Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
08/2005
08/11/2005US20050173754 Method and apparatus for a flash memory device comprising a source local interconnect
08/11/2005US20050173753 Semiconductor device and method of fabricating the same
08/11/2005US20050173752 Optic mask and manufacturing method of thin film transistor array panel using the same
08/11/2005US20050173751 Semiconductor memory device
08/11/2005US20050173750 Semiconductor device with improved overlay margin and method of manufacturing the same
08/11/2005US20050173749 Trench capacitor with insulating collar, and appropriate method of fabrication
08/11/2005US20050173748 DRAM with very shallow trench isolation
08/11/2005US20050173747 Methods for making semiconductor structures having high-speed areas and high-density areas
08/11/2005US20050173746 Use of gate electrode workfunction to improve DRAM refresh
08/11/2005US20050173745 Capacitor structures, DRAM cell structures, and integrated circuitry, and methods of forming capacitor structures, integrated circuitry and DRAM cell structures
08/11/2005US20050173744 Recessed-type field effect transistor with reduced body effect
08/11/2005US20050173743 Cell arrays of memory devices having extended source strapping regions
08/11/2005US20050173740 Multi-gate transistor formed with active patterns of uniform critical dimension
08/11/2005US20050173739 Semiconductor device and method for manufacturing same
08/11/2005US20050173738 Semiconductor device and manufacturing method of the same
08/11/2005US20050173737 Transflective lcd (liquid crystal display) panel and method of constructing the same
08/11/2005US20050173735 Integrated circuit devices including a depletion barrier layer at source/drain regions and methods of forming the same
08/11/2005US20050173732 Wire for a display device, a method for manufacturing the same, a thin film transistor array panel including the wire, and a method for manufacturing the same
08/11/2005US20050173729 Fabrication method for a semiconductor structure and corresponding semiconductor structure
08/11/2005US20050173728 Nitride heterojunction transistors having charge-transfer induced energy barriers and methods of fabricating the same
08/11/2005US20050173727 Triggered silicon controlled rectifier for RF ESD protection
08/11/2005US20050173724 Group III-nitride based LED having a transparent current spreading layer
08/11/2005US20050173722 Semiconductor device and method for manufacturing the same
08/11/2005US20050173721 Surface-mount type light emitting diode and method for manufacturing it
08/11/2005US20050173717 Light emitting system with high extraction efficency
08/11/2005US20050173715 Nitride semiconductor devices and method of their manufacture
08/11/2005US20050173714 Lighting system with high and improved extraction efficiency
08/11/2005US20050173712 Semiconductor photodetector and its production method
08/11/2005US20050173709 Organic light-emitting diode (OLED) and method of fabrication thereof
08/11/2005US20050173707 Electronic device, display device and production method thereof
08/11/2005US20050173705 Fabrication method of semiconductor device and semiconductor device
08/11/2005US20050173702 Chip mis-position detection method
08/11/2005US20050173701 Transistor, circuit board, display and electronic equipment
08/11/2005US20050173698 Multilayer dielectric tunnel barrier used in magnetic tunnel junction devices, and its method of fabrication
08/11/2005US20050173697 Semiconductor device including a MOSFET having a band-engineered superlattice with a semiconductor cap layer providing a channel
08/11/2005US20050173696 Method for making a semiconductor device including a MOSFET having a band-engineered superlattice with a semiconductor cap layer providing a channel
08/11/2005US20050173695 Method for forming quantum dot, and quantum semiconductor device and method for fabricating the same
08/11/2005US20050173694 Type II quantum well mid-infrared optoelectronic devices
08/11/2005US20050173692 Vertical GaN light emitting diode and method for manufacturing the same
08/11/2005US20050173682 carrier medium and at least one additive such as alkyl polyglycoside, alkyl alcohol, or various ethylene oxide adducts; use at an operating wavelength ranging from 140 nm to 365 nm
08/11/2005US20050173670 Slurry for polishing copper film and method for polishing copper film using the same
08/11/2005US20050173669 Polishing fluid and method of polishing
08/11/2005US20050173657 Contact opening metrology
08/11/2005US20050173656 Radial scan arm and collimator for serial processing of semiconductor wafers with ribbon beams
08/11/2005US20050173655 Multi directional mechanical scanning in an ion implanter
08/11/2005US20050173653 Exposure apparatus and method
08/11/2005US20050173647 Radiation detector assembly, lithographic apparatus, method of determining an amount of radiation, an intensity of the amount of radiation, or an amount of contamination of an optical element, device manufacturing method, and device manufactured thereby
08/11/2005US20050173633 Method of measuring dimensions of pattern
08/11/2005US20050173532 Semiconductor chip with coil antenna and communication system
08/11/2005US20050173498 Brazing filler metal, assembly method for semiconductor device using same, and semiconductor device
08/11/2005US20050173491 System and method for automated wire bonding
