Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
08/2005
08/02/2005US6924505 Semiconductor device having a measuring pattern and a method of measuring the semiconductor device using the measuring pattern
08/02/2005US6924500 Semiconductor light-emitting device and process for producing the same
08/02/2005US6924497 Systems for measuring stresses in line features formed on substrates
08/02/2005US6924494 Method of exposing a target to a charged particle beam
08/02/2005US6924492 Lithographic apparatus, device manufacturing method, and device manufactured thereby
08/02/2005US6924482 Method of inspecting pattern and inspecting instrument
08/02/2005US6924463 Pyrometer calibrated wafer temperature estimator
08/02/2005US6924462 Pedestal for flat panel display applications
08/02/2005US6924346 Etch-stop resins
08/02/2005US6924242 SiOC properties and its uniformity in bulk for damascene applications
08/02/2005US6924241 Method of making a silicon nitride film that is transmissive to ultraviolet light
08/02/2005US6924240 Low dielectric constant material, insulating film comprising the low dielectric constant material, and semiconductor device
08/02/2005US6924239 Method for removal of hydrocarbon contamination on gate oxide prior to non-thermal nitridation using “spike” radical oxidation
08/02/2005US6924238 Edge peeling improvement of low-k dielectric materials stack by adjusting EBR resistance
08/02/2005US6924237 Method for manufacturing semiconductor integrated circuit device
08/02/2005US6924236 Manufacturing method of semiconductor device
08/02/2005US6924235 Sidewall smoothing in high aspect ratio/deep etching using a discrete gas switching method
08/02/2005US6924234 Method and apparatus for polishing a copper layer and method for forming a wiring structure using copper
08/02/2005US6924233 Phosphor deposition methods
08/02/2005US6924232 Semiconductor process and composition for forming a barrier material overlying copper
08/02/2005US6924231 Single wafer processing method and system for processing semiconductor
08/02/2005US6924230 Method for forming a conductive layer
08/02/2005US6924229 Method for forming a semiconductor device with a hard mask layer formed over a bit line to protect the bit line during subsequent etching steps
08/02/2005US6924228 Method of forming a via contact structure using a dual damascene technique
08/02/2005US6924227 Slurry for chemical mechanical polishing and method of manufacturing semiconductor device
08/02/2005US6924226 Methods for making multiple seed layers for metallic interconnects
08/02/2005US6924225 Method for producing an electrically conductive contact
08/02/2005US6924224 Method of forming filled blind vias
08/02/2005US6924223 Method of forming a metal layer using an intermittent precursor gas flow process
08/02/2005US6924222 Formation of interconnect structures by removing sacrificial material with supercritical carbon dioxide
08/02/2005US6924221 Integrated process flow to improve copper filling in a damascene structure
08/02/2005US6924220 Self-aligned gate formation using polysilicon polish with peripheral protective layer
08/02/2005US6924219 Method for forming polysilicon germanium layer
08/02/2005US6924218 Sulfide encapsulation passivation technique
08/02/2005US6924217 Method of forming trench in semiconductor device
08/02/2005US6924216 Semiconductor device having improved doping profiles and method of improving the doping profiles of a semiconductor device
08/02/2005US6924215 Method of monitoring high tilt angle of medium current implant
08/02/2005US6924213 Semiconductor device and process for fabricating the same
08/02/2005US6924212 Method for forming a semiconductor
08/02/2005US6924211 Semiconductor chip carrying adhesive tape/sheet, semiconductor chip carrier, semiconductor chip mounting method and semiconductor chip packaging body
08/02/2005US6924210 Chip dicing
08/02/2005US6924209 Method for fabricating an integrated semiconductor component
08/02/2005US6924208 Dual mask capacitor for integrated circuits
08/02/2005US6924207 Method of fabricating a metal-insulator-metal capacitor
08/02/2005US6924206 Method of manufacturing a semiconductor capacitive element in a semiconductor device
08/02/2005US6924205 Collar formation using selective SiGe/Si etch
08/02/2005US6924204 Split gate flash memory cell and manufacturing method thereof
08/02/2005US6924203 Double HBT base metal micro-bridge
08/02/2005US6924202 Heterojunction bipolar transistor with self-aligned emitter and sidewall base contact
08/02/2005US6924201 Heterojunction bipolar transistor and method of producing the same
08/02/2005US6924200 Methods using disposable and permanent films for diffusion and implantation doping
