Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
04/2005
04/12/2005US6878632 Semiconductor device having a conductive layer with a cobalt tungsten phosphorus coating and a manufacturing method thereof
04/12/2005US6878631 Abrasive used for planarization of semiconductor device and method of manufacturing semiconductor device using the abrasive
04/12/2005US6878630 Method of manufacturing a wafer
04/12/2005US6878629 Method for detecting CMP endpoint in acidic slurries
04/12/2005US6878628 In situ reduction of copper oxide prior to silicon carbide deposition
04/12/2005US6878627 Semiconductor device with cobalt silicide contacts and method of making the same
04/12/2005US6878625 Method for manufacturing semiconductor device
04/12/2005US6878624 Pre-anneal of CoSi, to prevent formation of amorphous layer between Ti-O-N and CoSi
04/12/2005US6878623 Technique to achieve thick silicide film for ultra-shallow junctions
04/12/2005US6878622 Method for forming SAC using a dielectric as a BARC and FICD enlarger
04/12/2005US6878621 Method of fabricating barrierless and embedded copper damascene interconnects
04/12/2005US6878620 Side wall passivation films for damascene cu/low k electronic devices
04/12/2005US6878619 Method for fabricating semiconductor device
04/12/2005US6878617 Method of forming copper wire on semiconductor device
04/12/2005US6878616 Low-k dielectric material system for IC application
04/12/2005US6878615 Method to solve via poisoning for porous low-k dielectric
04/12/2005US6878614 Methods of forming integrated circuit devices including fuse wires having reduced cross-sectional areas and related structures
04/12/2005US6878613 Field-effect transistor having a contact to one of its doping regions, and method for fabricating the transistor
04/12/2005US6878612 Self-aligned contact process for semiconductor device
04/12/2005US6878611 Patterned strained silicon for high performance circuits
04/12/2005US6878610 Relaxed silicon germanium substrate with low defect density
04/12/2005US6878609 Silicon wafer break pattern, silicon substrate, and method of generating silicon wafer break pattern
04/12/2005US6878608 Method of manufacture of silicon based package
04/12/2005US6878607 Thin film device transfer method, thin film device, thin film integrated circuit device, active matrix board, liquid crystal display, and electronic apparatus
04/12/2005US6878606 Fabrication method and device structure of shallow trench insulation for silicon wafer containing silicon-germanium
04/12/2005US6878605 Methods for manufacturing SOI substrate using wafer bonding and complementary high voltage bipolar transistor using the SOI substrate
04/12/2005US6878604 Semiconductor element comprising a sequence of layers for converting acoustic or thermal signal and electrical voltage changes into each other and method for producing the same
04/12/2005US6878603 Process for manufacturing a DMOS transistor
04/12/2005US6878602 Dielectric cure for reducing oxygen vacancies
04/12/2005US6878601 Method for fabricating a capacitor containing metastable polysilicon
04/12/2005US6878600 Method for fabricating trench capacitors and semiconductor device with trench capacitors
04/12/2005US6878599 Semiconductor device and method of manufacturing the same
04/12/2005US6878598 Method of forming thick metal silicide layer on gate electrode
04/12/2005US6878597 Methods of forming source/drain regions using multilayer side wall spacers and structures so formed
04/12/2005US6878596 Method of forming high voltage junction in semiconductor device
04/12/2005US6878595 Technique for suppression of latchup in integrated circuits (ICS)
04/12/2005US6878594 Semiconductor device having an insulation film with reduced water content
04/12/2005US6878592 Selective epitaxy to improve silicidation
04/12/2005US6878591 Self aligned method of forming non-volatile memory cells with flat word line
04/12/2005US6878589 Method and system for improving short channel effect on a floating gate device
04/12/2005US6878588 Method for fabricating a flash memory cell
04/12/2005US6878587 Method and structure for reducing contact aspect ratios
04/12/2005US6878585 Methods of forming capacitors
04/12/2005US6878584 Flat panel display with high capacitance and method of manufacturing the same
04/12/2005US6878583 Integration method to enhance p+ gate activation
04/12/2005US6878582 Low-GIDL MOSFET structure and method for fabrication
04/12/2005US6878581 Electrostatic discharge protection structure and a method for forming the same
04/12/2005US6878580 Semiconductor device having gate with negative slope and method for manufacturing the same
04/12/2005US6878579 Semiconductor device and method of manufacturing the same
