Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
07/2005
07/20/2005CN1643676A Receiving container body for object to be processed
07/20/2005CN1643674A Low temperature dielectric deposition using aminosilane and ozone
07/20/2005CN1643673A Metal organic chemical vapor deposition and atomic layer deposition
07/20/2005CN1643672A Ion implantation of silicon oxide liner to prevent dopant out-diffusion from source/drain extensions
07/20/2005CN1643671A Integrated circuit device and method therefor
07/20/2005CN1643670A Organic compositions
07/20/2005CN1643669A Organic compositions for low dielectric constant material
07/20/2005CN1643667A Film formation method
07/20/2005CN1643666A Plasma processor electrode and plasma processor
07/20/2005CN1643665A Method of plasma etching
07/20/2005CN1643664A Plasma processing method, detecting method of completion of seasoning, plasma processing apparatus
07/20/2005CN1643663A Plasma processing apparatus
07/20/2005CN1643662A System and method of broad band optical end point detection for film change indication
07/20/2005CN1643661A Method of manufacturing nanowires and electronic device
07/20/2005CN1643660A Tantalum barrier removal solution
07/20/2005CN1643659A Surface treatment method, semiconductor device, method of fabricating semiconductor device, and treatment apparatus
07/20/2005CN1643658A Double side polishing device for wafer and double side polishing method
07/20/2005CN1643657A Pressure-sensitive adhesive film for the surface protection of semiconductor wafers and method for protection of semiconductor wafers with the film
07/20/2005CN1643656A Method for deviding substrate
07/20/2005CN1643655A Method for making integrated circuit using memory wordline hard mask extension
07/20/2005CN1643653A Radio-communication-adjustable apparatus, apparatus adjusting method, and apparatus adjusting system
07/20/2005CN1643652A Component mounting method, component mounting apparatus, and ultrasonic bonding head
07/20/2005CN1643651A In-situ integrated dielectric etch process particularly useful for multi-chamber substrate treatment system
07/20/2005CN1643650A Laser assisted direct imprint lithography
07/20/2005CN1643642A Tandem etch chamber plasma processing system
07/20/2005CN1643626A Coil on a semiconductor substrate and method for its production
07/20/2005CN1643616A A volumetric data storage apparatus comprising a plurality of stacked matrix-addressable memory devices
07/20/2005CN1643615A Method for producing a reference layer and an MRAM memory cell provided with said type of reference layer
07/20/2005CN1643613A Data storage circuit, data write method in the data storage circuit, and data storage device
07/20/2005CN1643562A Plasma display panel having trench discharge cell and method of fabricating the same
07/20/2005CN1643532A Management system, method and apparatus for licensed delivery and accounting of electronic circuits
07/20/2005CN1643525A System and method for placement of dummy metal fills while preserving device matching and/or limiting capacitance increase
07/20/2005CN1643454A PH buffered compositions for cleaning semiconductor substrates
07/20/2005CN1643453A Method and apparatus for printing large data flows
07/20/2005CN1643452A Controlling of photolithography overlay incorporating feedforward overlay information
07/20/2005CN1643389A Predictive, adaptive power supply for an integrated circuit under test
07/20/2005CN1643323A Pulsed processing semiconductor heating methods using combinations of heating sources
07/20/2005CN1643322A Heat treatment system and formable vertical chamber
07/20/2005CN1643179A ALD device and method
07/20/2005CN1643178A Low contamination components for semiconductor processing apparatus and methods for making components
07/20/2005CN1643177A Device for handling flat panels in a vacuum
07/20/2005CN1643143A Compositions and methods for the detection, diagnosis and therapy of hematological malignancies
07/20/2005CN1643098A Adhesive film for protection of semiconductor wafer surface and method of protecting semiconductor wafer with the adhesive film
07/20/2005CN1643095A Adhesive compositions containing organic spacers and methods for use thereof
07/20/2005CN1643065A Apparatus and method for cleaning test probes
07/20/2005CN1643045A Method of making a nanoporous film
