| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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| 07/21/2005 | WO2005067041A1 Wire-bonded integrated circuit package and manufacturing method thereof |
| 07/21/2005 | WO2005067035A1 Method for forming non-amorphous, ultra-thin semiconductor devices using sacrificial implantation layer |
| 07/21/2005 | WO2005067034A1 A cmos device with metal and silicide gate electrodes and a method for making it |
| 07/21/2005 | WO2005067033A1 Methods for integrating replacement metal gate structures |
| 07/21/2005 | WO2005067032A1 Dual damascene process using carbon doped and carbon free oxide layers |
| 07/21/2005 | WO2005067031A1 Ferroelectric thin films and devices comprising thin ferroelectric films |
| 07/21/2005 | WO2005067030A1 Support system for semiconductor wafers and methods thereof |
| 07/21/2005 | WO2005067029A1 Method for packaging integrated circuit dies |
| 07/21/2005 | WO2005067028A1 A semiconductor device and a process for packaging a semiconductor device |
| 07/21/2005 | WO2005067027A1 Replacement gate flow facilitating high yield and incorporation of etch stop layers and/or stressed films |
| 07/21/2005 | WO2005067026A1 A method for making a semiconductor device that includes a metal gate electrode |
| 07/21/2005 | WO2005067025A1 Method of forming wiring structure and semiconductor device |
| 07/21/2005 | WO2005067024A1 Method and apparatus for etching an organic layer |
| 07/21/2005 | WO2005067023A1 Substrate processing apparatus |
| 07/21/2005 | WO2005067022A1 Shower plate, plasma processing system, and process for producing product |
| 07/21/2005 | WO2005067021A1 An amorphous etch stop for the anisotropic etching of substrates |
| 07/21/2005 | WO2005067020A2 A method of varying etch selectivities of a film |
| 07/21/2005 | WO2005067019A1 System and method for selective etching of silicon nitride during substrate processing |
| 07/21/2005 | WO2005067018A1 Method for producing semiconductor device |
| 07/21/2005 | WO2005067016A1 Vaporizer for cvd, solution voporizing cvd system and voporization method for cvd |
| 07/21/2005 | WO2005067015A1 Film forming device and film forming method |
| 07/21/2005 | WO2005067014A1 Strained transistor integration for cmos |
| 07/21/2005 | WO2005067012A1 Exposure method and apparatus, and device producing method |
| 07/21/2005 | WO2005067011A1 Coater/developer and coating/developing method |
| 07/21/2005 | WO2005067009A2 Process controls for improved wafer uniformity using integrated or standalone metrology |
| 07/21/2005 | WO2005067008A2 Method and system for coating polymer solution on a substrate in a solvent saturated chamber |
| 07/21/2005 | WO2005067007A1 A non-dripping nozzle apparatus |
| 07/21/2005 | WO2005067006A1 Methods for adaptive real time control of a thermal processing system |
| 07/21/2005 | WO2005067005A1 Small volume process chamber with hot inner surfaces |
| 07/21/2005 | WO2005066920A1 Display |
| 07/21/2005 | WO2005066717A1 Method and apparatus for removing photoresist from a substrate |
| 07/21/2005 | WO2005066658A1 Ion beam measuring method and ion implanting apparatus |
| 07/21/2005 | WO2005066621A1 Surface acoustic wave sensor assemblies |
| 07/21/2005 | WO2005066579A1 Method and apparatus for measuring fillm thickness by means of coupled eddy sensors |
| 07/21/2005 | WO2005066392A2 Surface structuring by means of a film |
| 07/21/2005 | WO2005066391A1 Copper electrodeposition in microelectronics |
| 07/21/2005 | WO2005066386A2 A method and apparatus for forming a high quality low temperature silicon nitride layer |
| 07/21/2005 | WO2005066325A2 Cleaner compositions containing free radical quenchers |
| 07/21/2005 | WO2005066091A2 High strain point glasses |
| 07/21/2005 | WO2005066087A2 Aluminum silicophosphate glasses |
| 07/21/2005 | WO2005065936A1 Hot pressing ceramic distortion control |
| 07/21/2005 | WO2005065882A1 Laser processing method and device |
| 07/21/2005 | WO2005065881A1 Laser processing method and device |
| 07/21/2005 | WO2005065849A1 Core for washing sponge roller |
| 07/21/2005 | WO2005065436A2 Method and apparatus for maintaining parallelism of layers and/or achieving desired thicknesses of layers during the electrochemical fabrication of structures |
| 07/21/2005 | WO2005065433A2 Electrochemical fabrication methods incorporating dielectric materials and/or using dielectric substrates |
| 07/21/2005 | WO2005065430A2 Electrochemical fabrication methods for producing multilayer structures including the use of diamond machining in the planarization of deposits of material |
| 07/21/2005 | WO2005065425A2 Localized synthesis and self-assembly of nanostructures |
| 07/21/2005 | WO2005065424A2 Micro pin grid array with wiping action |
| 07/21/2005 | WO2005065385A2 Power semiconductor devices and methods of manufacture |
| 07/21/2005 | WO2005065281A2 Articles comprising high-electrical-conductivity nanocomposite material and method for fabricating same |
| 07/21/2005 | WO2005065273A2 System and method for self-leveling heat sink for multiple height devices |