04/12/2005US6878578 Method for forming a high quality chemical oxide on a freshly cleaned silicon surface as a native oxide replacement
04/12/2005US6878577 Method of forming LDD of semiconductor devices
04/12/2005US6878576 Method for making semiconductor device including band-engineered superlattice
04/12/2005US6878575 Method of forming gate oxide layer in semiconductor devices
04/12/2005US6878574 Alloying method for a image display device using laser irradiation
04/12/2005US6878573 Method of manufacturing a semiconductor device and semiconductor device
04/12/2005US6878572 High capacitance package substrate
04/12/2005US6878570 Thin stacked package and manufacturing method thereof
04/12/2005US6878568 CMOS imager and method of formation
04/12/2005US6878565 Process for improving yield of DFB lasers
04/12/2005US6878564 Method of manufacturing a light emitting semiconductor package
04/12/2005US6878562 Method for shifting the bandgap energy of a quantum well layer
04/12/2005US6878560 Fab correlation system
04/12/2005US6878506 Method for manufacturing semiconductor device
04/12/2005US6878465 Under bump metallurgy for Lead-Tin bump over copper pad
04/12/2005US6878435 Adapted for enhancing the adhesion strength of a typical single layer anisotropic conductive film in flip chip bonding; comprising epoxy resin-based film containing conductive particles
04/12/2005US6878417 Molecules adsorb at surfaces in patterns and then the surface is imprinted with the pattern by inducing localized chemical reaction between adsorbate molecules and the surface of the solid
04/12/2005US6878415 Reacting a doped surface layer to form a dielectric film, a metal film or a silicide film having a thickness of 50 angstroms or less.
04/12/2005US6878406 Heating, cooling; reacting with gases during cooling; uniform thickness
04/12/2005US6878402 Method and apparatus for improved temperature control in atomic layer deposition
04/12/2005US6878401 Substrate processing method
04/12/2005US6878396 Micro C-4 semiconductor die and method for depositing connection sites thereon
04/12/2005US6878395 Average surface temperature measured optically and level of the gas cushions regulated by varying the individually controlled gas flow producing the cushions; variations lie within a predetermined temperature window.
04/12/2005US6878303 Substrate processing apparatus and substrate processing method
04/12/2005US6878302 Method of polishing wafers
04/12/2005US6878301 Methods and apparatuses for trench depth detection and control
04/12/2005US6878300 Etching methods, methods of removing portions of material, and methods of forming silicon nitride spacers
04/12/2005US6878259 Immersion in electrolytic cell
04/12/2005US6878249 High frequency sputtering device
04/12/2005US6878241 Method of forming deposited film
04/12/2005US6878234 Plasma processing device and exhaust ring
04/12/2005US6878233 Workpiece holding mechanism
04/12/2005US6878232 Method and apparatus for improving a temperature controlled solution delivery process
04/12/2005US6878216 Substrate processing method and substrate processing system
04/12/2005US6878214 Process endpoint detection in processing chambers
04/12/2005US6878213 Cleaning partially processed metallized wafers with an aqueous anticorrosion agent; carboxylic acids; acetic acid; removal of N-methylpyrrolidinone etch residue removal chemistry
04/12/2005US6878211 Supporting structure for a ceramic susceptor
04/12/2005US6878207 Gas gate for isolating regions of differing gaseous pressure
04/12/2005US6878206 Lid assembly for a processing system to facilitate sequential deposition techniques
04/12/2005US6878202 Method for growing single crystal of compound semiconductor and substrate cut out therefrom
04/12/2005US6878172 Systems employing elevated temperatures to enhance quality control in microelectronic component manufacture
04/12/2005US6878044 Polishing apparatus
04/12/2005US6878036 Apparatus for monitoring a metal layer during chemical mechanical polishing using a phase difference signal
04/12/2005US6877946 Wafer transport apparatus
04/12/2005US6877944 Configuration for transporting a semiconductor wafer carrier
04/12/2005US6877853 Pattern formation method and substrate manufacturing apparatus
04/12/2005US6877668 Marking method for semiconductor wafer
04/12/2005US6877667 Integrated circuit and associated design method with antenna error control using spare gates
04/12/2005US6877650 Compliant wirebond pedestal
04/12/2005US6877648 Ultrasonic horn, and ultrasonic bonding apparatus using the ultrasonic horn
04/12/2005US6877518 Chemical solution treatment apparatus for semiconductor substrate