Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
07/2005
07/19/2005US6919642 Method for bonding IC chips to substrates incorporating dummy bumps and non-conductive adhesive and structures formed
07/19/2005US6919640 Semiconductor device having a contact window including a lower region with a wider width to provide a lower contact resistance
07/19/2005US6919638 Method, structure and process flow to reduce line-line capacitance with low-K material
07/19/2005US6919636 For semiconductor device exhibiting increased operating speed/improved reliability; chemical vapor deposition
07/19/2005US6919634 Solder ball assembly, a method for its manufacture, and a method of forming solder bumps
07/19/2005US6919632 Semiconductor integrated circuit device with I/O cell and connection member
07/19/2005US6919630 Semiconductor package with heat spreader
07/19/2005US6919629 Method and system for integrated circuit packaging
07/19/2005US6919622 For improved signal transduction/reduced electrical noises; for packaging
07/19/2005US6919617 Semiconductor device and manufacturing method thereof
07/19/2005US6919615 Semiconductor device for integrated injection logic cell and process for fabricating the same
07/19/2005US6919612 Biasable isolation regions using epitaxially grown silicon between the isolation regions
07/19/2005US6919611 Semiconductor memory reducing current consumption and narrow channel effect and method of manufacturing the same
07/19/2005US6919610 Power semiconductor device having RESURF layer
07/19/2005US6919608 Spin transistor
07/19/2005US6919607 Structure of two-bit mask read-only memory device and fabricating method thereof
07/19/2005US6919606 Semiconductor device comprising an insulating mask formed on parts of a gate electrode and semiconductor layer crossing an active region
07/19/2005US6919605 Integrated circuit MOS transistor with reduced drain and source resistance
07/19/2005US6919603 Efficient protection structure for reverse pin-to-pin electrostatic discharge
07/19/2005US6919601 Semiconductor device with gate electrode formed on each of three side surfaces of an active layer, and manufacturing method thereof
07/19/2005US6919600 Permanently on transistor implemented using a double polysilicon layer CMOS process with buried contact
07/19/2005US6919597 Bismuth titanium silicon oxide, bismuth titanium silicon oxide thin film, and method for forming the thin film
07/19/2005US6919596 Structure of a capacitive element of a booster circuit included in a semiconductor device and method of manufacturing such a structure
07/19/2005US6919595 Semiconductor memory device
07/19/2005US6919594 Magneto resistive storage device having a magnetic field sink layer
07/19/2005US6919593 Semiconductor memory device and method of fabricating the same
07/19/2005US6919592 Electromechanical memory array using nanotube ribbons and method for making same
07/19/2005US6919590 Heterojunction bipolar transistor with monolithically integrated junction field effect transistor and method of manufacturing same
07/19/2005US6919589 HEMT with a graded InGaAlP layer separating ohmic and Schottky contacts
07/19/2005US6919581 Image display unit and production method thereof
07/19/2005US6919578 Utilizing atomic layer deposition for programmable device
07/19/2005US6919574 Electron beam exposure apparatus, deflection apparatus, and electron beam exposure method
07/19/2005US6919573 Method and apparatus for recycling gases used in a lithography tool
07/19/2005US6919543 Resistive heaters and uses thereof
07/19/2005US6919541 Apparatus for preventing rapid temperature variation during wafer processing
07/19/2005US6919538 Method for thermally treating substrates
07/19/2005US6919533 Method for manufacturing a display device including irradiating overlapping regions
07/19/2005US6919513 For decreasing deformation/damage from contact with sprocket teeth during assembly
07/19/2005US6919508 Build-up structures with multi-angle vias for chip to chip interconnects and optical bussing
07/19/2005US6919420 Thermosetting resins comprising polyepoxides used as reusable wafer underfillings for microelectronic packages
07/19/2005US6919287 Aluminum nitride materials and members used for the production of semiconductors
07/19/2005US6919286 Aluminum nitride ceramics, members for use in a system for producing semiconductors, and corrosion resistant members
07/19/2005US6919284 Protective tape applying method and apparatus, and protective tape separating method
07/19/2005US6919282 Method of fabricating a semiconductor device
07/19/2005US6919281 Method of manufacturing semiconductor device using flexible tube
07/19/2005US6919279 Endpoint detection for high density plasma (HDP) processes
07/19/2005US6919278 Method for etching silicon carbide
07/19/2005US6919277 Deliberate semiconductor film variation to compensate for radial processing differences, determine optimal device characteristics, or produce small productions
