flat semiconductor devices
05/05/1992US5110760 Vertical, vapor deposition of metal
05/05/1992US5110759 Melting
05/05/1992US5110758 Method of heat augmented resistor trimming
05/05/1992US5110757 Formation of composite monosilicon/polysilicon layer using reduced-temperature two-step silicon deposition
05/05/1992US5110756 Method of semiconductor integrated circuit manufacturing which includes processing for reducing defect density
05/05/1992US5110755 Process for forming a component insulator on a silicon substrate
05/05/1992US5110754 Method of making a DRAM capacitor for use as an programmable antifuse for redundancy repair/options on a DRAM
05/05/1992US5110752 Metal silicides
05/05/1992US5110751 Etching, vapor deposition of gate metal
05/05/1992US5110750 Semiconductor device and method of making the same
05/05/1992US5110749 Method for manufacturing semiconductor device
05/05/1992US5110748 Glass, silicon
05/05/1992US5110712 High density multi-level interconnects
05/05/1992US5110709 Light-sensitive positive working composition containing a pisolfone compound
05/05/1992US5110708 Positives
05/05/1992US5110706 I-line radiation-sensitive alkali-soluble resin composition utilizing 1,2-quinone diazide compound and hydroxy-chalcone additive
05/05/1992US5110697 Multifunctional photolithographic compositions
05/05/1992US5110654 Ceramic multilayer wiring substrate
05/05/1992US5110628 Without touching its leads
05/05/1992US5110515 Method of encapsulating semiconductor chips
05/05/1992US5110438 Reduced pressure surface treatment apparatus
05/05/1992US5110437 Plasma processing apparatus
05/05/1992US5110428 Differently polarizing front and rear surfaces
05/05/1992US5110411 Method of isotropically dry etching a poly/WSix sandwich structure
05/05/1992US5110410 Etching thick resist coating back to zinc sulfide and then etching both until all of resist is removed
05/05/1992US5110409 Enhanced plasma etching
05/05/1992US5110408 Anisotropic etching of gate film with good accuracy
05/05/1992US5110407 Surface fabricating device
05/05/1992US5110404 High temperature followed by low temperature of oxygen
05/05/1992US5110394 Apparatus for forming interconnection pattern
05/05/1992US5110388 Method of dicing and bonding semiconductor chips using a photocurable and heat curable adhesive tape
05/05/1992US5110373 Layer having non-uniform dopant concentration
05/05/1992US5110299 High density interconnect
05/05/1992US5110249 Transport system for inline vacuum processing
05/05/1992US5110248 Vertical heat-treatment apparatus having a wafer transfer mechanism
05/05/1992US5110167 Disc handling device, method of use and package
05/05/1992US5110032 Method and apparatus for wire bonding
05/05/1992US5110001 Handle for wafer carrier
05/05/1992US5109981 Carrier and carrier system for flatpack integrated circuits
05/05/1992US5109980 Ic carrier with shaft coupling
05/05/1992US5109601 Method of marking a thin film package
05/05/1992CA1300282C Wire bonds and electrical contacts of an integrated circuit device
05/05/1992CA1300281C Substrate potential detecting circuit
05/05/1992CA1299983C Passivation of gallium arsenide surfaces
05/05/1992CA1299982C Passivation of gallium arsenide electron devices
05/02/1992CA2053492A1 Device fabrication and resulting devices
05/01/1992CA2185936A1 Process for fabricating a superconducting circuit
04/1992
04/30/1992WO1992007384A1 Piso electrostatic discharge protection device
04/30/1992WO1992007383A1 Semiconductor device
04/30/1992WO1992007382A1 Structure of semiconductor device and manufacturing method thereof
04/30/1992WO1992007380A1 Semiconductor device having switching circuit to be switched by light and its fabrication process
04/30/1992WO1992007379A1 Dual-mode z-stage
04/30/1992WO1992007378A1 Process for producing a hybrid semiconductor structure and semiconductor structure thus produced
04/30/1992WO1992007377A1 Sacrificial metal etchback system
04/30/1992WO1992007376A1 Semiconductor processing apparatus and method
04/30/1992WO1992007362A1 Semiconductor memory unit having redundant structure
04/30/1992DE4134172A1 Tape automated bonding interconnect device mfr.
04/30/1992DE4116696A1 Opto=electronic integrated circuit mfr. - by depositing mask layer on substrate surface and forming mask for selective growth
04/30/1992DE4033658A1 Processing trench edges in semiconductor substrates - using stream of particles, for simple, accurate silicon@ solar cell mfr.
04/30/1992CA2054164A1 Transport device for the transfer of a workpiece carrier
04/29/1992EP0482940A1 Method of forming an electrical connection for an integrated circuit
04/29/1992EP0482907A2 Electrode structures