Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
04/2005
04/07/2005US20050072625 Acoustic diffusers for acoustic field uniformity
04/07/2005US20050072528 Integration of sensor based metrology into semiconductor processing tools
04/07/2005US20050072527 Substrate holding apparatus and substrate polishing apparatus
04/07/2005US20050072526 Heating apparatus to heat wafers using water and plate with turbolators
04/07/2005US20050072525 Apparatus to improve wafer temperature uniformity for face-up wet processing
04/07/2005US20050072524 System for the preferential removal of silicon oxide
04/07/2005US20050072517 Method and apparatus for joining protective tape to semiconductor wafer
04/07/2005US20050072460 GaAs substrate with Sb buffering for high in devices
04/07/2005US20050072446 Removing a coating, especially a photoresist, from, e.g., a semiconductive wafer, heating the workpiece at or above ambient pressure, adding water vapor, and diffusing O3 through the liquid layer and oxidizing a contaminant or film on the workpiece.
04/07/2005US20050072444 Method for processing plasma processing apparatus
04/07/2005US20050072360 Submicron size metal deposit apparatus
04/07/2005US20050072358 Substrate processing apparatus and substrate processing method
04/07/2005US20050072357 Sublimation bed employing carrier gas guidance structures
04/07/2005US20050072353 Method of manufacturing gallium nitride-based single crystal substrate
04/07/2005US20050072266 Planetary system workpiece support and method for surface treatment of workpieces
04/07/2005US20050072121 Method and system for shipping semiconductor wafers
04/07/2005US20050072054 Safe for nickel phosphide, glass and/or ceramic materials; polishing efficiency, uniformity, removal rate; minimizing defects; includes purified sodium containing clays
04/07/2005US20050071993 Ball grid array rework using a continuous belt furnace
04/07/2005US20050071991 Electronic component mounting apparatus and electronic component mounting method
04/07/2005US20050071990 Electronic-component alignment method and apparatus therefor
04/07/2005US20050071989 Apparatus used for manufacturing semiconductor device, method of manufacturing the semiconductor devices, and semiconductor device manufactured by the apparatus and method
04/07/2005US20050071974 Method of retrofitting a probe station
04/07/2005US20050071970 Manufacturing method for electrodes that inhibit corona effect on ceramic capacitor
04/07/2005US20050071969 Solid state embossing of polymer devices
04/07/2005DE19782235B4 Lasergestütztes Verfahren und System für die Reparatur oder Neukonfiguration einer integrierten Schaltung Laser-assisted method and system for repair or reconfiguration of an integrated circuit
04/07/2005DE10392347T5 Gerät mit einer Schaltung zur Erfassung von Substratfehlern Device with a circuit for detecting substrate defects
04/07/2005DE10392327T5 Verfahren zum Herstellen einer Belichtungsmaske, Belichtungsmaske und Verfahren zum Herstellen einer Halbleitereinrichtung A method of manufacturing an exposure mask, the exposure mask and method for manufacturing a semiconductor device
04/07/2005DE10342155A1 Verfahren zur Herstellung von Ätzlöchern und/oder Ätzgräben sowie Membransensoreinheit A process for the production of etching holes and / or etching trenches as well as membrane sensor unit
04/07/2005DE10341592A1 Power transistor used in direct current/DC converter, has gate electrode whose lower edge is obliquely angled, arranged between semiconductor cell height and semiconductor cell surface
04/07/2005DE10341564A1 Capacitor unit, e.g. of metal-insulator-metal (MIM) type for integrated circuits, with first conductive auxiliary layer on substrate, capacitor dielectric, second conductive layer
04/07/2005DE10341544A1 Strip conductor arrangement used in the electronics industry comprises a strip conductor arranged in a substrate, additional strip conductors, a covering layer, a hollow chamber, wall layers, plugs, and further layers