07/20/2005CN1643025A Organic compositions
07/20/2005CN1643023A No flow underfill composition
07/20/2005CN1642692A Polishing pad support that improves polishing performance and longevity
07/20/2005CN1642688A Laser machining method
07/20/2005CN1642687A Cutting method for workpiece
07/20/2005CN1642665A Removal of contaminants using supercritical processing
07/20/2005CN1642627A Continuous dissolving device, continuous dissolving method, and gas-dissolved water supply
07/20/2005CN1642394A Electronic device and method for producing the same
07/20/2005CN1642393A Electronic devices and methods of forming electronic devices
07/20/2005CN1642392A Methods of forming solder areas on electronic components and electronic components having solder areas
07/20/2005CN1642391A Wire soldering method for circuit board package
07/20/2005CN1642387A Method and apparatus for forming pattern, device and electronic device
07/20/2005CN1642374A Method of manufacturing a mask
07/20/2005CN1641986A Semiconductor integrated circuit for DC-DC converter
07/20/2005CN1641985A Voltage booster circuit, power supply circuit, and liquid crystal driver
07/20/2005CN1641951A Semiconductor device and a method for the manufacture thereof
07/20/2005CN1641895A Method for manufacturing gallium nitride transparent conductive oxide film ohmic electrode
07/20/2005CN1641887A 半导体器件 Semiconductor devices
07/20/2005CN1641885A Semiconductor device and method for fabricating the same
07/20/2005CN1641884A CMOS image sensor and method for fabricating the same
07/20/2005CN1641883A CMOS image sensor and method for fabricating the same
07/20/2005CN1641882A Node contact structures in semiconductor devices and methods of fabricating the same
07/20/2005CN1641881A Electrodes for RRAM memory cells
07/20/2005CN1641880A Method for manufacturing nonvolatile semiconductor memory device
07/20/2005CN1641878A Semiconductor integrated circuit with laminated node contacting structure and mfg. method
07/20/2005CN1641876A Mounting structure in integrated circuit module
07/20/2005CN1641874A 多芯片封装 Multi-chip package
07/20/2005CN1641871A Integrated circuit assembly and mfg. method and 3-D integrated circuit assembly
07/20/2005CN1641861A Method of programming electrons onto a floating gate of a non-volatile memory cell
07/20/2005CN1641860A Method of manufacturing a layer sequence and a method of manufacturing an integrated circuit
07/20/2005CN1641859A Mixed-mode process
07/20/2005CN1641858A Method for magnifying silicon slide unit area metal-dielectric-metal capacitance
07/20/2005CN1641857A Copper metallization technology
07/20/2005CN1641856A Sacrificial inorganic polymer intermetal dielectric damascene wire and via liner
07/20/2005CN1641855A Method for forming contact in semiconductor device
07/20/2005CN1641854A Method of manufacturing a semiconductor device
07/20/2005CN1641853A Inspection device and method for manufacturing the same, method for manufacturing electro-optic device and method for manufacturing semiconductor device
07/20/2005CN1641852A Method for marking test result for electronic package
07/20/2005CN1641851A 半导体装置 Semiconductor device
07/20/2005CN1641850A Method for replanting ball of integrated circuit packaged by ball grid array
07/20/2005CN1641849A Method for manufacturing carrying-plate for packaging flat plastic-sealed ball grid array and its carrying plate
07/20/2005CN1641848A Method and apparatus to increase strain effect in a transistor channel
07/20/2005CN1641847A Semiconductor and method for making same
07/20/2005CN1641846A MOSFET semiconductor and mfg. method
07/20/2005CN1641845A Method for forming finfet field effect transistor
07/20/2005CN1641844A Laser annealing device for preparing polycrystal system membrance layer and method for forming polycrystal system membrance layer
07/20/2005CN1641843A Semiconductor device and manufacturing method thereof
07/20/2005CN1641842A Method for forming conductive bolt
07/20/2005CN1641841A Plasma processing method and apparatus
07/20/2005CN1641840A Chip protection device
07/20/2005CN1641839A Chip protection device
07/20/2005CN1641838A Slot post-processing method and device
07/20/2005CN1641837A Method for manufacturing air bridge by composite glue electric-plating
07/20/2005CN1641836A Method and system for providing a continuous motion sequential lateral solidification