| 07/21/2005 | WO2005065255A2 Semiconductor chip package |
| 07/21/2005 | WO2005065238A2 Micro pin grid array with pin motion isolation |
| 07/21/2005 | WO2005065207A2 Microelectronic packages and methods therefor |
| 07/21/2005 | WO2005065179A2 Method of manufacturing a superjunction device |
| 07/21/2005 | WO2005065144A2 Planarization method of manufacturing a superjunction device |
| 07/21/2005 | WO2005065143A2 Isotopically pure silicon-on-insulator wafers and method of making same |
| 07/21/2005 | WO2005065140A2 Method of manufacturing a superjunction device with conventional terminations |
| 07/21/2005 | WO2005065127A2 A method for forming thick dielectric regions using etched trenches |
| 07/21/2005 | WO2005065089A2 Method of manufacturing a semiconductor component, and semiconductor component formed thereby |
| 07/21/2005 | WO2005065072A2 Electrospray systems and methods |
| 07/21/2005 | WO2005065021A2 Texturing a semiconductor material using negative potential dissolution (npd) |
| 07/21/2005 | WO2005045903A3 Method for making a flat-top pad |
| 07/21/2005 | WO2005043623A3 Method for forming a dielectric on a metallic layer and capacitor assembly |
| 07/21/2005 | WO2005041272A3 Production method and device for improving the bonding between plastic and metal |
| 07/21/2005 | WO2005041271A3 Method and device for fixing a chip in a housing |
| 07/21/2005 | WO2005031846A3 Electrochemical etching process for the selective removal of contaminant phases on the surface of a sulphide-containing chalcopyrite semiconductor |
| 07/21/2005 | WO2005020279A3 Semiconductor device having electrical contact from opposite sides and method therefor |
| 07/21/2005 | WO2005015613A3 Perimeter partition-valve with protected seals |
| 07/21/2005 | WO2005013358A3 Arrangement of an electrical component placed on a substrate, and method for producing the same |
| 07/21/2005 | WO2005010936A3 Edge bead control method and apparatus |
| 07/21/2005 | WO2005008743A3 A semiconductor device with metallic electrodes and a method for use in forming such a device |
| 07/21/2005 | WO2005008739A3 Micellar technology for post-etch residues |
| 07/21/2005 | WO2004097518A3 A method of forming stepped structures employing imprint lithography |
| 07/21/2005 | WO2004078411A3 Method and apparatus for local polishing control |
| 07/21/2005 | WO2004070838A3 Device and method for encapsulating with encapsulating material and electronic component fixed on a carrier |
| 07/21/2005 | WO2004068554A3 Analysis and monitoring of stresses in embedded lines and vias integrated on substrates |
| 07/21/2005 | WO2004053939A3 Integrated circuit structure with improved ldmos design |
| 07/21/2005 | WO2004052785B1 High purity nickel/vanadium sputtering components; and methods of making sputtering components |
| 07/21/2005 | WO2003073357A8 Methods and apparatus for fabricating chip-on-board modules |
| 07/21/2005 | US20050160394 Driven inspection or measurement |
| 07/21/2005 | US20050160393 Method of automatically correcting mask pattern data and program for the same |
| 07/21/2005 | US20050160391 Semiconductor integrated circuit having multi-level interconnection, CAD method and CAD tool for designing the semiconductor integrated circuit |
| 07/21/2005 | US20050160389 Method of protecting a semiconductor integrated circuit from plasma damage |
| 07/21/2005 | US20050160388 Streamlined IC mask layout optical and process correction through correction reuse |
| 07/21/2005 | US20050160383 Combined e-beam and optical exposure semiconductor lithography |
| 07/21/2005 | US20050160381 Designing and fabrication of a semiconductor device |
| 07/21/2005 | US20050160338 Integrated circuit with test circuit |
| 07/21/2005 | US20050160336 Semiconductor LSI circuit with scan circuit, scan circuit system, scanning test system and method |
| 07/21/2005 | US20050159911 Method and apparatus for automatic sensor installation |
| 07/21/2005 | US20050159909 Method of defect review |
| 07/21/2005 | US20050159899 Device and method for monitoring process exhaust gas, semiconductor manufacturing device, and system and method for controlling semiconductor manufacturing device |
| 07/21/2005 | US20050159835 Device for and method of creating a model for determining relationship between process and quality |
| 07/21/2005 | US20050159576 Novel poly(arylene ether) dielectrics |
| 07/21/2005 | US20050159520 An polyacrylate binder, and a solvent system as solid component for protecting base material during etching, characterized by that 70 % or more removed from the base material when subjected to pre-baking thermal stability test |
| 07/21/2005 | US20050159322 Aqueous cleaning solution for integrated circuit device and method of cleaning using the cleaning solution |
| 07/21/2005 | US20050159090 Polishing apparatus |
| 07/21/2005 | US20050159089 Double-side polishing method and apparatus |
| 07/21/2005 | US20050159086 Methods for planarization of group VIII metal-containing surfaces using complexing agents |