| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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| 08/05/2004 | US20040149110 Machining apparatus equipped with rotary tool |
| 08/05/2004 | US20040149055 Method and arrangement for transporting and inspecting semiconductor substrates |
| 08/05/2004 | US20040149041 Apparatus and method for determining clamping status of semiconductor wafer |
| 08/05/2004 | US20040148867 Metal abrasive composition and polishing method |
| 08/05/2004 | US20040148773 Angled flying lead wire bonding process |
| 08/05/2004 | US20040148769 Apparatus and method for mounting electronic parts |
| 08/05/2004 | US20040148765 Electronic package repair process |
| 08/05/2004 | DE4426364B4 Halbleiterbauelement mit einem selbstjustiertangeordneten Kontakt und Verfahren zu seiner Herstellung A semiconductor device with a self-aligned contact is arranged and process for its preparation |
| 08/05/2004 | DE4306320B4 Verfahren zur Erhöhung der Spannungsfestigkeit eines mehrschichtigen Halbleiterbauelements A method for increasing the dielectric strength of a multilayer semiconductor component |
| 08/05/2004 | DE19924649B4 Halbleiterscheiben mit Kristallgitter-Defekten und Verfahren zur Herstellung derselben Semiconductor wafers having lattice defects and process for producing same |
| 08/05/2004 | DE19841964B4 Verfahren zur Einstellung der Ätzgeschwindigkeit beim anisotropen Plasmaätzen von lateralen Strukturen Method for adjusting the etching rate in the anisotropic plasma etching of lateral structures |
| 08/05/2004 | DE19832795B4 Statische Zelle eines Speichers für wahlfreien Zugriff mit optimiertem Seitenverhältnis und Halbleiterspeichervorrichtung, die mindestens eine Speicherzelle umfasst Static memory cell of a random access with optimized aspect ratio and semiconductor memory device comprising at least one memory cell |
| 08/05/2004 | DE19801557B4 Kontakt-Prüfschaltung in einer Halbleitereinrichtung Contact check circuit in a semiconductor device |
| 08/05/2004 | DE19800919B4 Dünnfilmtransistor und Verfahren zu seiner Herstellung A thin film transistor and method for its preparation |
| 08/05/2004 | DE19751785B4 Verfahren zum Behandeln eines Halbleiter-Wafers A method for treating a semiconductor wafer |
| 08/05/2004 | DE10361272A1 Buried Strap mit begrenzter Ausdiffusion und DRAM-Speicher mit vertikalem Transistor Buried strap with limited diffusion and DRAM memory with vertical transistor |
| 08/05/2004 | DE10360537A1 Tiefe Isolationsgräben Deep isolation trenches |
| 08/05/2004 | DE10358556A1 Ausbildung selbstjustierender Kontakte unter Verwendung von Doppelten-SiN-Abstandschichten Training self-aligning contacts using double-SiN spacer layers |
| 08/05/2004 | DE10349187A1 Halbleiterwafer-Bearbeitungsvorrichtung A semiconductor wafer processing apparatus |
| 08/05/2004 | DE10349185A1 Halbleiterbaugruppe Semiconductor package |
| 08/05/2004 | DE10343297A1 Halbleiterbauelement mit Poly-Poly-Kondensator Semiconductor component with poly-poly capacitor |
| 08/05/2004 | DE10341795A1 Halbleiterspeichervorrichtung A semiconductor memory device |
| 08/05/2004 | DE10340391A1 Induktor mit geringem Energieverlust Inductor with low energy loss |
| 08/05/2004 | DE10338405A1 Verfahren zur epitaktischen Abscheidung von Schichten Process for epitaxial deposition of layers |
| 08/05/2004 | DE10334424A1 Halbleiterspeichervorrichtung mit Doppelzelleneinheiten A semiconductor memory device with dual cell units |
| 08/05/2004 | DE10315068B3 Sacrificial layer removal method for semiconductor technology using microchannels formed in structured layer for transporting removal medium to sacrificial layer |
| 08/05/2004 | DE10304425B3 Semiconductor disc handling device using combined Bernoulli effect and suction effect for retention of semiconductor disc |
| 08/05/2004 | DE10303413B3 Production of structured ceramic layers on surfaces of relief arranged vertically to substrate surface comprises preparing semiconductor substrate with relief on its surface, filling the relief with lacquer and further processing |
| 08/05/2004 | DE10303195A1 Transport arrangement for wafer containers in clean rooms has 2 synchronously driven, mutually parallel endless belts passed over rollers, on which containers are placed, supporting, drive rollers. |
| 08/05/2004 | DE10302632A1 Verfahren zum Erzeugen eines definierten Dotierungsgebietes in einem Halbleitermaterial A process for producing a defined doping area in a semiconductor material |