07/19/2005US6919276 Method to reduce dishing and erosion in a CMP process
07/19/2005US6919275 Method of preventing diffusion of copper through a tantalum-comprising barrier layer
07/19/2005US6919274 LSI device etching method and apparatus thereof
07/19/2005US6919273 Method for forming TiSiN film, diffusion preventive film comprising TiSiN film, semiconductor device and its production method, and apparatus for forming TiSiN film
07/19/2005US6919272 Method for patterning densely packed metal segments in a semiconductor die and related structure
07/19/2005US6919271 Method for rapidly heating and cooling semiconductor wafers
07/19/2005US6919270 Method of manufacturing silicon carbide film
07/19/2005US6919269 Production method for a semiconductor component
07/19/2005US6919268 Method of manufacturing a WN contact plug
07/19/2005US6919267 Method for forming wiring structure
07/19/2005US6919266 Copper technology for ULSI metallization
07/19/2005US6919265 Semiconductor device with elongated interconnecting member and fabrication method thereof
07/19/2005US6919264 Method for the solder-stop structuring of elevations on wafers
07/19/2005US6919263 High-K dielectric gate material uniquely formed
07/19/2005US6919262 Release sheet and a protective film forming layer of a thermosetting or energy ray-curable component and binder component formed on a detachable surface of the release sheet
07/19/2005US6919261 Method and resulting structure for manufacturing semiconductor substrates
07/19/2005US6919260 Method of manufacturing a substrate having shallow trench isolation
07/19/2005US6919259 Method for STI etching using endpoint detection
07/19/2005US6919258 Semiconductor device incorporating a defect controlled strained channel structure and method of making the same
07/19/2005US6919257 Method of forming a capacitor
07/19/2005US6919256 Method of manufacturing semiconductor device having MIM capacitor
07/19/2005US6919255 Semiconductor trench structure
07/19/2005US6919254 Computer systems, processes for forming a SRAM cell, processes for turning a SRAM cell off, processes for writing a SRAM cell and processes for reading data from a SRAM cell
07/19/2005US6919253 Method of forming a semiconductor device including simultaneously forming a single crystalline epitaxial layer and a polycrystalline or amorphous layer
07/19/2005US6919252 Process for manufacturing MOS semiconductor device having inactive zone with alternating thickness silicon oxide layer
07/19/2005US6919251 Gate dielectric and method
07/19/2005US6919250 Multiple-gate MOS device and method for making the same
07/19/2005US6919249 Semiconductor device and its manufacturing method comprising a trench gate
07/19/2005US6919248 Angled implant for shorter trench emitter
07/19/2005US6919247 Method of fabricating a floating gate
07/19/2005US6919246 Semiconductor device and fabricating method thereof
07/19/2005US6919245 Dynamic random access memory cell layout and fabrication method thereof
07/19/2005US6919244 Method of making a semiconductor device, and semiconductor device made thereby
07/19/2005US6919243 Methods of forming an integrated circuit capacitor in which a metal preprocessed layer is formed on an electrode thereof
07/19/2005US6919242 Mirror image memory cell transistor pairs featuring poly floating spacers
07/19/2005US6919241 Superjunction device and process for its manufacture
07/19/2005US6919239 Method for forming a semiconductor device
07/19/2005US6919238 Silicon on insulator (SOI) transistor and methods of fabrication
07/19/2005US6919237 Process for fabricating thin film transistors
07/19/2005US6919236 Biased, triple-well fully depleted SOI structure, and various methods of making and operating same
07/19/2005US6919235 Semiconductor device having semiconductor circuit comprising semiconductor element, and method for manufacturing same
07/19/2005US6919233 MIM capacitors and methods for fabricating same
07/19/2005US6919232 Process for producing a semiconductor chip
07/19/2005US6919231 Methods of forming channels on an integrated circuit die and die cooling systems including such channels
07/19/2005US6919230 Method of eliminating uncontrolled voids in sheet adhesive layer
07/19/2005US6919229 Method for controlling the depth of immersion of a semiconductor element in an exposed surface of a viscous fluid
07/19/2005US6919228 Methods and apparatus for the detection of damaged regions on dielectric film or other portions of a die
07/19/2005US6919227 Semiconductor part of component mounting, mounting structure and mounting method
07/19/2005US6919226 Method for producing a multi-chip circuit module including a multi-layered wiring section utilizing a via-on-via structure
07/19/2005US6919224 Modified chip attach process and apparatus
07/19/2005US6919223 Method of manufacturing semiconductor resin molding and resin member employed therefor
07/19/2005US6919220 Method of making chip package with grease heat sink