08/02/2005US6924199 Method to form flash memory with very narrow polysilicon spacing
08/02/2005US6924198 Self-aligned trench transistor using etched contact
08/02/2005US6924197 Method of fabricating an integrated circuit with a dielectric layer exposed to a hydrogen-bearing nitrogen source
08/02/2005US6924196 Anti-reflective coating and process using an anti-reflective coating
08/02/2005US6924195 Methods of forming metal-comprising materials and capacitor electrodes; and capacitor constructions
08/02/2005US6924194 DRAM technology compatible processor/memory chips
08/02/2005US6924193 Capacitor
08/02/2005US6924192 Semiconductor device manufacturing method and semiconductor device
08/02/2005US6924191 Method for fabricating a gate structure of a field effect transistor
08/02/2005US6924190 Use of gate electrode workfunction to improve DRAM refresh
08/02/2005US6924189 Method for manufacturing capacitor bottom electrode of semiconductor device
08/02/2005US6924188 Device and method for protecting against oxidation of a conductive layer in said device
08/02/2005US6924187 Method of making a semiconductor device with dummy diffused layers
08/02/2005US6924186 Method of forming a memory device and semiconductor device
08/02/2005US6924184 Semiconductor device and method for forming a semiconductor device using post gate stack planarization
08/02/2005US6924183 Manufacturing method for SOI semiconductor device, and SOI semiconductor device
08/02/2005US6924182 Strained silicon MOSFET having reduced leakage and method of its formation
08/02/2005US6924181 Strained silicon layer semiconductor product employing strained insulator layer
08/02/2005US6924180 Method of forming a pocket implant region after formation of composite insulator spacers
08/02/2005US6924179 Array substrate for a liquid crystal display and method for fabricating thereof
08/02/2005US6924178 Oxide/nitride stacked in FinFET spacer process
08/02/2005US6924177 Method for producing a thyristor
08/02/2005US6924176 Method of manufacturing semiconductor device
08/02/2005US6924172 Method of forming a bond pad
08/02/2005US6924171 Bilayer wafer-level underfill
08/02/2005US6924164 Method of continuous processing of thin-film batteries and like devices
08/02/2005US6924162 Process of manufacturing a semiconductor device
08/02/2005US6924159 Semiconductor substrate made of group III nitride, and process for manufacture thereof
08/02/2005US6924157 Real time particle monitor inside of plasma chamber during resist strip processing
08/02/2005US6924156 Method for forming a ferroelectric capacitor device
08/02/2005US6924155 Ferroelectric memory, method of fabricating the same, semiconductor device, and method of fabricating the same
08/02/2005US6924088 Method and system for realtime CD microloading control
08/02/2005US6924084 Electron exposure to reduce line edge roughness
08/02/2005US6924079 Resist resin, chemical amplification type resist, and method of forming of pattern with the same
08/02/2005US6924078 Multi-oxygen-containing compound which with polymerizable carbon-carbon double bond and ethyleneoxy moiety
08/02/2005US6924072 A photoresist film formed on a peripheral area of a wafer is exposed by radiating a light toward the peripheral area of the wafer and moving the wafer while inspecting for a uniformly radiated predetermined width of the edge
08/02/2005US6924070 Composite patterning integration
08/02/2005US6924068 Photomask fabrication method, photomask, and exposure method thereof
08/02/2005US6924023 Method of manufacturing a structure having pores
08/02/2005US6924016 Assembly system for stationing semiconductor wafer suitable for processing and process for manufacturing semiconductor wafer
08/02/2005US6924012 Vapor deposition; molecular beam epitaxial
08/02/2005US6923923 Metallic nanoparticle cluster ink and method for forming metal pattern using the same
08/02/2005US6923920 Method and compositions for hardening photoresist in etching processes
08/02/2005US6923919 Preethching liquid crystalline polymer; depositing metal
08/02/2005US6923892 Method for electrodeposited film formation, method for electrode formation, and apparatus for electrodeposited film formation
08/02/2005US6923891 FCVA (Filtered Cathodic Vacuum Arc) generates a filtered ion beam and forms a conformal metal coating, even in high aspect ratio visa and trenches; filtered beam of ionised metallic ions under a pulsed, modulalated electrical bias
08/02/2005US6923885 Plasma processing system and apparatus and a sample processing method
08/02/2005US6923882 Compliant pre-form interconnect
08/02/2005US6923869 Device for deposition with chamber cleaner and method for cleaning the chamber