| 08/05/2004 | DE10302625A1 Production of a bipolar transistor used in microelectronic switching circuits comprises preparing a semiconductor substrate with a surface, forming a base connecting layer on the substrate surface and further processing |
| 08/05/2004 | DE10302611A1 Polished semiconductor wafer used in the production of an electronic component has a front side and a rear side with a maximum deviation of planarity of the rear side from the ideal plane lies in the region |
| 08/05/2004 | DE10302544A1 Production of a hard mask on a semiconductor substrate used in the production of integrated circuits comprises forming a hard mask layer on the substrate, forming a photolacquer structure on the hard mask layer, and further processing |
| 08/05/2004 | DE10302342A1 Production of substrate used in the production of mask or optical component comprises preparing a base layer, applying a first covering layer on the base layer, and post-treating the covering layer |
| 08/05/2004 | DE10302104A1 Verfahren zum Herstellen von Schaltungsträgern mit intergrierten passiven Bauelementen A method for manufacturing of circuit carriers with integrated passive components |
| 08/05/2004 | DE10301496A1 Semiconducting arrangement with p- and n-channel transistors has transistors with drift paths with at least one region of opposite type to channel types and complementary symmetry in drift paths |
| 08/05/2004 | DE10301244A1 Verfahren zum Dotieren von Halbleiterkörpern A method of doping semiconductor bodies |
| 08/05/2004 | DE10297154T5 Phasenverschiebungs-Moiré-Fokusmonitor Phase shift Moiré FokusMonitor |
| 08/05/2004 | DE10297094T5 Aktiver Strom/Erde ESD Trigger Active power / ground ESD trigger |
| 08/05/2004 | DE10297021T5 Grabenstruktur für Halbleiterbauelemente Grave structure for semiconductor devices |
| 08/05/2004 | DE10296993T5 Vorrichtung und Verfahren zum Montieren elektronischer Bauteile Device and method for mounting electronic components |
| 08/05/2004 | DE10254415A1 Feldeffekttransistorstruktur, zugehörige Halbleiter-Speicherzelle sowie zugehöriges Herstellungsverfahren Field effect transistor structure, corresponding semiconductor memory cell, and manufacturing method thereof |
| 08/05/2004 | DE10232469B4 Transportsystem mit einer kassettenartigen Stapelvorrichtung Transport system with a cassette-like stacking device |
| 08/05/2004 | DE10215355B4 Verfahren zur Flip-Chip-Montage von Halbleiterchips A method for flip-chip mounting of semiconductor chips |
| 08/05/2004 | DE102004003618A1 Halbleitereinrichtung mit einer Gateelektrode einer Polymetall-Gatestruktur, verarbeitet mittels Seitennitridieren in Ammoniakatmosphäre A semiconductor device having a gate electrode of a polymetal gate structure processed by Seitennitridieren in ammonia atmosphere |
| 08/05/2004 | DE102004002659A1 Semiconductor device e.g. dynamic random access memory device, includes contact patterns and spacers formed on sidewall of wiring forming contact hole regions |
| 08/05/2004 | DE102004002417A1 Kontaktstellenbeschichtungssystem und Verriegelungsverfahren dafür Contact points coating system and locking method therefor |
| 08/05/2004 | DE102004002223A1 Verfahren zur Herstellung einer Halbleitervorrichtung mit einem Kontaktkörper, der sich in Richtung einer Bitleitung zu einem Kontaktspeicherknotenpunkt erstreckt A method of manufacturing a semiconductor device having a contact body, which extends in the direction of a bit line to a storage node contact |
| 08/05/2004 | DE10134755B4 Verfahren zur Messung einer charakteristischen Abmessung wenigstens einer Struktur auf Halbleiterwafern A method for measuring a characteristic dimension of at least one structure on semiconductor wafers |
| 08/05/2004 | DE10049354B4 Halbleiterbauelement Semiconductor device |
| 08/05/2004 | DE10034942B4 Verfahren zur Erzeugung eines Halbleitersubstrats mit vergrabener Dotierung A method for producing a semiconductor substrate with a buried doping |
| 08/05/2004 | CA2512648A1 Methods of making carbon nanotube films, layers, fabrics, ribbons, elements and articles |
| 08/04/2004 | EP1443662A2 One chipped-direct conversion transceiver for reducing dc offset and a method of manufacturing the same |
| 08/04/2004 | EP1443651A1 Multi-device system and method for controlling voltage peaking of an output signal transmitted between integrated circuit devices |
