Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
04/2005
04/07/2005US20050075855 Semiconductor integrated circuit device
04/07/2005US20050075854 Simulation circuit pattern evaluation method, manufacturing method of semiconductor integrated circuit, test substrate, and test substrate group
04/07/2005US20050075830 Process parameter based I/O timing programmability using electrical fuse elements
04/07/2005US20050075819 Adaptive lithographic critical dimension enhancement
04/07/2005US20050075751 Proactive staging for distributed material handling
04/07/2005US20050075750 Method and system for analyzing semiconductor fabrication
04/07/2005US20050075052 Method and system for planarizing integrated circuit material
04/07/2005US20050075049 Configuration and method for mounting a backing film to a polish head
04/07/2005US20050074987 Method of manufacturing semiconductor device
04/07/2005US20050074986 Absorber layer for DSA processing
04/07/2005US20050074985 Method of making a vertical electronic device
04/07/2005US20050074984 Method of forming silicon oxide layer and method of manufacturing thin film transistor thereby
04/07/2005US20050074983 Substrate processing apparatus and substrate processing method, high speed rotary valve, and cleaning method
04/07/2005US20050074982 Dielectric layer for semiconductor device and method of manufacturing the same
04/07/2005US20050074981 Increasing the etch resistance of photoresists
04/07/2005US20050074980 Method for forming a ruthenium metal layer
04/07/2005US20050074979 Method for forming ferrocapacitors and FeRAM devices
04/07/2005US20050074978 High-K gate dielectric stack plasma treatment to adjust threshold voltage characteristics
04/07/2005US20050074977 Method and apparatus for dry etching
04/07/2005US20050074976 Method for polishing copper layer and method for forming copper layer wiring using the same
04/07/2005US20050074975 Chemical-mechanical polishing (CMP) slurry and method of planarizing surfaces
04/07/2005US20050074973 Method of fabricating a surface-type optical apparatus
04/07/2005US20050074972 Semiconductor device and method of manufacturing the same
04/07/2005US20050074969 Contact structure of semiconductor device and method of forming the same
04/07/2005US20050074968 Tantalum barrier layer for copper metallization
04/07/2005US20050074967 Polishing method
04/07/2005US20050074966 Local multilayered metallization
04/07/2005US20050074965 Method for fabricating semiconductor device capable of preventing damage by wet cleaning process
04/07/2005US20050074964 [method for fabricating passivation layer]
04/07/2005US20050074963 Fabrication method of a semiconductor device
04/07/2005US20050074962 Lithography-independent fabrication of small openings
04/07/2005US20050074961 Methods for selective integration of airgaps and devices made by such methods
04/07/2005US20050074960 Methods for selective integration of airgaps and devices made by such methods
04/07/2005US20050074959 Novel integration of wire bond pad with Ni/Au metallization
04/07/2005US20050074958 Method of manufacturing a semiconductor device including a bump forming process
04/07/2005US20050074957 Methods for manufacturing stacked gate structure and field effect transistor povided with the same
04/07/2005US20050074956 Absorber layer for DSA processing
04/07/2005US20050074954 Method and apparatus for producing ultra-thin semiconductor chip and method and apparatus for producing ultra-thin back-illuminated solid-state image pickup device
04/07/2005US20050074953 Integrated re-combiner for electroosmotic pumps using porous frits
04/07/2005US20050074952 Method of separating semiconductor wafer, and separating apparatus using the same
04/07/2005US20050074951 Selective heating using flash anneal
04/07/2005US20050074950 Method of manufacturing trench-type MOSFET
04/07/2005US20050074949 Semiconductor device and a method for fabricating the semiconductor device
04/07/2005US20050074948 Method of manufacturing shallow trench isolation structure using HF vapor etching process
04/07/2005US20050074947 Methods for fabricating semiconductor devices
04/07/2005US20050074946 [silicon oxide gap-filling process]
04/07/2005US20050074944 Method for fabricating a capacitor containing metastable polysilicon
04/07/2005US20050074943 [method of fabricating deep trench capacitor]
04/07/2005US20050074942 Amorphizing ion implant method for forming polysilicon emitter bipolar transistor
04/07/2005US20050074941 Method of manufacturing semiconductor device
04/07/2005US20050074940 Method for fabricating a semiconductor device
04/07/2005US20050074939 Process to manufacture nonvolatile MOS memory device
04/07/2005US20050074938 Method for fabricating semiconductor device
04/07/2005US20050074937 Method for fabricating flash memory device
04/07/2005US20050074936 Method of fabricating a semiconductor device including a reaction barrier film, a diffusion barrier film and a ferroelectric film
04/07/2005US20050074935 Non-volatile memory cell fabricated with slight modification to a conventional logic process and methods of operating same
04/07/2005US20050074932 Dual fully-silicided gate mosfets