04/07/2005DE10340409A1 Support wafer for processing a semiconductor wafer comprises a support substrate permeable in a partial region for light having a predetermined wavelength, and an adhesive region arranged directly on the light-permeable partial region
04/07/2005DE10340131A1 Halbleiterleistungsbauteil mit Ladungskompensationsstruktur und monolithisch integrierter Schaltung, sowie Verfahren zu dessen Herstellung The semiconductor power component having charge compensation structure and a monolithically integrated circuit, and to processes for the preparation thereof
04/07/2005DE10339992A1 Eine Technik zur Erhöhung der Genauigkeit kritischer Abmessungen einer Gateelektrode durch Nutzung von Eigenschaften einer antireflektierenden Beschichtung One technique for increasing the accuracy of critical dimensions of a gate electrode by use of properties of an anti-reflective coating
04/07/2005DE10339989A1 Verfahren zur Herstellung eines konformen Abstandselements benachbart zu einer Gateelektrodenstruktur A process for producing a conformal spacer adjacent to a gate electrode structure
04/07/2005DE10339924A1 ESD-Testanordnung und Verfahren ESD test arrangement and method
04/07/2005DE10339702A1 Method for simultaneous forming of different gate regions of FET structure, starting with silicon substrate with two FET regions and simultaneous formation of stray layer over both FET regions
04/07/2005DE10338967A1 Mikrosystembauelement und Verfahren zum Kleben von Mikrobauteilen auf ein Substrat Microsystem device and method for bonding of micro components on a substrate
04/07/2005DE10337830A1 Producing a multiple layer arrangement with a metal layer comprises applying a metal layer on one surface of a first wafer, applying an intermediate layer on the metal layer, and further processing
04/07/2005DE10335062A1 Semiconductor bar scribing/cutting method, involves removing saw/scribing base by immersion in purification bath
04/07/2005DE10297660T5 Prüfgerät für elektronische Bauelemente An electronic component tester
04/07/2005DE102004043430A1 Dämpfender Phasenverschiebungsmaskenrohling und Photomaske Steaming phase shift mask blank and photomask
04/07/2005DE102004043233A1 Verfahren zum Herstellen eines beweglichen Abschnitts einer Halbleitervorrichtung A method of manufacturing a movable portion of a semiconductor device
04/07/2005DE102004041654A1 Verfahren zum Entfernen von Fremdmaterial für einen Dynamikgrössensensor vom Kapazitätstyp A method for removing foreign material for a dynamic variable capacitance type sensor
04/07/2005DE102004041346A1 Halbleiter und Verfahren zur Herstellung desselben Semiconductor and method for manufacturing the same
04/07/2005DE102004041102A1 Semiconductor wafer testing arrangement used in semiconductor production, has temperature control station that transfers wafer to prober through handling system, after applying thermal or mechanical load to wafer
04/07/2005DE102004025974A1 One-time programmable memory device for integrated circuit, comprises floating gate formed over active area and isolation layer, inter-gate dielectric layer formed on floating gate, and control gate formed on inter-gate dielectric layer
04/07/2005DE102004022736A1 Vorrichtung und Verfahren zum Erzeugen eines Schreibstroms für eine magnetische Speicherzelle Apparatus and method for generating a write current for a magnetic memory cell
04/07/2005DE102004022573A1 Magnetische Speicherzellenstruktur Magnetic memory cell structure
04/07/2005DE102004021636A1 Selbstausgerichtetes vergrabenes Kontaktpaar und Verfahren zum Ausbilden desselben The same self-aligned buried contact pair and method of forming
04/07/2005DE102004020874A1 Systeme und Verfahren, die Schnellanalyseinformationen während einer detaillierten Analyse eines Schaltungsentwurfs verwenden Using systems and methods, the quick analysis information during a detailed analysis of circuit design
04/07/2005DE102004020699A1 Integrierte Halbleiterschaltung A semiconductor integrated circuit
04/07/2005DE102004020258A1 Verfahren und System zum Lesen von Magnetspeicher A method and system for reading magnetic memory