| 08/04/2004 | EP1443638A2 Method and device for controlling a stepping motor, and indicating instrument comprising the stepping drive |
| 08/04/2004 | EP1443616A2 InP based high temperature lasers with InAsP quantum well layers and barrier layers of Gax(AIIN) 1-xP |
| 08/04/2004 | EP1443571A2 Organic semiconductor element and fabrication method thereof |
| 08/04/2004 | EP1443565A2 Heterojunction semiconductor device having an intermediate layer for providing an improved junction |
| 08/04/2004 | EP1443564A2 Semiconductor device in which punchthrough is prevented |
| 08/04/2004 | EP1443558A1 Semiconductor device |
| 08/04/2004 | EP1443557A2 Semiconductor device and method for manufacturing the same |
| 08/04/2004 | EP1443556A2 Method of manufacturing thin film element, thin film transistor circuit substrate, active matrix display device, electro-optical device, and electronic apparatus |
| 08/04/2004 | EP1443553A1 Fabrication method of static random access memory cell |
| 08/04/2004 | EP1443552A2 Semiconductor device and method of fabricating semiconductor device |
| 08/04/2004 | EP1443551A2 Semiconductor device manufacturing method for improving adhesiveness of copper metal layer to barrier layer |
| 08/04/2004 | EP1443550A1 A method for fabricating a strained crystalline layer on an insulator, a semiconductor structure therefor, and a fabricated semiconductor structure |
| 08/04/2004 | EP1443549A1 Wafer mapping device and load port with the device |
| 08/04/2004 | EP1443548A2 Composite metal column for mounting semiconductor device |
| 08/04/2004 | EP1443547A2 Method for efficient capillary underfill |
| 08/04/2004 | EP1443546A2 Working method of metal material and semiconductor apparatus fabricated by the method |
| 08/04/2004 | EP1443545A2 Method of making a haze free, lead rich pzt film |
| 08/04/2004 | EP1443544A2 Semiconductor substrate, method for fabricating the same, and method for fabricating a semiconductor device |
| 08/04/2004 | EP1443543A1 Thermal treating apparatus |
| 08/04/2004 | EP1443542A2 Method and device for controlling the edge of a disc shaped arcticle |
| 08/04/2004 | EP1443364A2 Projection exposure apparatus |
| 08/04/2004 | EP1443363A2 Compounds for photoresist and resin composition for photoresist |
| 08/04/2004 | EP1443361A2 Projection exposure mask, projection exposure apparatus, and projection exposure method |
| 08/04/2004 | EP1443130A1 NATURAL SUPERLATTICE HOMOLOGOUS SINGLE CRYSTAL THIN FILM, METHOD FOR PREPARATION THEREOF, AND DEVICE USING SAID SINGLE CRYSTAL THIN FILM |
| 08/04/2004 | EP1443016A2 Micro-Fabricated device and method of making same |
| 08/04/2004 | EP1442840A1 Anti-scattering layer for polishing pad windows |
| 08/04/2004 | EP1442642A1 Method for the selective surface treatment of planar workpieces |
| 08/04/2004 | EP1442487A2 Organic thin film transistor with siloxane polymer interface |
| 08/04/2004 | EP1442484A2 Organic thin film transistor with polymeric interface |
| 08/04/2004 | EP1442481A1 Integrated circuit bus grid having wires with pre-selected variable widths |
| 08/04/2004 | EP1442479A2 Method of forming reliable cu interconnects |
| 08/04/2004 | EP1442478A2 Active wafer cooling during damage engineering implant to enhance buried oxide formation in simox wafers |
| 08/04/2004 | EP1442477A1 Method of fixing a sealing object to a base object |
| 08/04/2004 | EP1442476A1 Dielectric film |
| 08/04/2004 | EP1442474A2 Process for forming metallized contacts to periphery transistors |
| 08/04/2004 | EP1442330A1 Tilting mirror |
| 08/04/2004 | EP1442307A2 Method and system for compensating thermally induced motion of probe cards |
| 08/04/2004 | EP1442162A2 Substrate for epitaxy |
| 08/04/2004 | EP1442161A1 Method of eliminating voids in w plugs |
| 08/04/2004 | EP1442153A1 Gcib processing to improve interconnection vias and improved interconnection via |
| 08/04/2004 | EP1442081A1 Curable organopolysiloxane composition, use of the cured product of the composition, and semiconductor device |
| 08/04/2004 | EP1442071A1 Etch-stop resins |
| 08/04/2004 | EP1441864A1 Method for forming thin-film conductors through the decomposition of metal-chelates in association with metal particles |
| 08/04/2004 | EP1441836A1 Central carbon dioxide purifier |
| 08/04/2004 | EP1377983B1 Reference for mram cell |
| 08/04/2004 | EP1336188B1 Extraction and deceleration of low energy beam with low beam divergence |