04/07/2005US20050074931 Method of manufacturing metal-oxide-semiconductor transistor
04/07/2005US20050074930 Method of forming poly-silicon thin film transistors
04/07/2005US20050074929 Method for manufacturing semiconductor device
04/07/2005US20050074928 Semiconductor component, active matrix substrate for a liquid crystal display, and methods of manufacturing such component and substrate
04/07/2005US20050074927 Adhesive bonding with low temperature grown amorphous or polycrystalline compound semiconductors
04/07/2005US20050074926 Method of making non-volatile field effect devices and arrays of same
04/07/2005US20050074925 Method for fabricating a semiconductor device
04/07/2005US20050074924 Circuitized substrate, method of making same and information handling system using same
04/07/2005US20050074922 Process for producing resin-sealed type electronic device
04/07/2005US20050074921 Method of producing semiconductor package, apparatus for producing semiconductor package, and adhesive film
04/07/2005US20050074920 Surface treatment for oxidation removal in integrated circuit package assemblies
04/07/2005US20050074919 Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates
04/07/2005US20050074918 Pad structure for stress relief
04/07/2005US20050074916 Process for manufacturing semiconductor device
04/07/2005US20050074915 Thin-film solar cell fabricated on a flexible metallic substrate
04/07/2005US20050074914 Semiconductor device and method of fabrication the same
04/07/2005US20050074913 Stiction resistant release process
04/07/2005US20050074912 Method for manufacturing solid-state imaging devices
04/07/2005US20050074910 Manufacturing method of semiconductor device
04/07/2005US20050074909 Integrated implant monitor for closed loop control
04/07/2005US20050074907 Semi-conductor wafer fabrication
04/07/2005US20050074905 Inductors in semiconductor devices and methods of manufacturing the same
04/07/2005US20050074708 Method for the manufacture of an active matrix, corresponding electro-optical display devices and mask
04/07/2005US20050074705 Method of forming a resist pattern, method of forming a wiring pattern, method of fabricating a semiconductor device, electro-optic device, and electronic apparatus
04/07/2005US20050074704 Semiconductor fabrication apparatus and pattern formation method using the same
04/07/2005US20050074703 Forming fine patterns of a semiconductor using an electric field to infiltrate an acid produced when a photoresist film is exposed into non-exposure regions
04/07/2005US20050074699 An extremely thin photoresist layer is coated on top of a photosensitive and anti-reflective protective layer of organometallic polymer; stack of the films is selectively exposed to actinic radiation and the latent images on the layers are developed with a common alkaline developer
04/07/2005US20050074695 A resin with substituent group capable of forming a sulfonic acid residue after exposure to heat or light; e.g. ethyl p-styrenesulfonate-containing polymers; lithography; amines and quaternary ammonium hydroxide used as stripping solution for easy removal
04/07/2005US20050074689 Silicon-containing compositions for spin-on arc/hardmask materials
04/07/2005US20050074686 Use in optical applications such as immersion lithography; lower absorbance at wavelengths lower than 250 nm; free of chlorine atoms, even in end groups; made by oxidation of tetrafluoroethylene (TFE) in presence of dilute fluorine gas
04/07/2005US20050074679 Method of manufacturing semiconductor device
04/07/2005US20050074677 Optical proximity correction (OPC); modifying a mask layout to include scattering bars, which increases the amount of scattering bars included in the mask design, while minimizing the number of individual pieces of scattering bars
04/07/2005US20050074676 Chromium oxide film serves as etching stopper formed on diamond film serving as transmitter, and absorptive tungsten layer
04/07/2005US20050074578 Porous adhesive sheet, semiconductor wafer with porous adhesive sheet and method of manufacture thereof
04/07/2005US20050074559 Plating apparatus and method
04/07/2005US20050074558 Process solution supply system and method
04/07/2005US20050074556 Film-forming composition, production process therefor, and porous insulating film
04/07/2005US20050074554 In situ etch back of low-k dielectric layer of organofluorosilicate glass, organosilicate glass or black diamond; reaction with process gas to form an extra element; nitrogen fluoride (NF3) provides nitrogen and carbon fluoride gas provides carbon; nitriding, carbiding; high speed cleaning; semiconductor
04/07/2005US20050074547 Method of using pre-applied underfill encapsulant
04/07/2005US20050074352 Method and system for active purging of pellice volumes
04/07/2005US20050074313 Facility and method for manufacturing semiconductor device and stocker used in the facility
04/07/2005US20050074230 Thermal treatment equipment, thermal treatment method and manufacturing method of image display apparatus
04/07/2005US20050074160 Position detection technique
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