04/07/2005DE102004013707A1 Substrate e.g. semiconductor wafer, testing apparatus for use during semiconductor production, has two test arrangements that are jointly connected to handling system, substrate magazine station and alignment station
04/07/2005DE10194370T5 Verfahren zum Züchten eines Kristalls A method for growing a crystal of
04/07/2005CA2539481A1 Improved copper bath for electroplating fine circuitry on semiconductor chips
04/07/2005CA2538262A1 Methods, devices and compositions for depositing and orienting nanostructures
04/07/2005CA2530607A1 Device for detecting biological and chemical particles
04/06/2005EP1521368A2 Field programmable gate array
04/06/2005EP1521363A1 Integrated Coupler
04/06/2005EP1521312A2 Optoelectronic device having a metallised carrier
04/06/2005EP1521310A2 Nitride semiconductor substrate and method of producing same
04/06/2005EP1521307A2 High-voltage semiconductor devices
04/06/2005EP1521306A2 Bipolar transistor and method of manufacturing the same
04/06/2005EP1521304A2 Process for producing resin-sealed type electronic device
04/06/2005EP1521303A2 Method for manufacturing semiconductor memory device
04/06/2005EP1521302A1 Method for formation of airgaps around an interconnect
04/06/2005EP1521301A1 Method of formation of airgaps around interconnecting line
04/06/2005EP1521300A1 Circuit structure integrated on a semiconductor substrate and relevant manufacturing method
04/06/2005EP1521299A2 Method of mounting a semiconductor chip with an adhesive film and apparatus using the same
04/06/2005EP1521298A2 Method of making a high-voltage field-effect transistor
04/06/2005EP1521297A1 Plasma processing equipment
04/06/2005EP1521296A2 Method of reclaiming silicon wafers
04/06/2005EP1521295A2 Method for forming an epitaxial layer sequence in a component and optoelectronic semiconductor chip
04/06/2005EP1521294A2 Method for surface treatment
04/06/2005EP1521293A1 Submicron size metal deposit apparatus
04/06/2005EP1521269A2 Asymmetric patterned magnetic memory
04/06/2005EP1521155A2 Cooling system, exposure apparatus having the same, and device manufacturing method
04/06/2005EP1521154A1 Method for supplying gas while dividing to chamber from gas supply facility equipped with flow controller
04/06/2005EP1521121A2 Cooling technique
04/06/2005EP1521120A2 Substrate holding system and exposure apparatus using the same
04/06/2005EP1521119A2 A focusing-device for the radiation from a light source
04/06/2005EP1521118A2 Use of perfluoropolyethers in optical systems
04/06/2005EP1520894A1 Barrier polishing fluid
04/06/2005EP1520893A1 High-rate barrier polishing composition
04/06/2005EP1520892A2 Polishing composition
04/06/2005EP1520891A1 Film forming composition, process for producing film forming composition, insulating film forming material, process for forming film, and silica-based film
04/06/2005EP1520669A1 A method for separating plates which are bonded with each other and form a piled structure
04/06/2005EP1520329A2 Nitride semiconductor laser device and a method for improving its performance
04/06/2005EP1520303A1 Semiconductor component with an integrated radially symmetrical resistor
04/06/2005EP1520302A1 Technique for fabricating logic elements using multiple gate layers
04/06/2005EP1520299A2 Set of integrated capacitor arrangements, especially integrated grid capacitors
04/06/2005EP1520298A1 Integrated circuit having building blocks
04/06/2005EP1520295A2 Method for making an anisotropic conductive film with pointed conductive inserts
04/06/2005EP1520294A1 Thin-film electronic device, in particular power device, and method for making same
04/06/2005EP1520293A1 Method for the production of a short channel field effect transistor
04/06/2005EP1520291A2 System and method for controlling wafer temperature
04/06/2005EP1520289A1 Dielectric barrier discharge apparatus and process for treating a substrate
04/06/2005EP1520288A2 Multirate processing for metrology of plasma rf source
04/06/2005EP1520287A1 Adjustable implantation angle workpiece support structure for an ion beam implanter