08/11/2005US20050173413 Heaters
08/11/2005US20050173412 Systems for heating wafers
08/11/2005US20050173411 Heating resistances and heaters
08/11/2005US20050173410 Ceramic heaters
08/11/2005US20050173404 Method and apparatus for controlling the spatial temperature distribution across the surface of a workpiece support
08/11/2005US20050173403 Method and apparatus for controlling the spatial temperature distribution across the surface of a workpiece support
08/11/2005US20050173396 Heat-treating apparatus and heat-treating method
08/11/2005US20050173386 Light irradiation heat treatment method and light irradiation heat treatment apparatus
08/11/2005US20050173385 Laser processing
08/11/2005US20050173377 Semiconductor wafer, apparatus and process for producing the semiconductor wafer
08/11/2005US20050173374 Electrochemical fabrication methods incorporating dielectric materials and/or using dielectric substrates
08/11/2005US20050173358 Receiving container body for object to be processed
08/11/2005US20050173296 Lid unit for thin-plate holding container, thin-plate holding container, and simplified attaching/detaching mechanism
08/11/2005US20050173288 Packaging structure and component installation method for oscillator
08/11/2005US20050173260 electroconductive surfaces of wafers using solutions comprising wafer holders, pad including an electrode layers having apertures for wetting the surfaces of the wafer and electrodes and a showerhead for applying fluids; semiconductor integrated circuits
08/11/2005US20050173252 electroplating the copper ions from the plating solution directly onto the barrier layer of a microelectronic workpiece; microstructure vias can be filled, forming a uniform layer; annealing at low temperatures
08/11/2005US20050173239 End point detection for sputtering and resputtering
08/11/2005US20050173069 Plasma generating apparatus and plasma processing apparatus
08/11/2005US20050173068 Gas delivery apparatus and method for atomic layer deposition
08/11/2005US20050173067 Plasma etching chamber and plasma etching system using same
08/11/2005US20050173066 Exhaust apparatus, semiconductor device manufacturing system and method for manufacturing semiconductor device
08/11/2005US20050173065 Method of manufacturing semiconductor device, plasma processing apparatus and plasma processing method
08/11/2005US20050173064 Supporting plate has a diameter identical to or larger than that of the substrate to which it is attached and has penetrating holes through which solvent can pass to reach and dissolve the adhesive, allowing the plate to be stripped from the support
08/11/2005US20050173057 Method for bonding substrates and method for irradiating particle beam to be utilized therefor
08/11/2005US20050173052 Using gas generating pressure sensitive adhesive for temporarily secure attachment of workpiece to platform during working; irradiation production of effusing gas for easy detachment
08/11/2005US20050173024 IC die configured to reduce post-fabrication damage to the device. The IC die is formed such that at least a portion of one or more perimeter edges of the die are beveled by an etching process. The semiconductor device may include a plurality of IC dies, at least one of the IC dies being separated from
08/11/2005US20050172998 buried-contact solar cell, in-process buried-contact solar cell components and methods for making buried contact solar cells wherein a self-doping contact material is placed in a plurality of buried-contact surface grooves. steps, the resulting solar cell is cheaper to make
08/11/2005US20050172983 Process for manufacturing component parts, use of same, with air bearing supported workpieces and vacuum processing chamber
08/11/2005US20050172905 Apparatus for reducing entrapment of foreign matter along a moveable shaft of a substrate support
08/11/2005US20050172904 Plasma processing apparatus and plasma processing method
08/11/2005US20050172903 Plasma processing apparatus, process vessel for plasma processing apparatus and dielectric plate for plasma processing apparatus
08/11/2005US20050172901 Plasma processing device
08/11/2005US20050172894 Selective deposition system and method for initiating deposition at a defined starting surface
08/11/2005US20050172891 Dies bonding apparatus and dies bonding method
08/11/2005US20050172888 Method of producing crystalline semiconductor material and method of fabricating semiconductor device
08/11/2005US20050172778 Linear via punch
08/11/2005US20050172704 Methods utilizing scanning probe microscope tips and products thereof or produced thereby
08/11/2005US20050172438 Methods and apparatus for installing a scrubber brush on a mandrel
08/11/2005US20050172430 Scrubbing devices for concurrent scrubbing the entire surface of a thin disk, e.g. semiconductors; compact disks, after the polishing; rolls to support the edge as the wafer rotates in a first plane; an edge-cleaning roll rotates in a second plane at a first non-zero angle to contact an edge bevel
08/11/2005DE4117004B4 Verfahren zur Herstellung einer Schaltungsplatte A process for producing a circuit board
08/11/2005DE19900091B4 Verfahren zur Beseitigung von eingewachsenen Defekten, die bei der Siliciumwaferherstellung entstanden sind sowie Tempervorrichtung zur Durchführung des Verfahrens A process for the removal of grown-in defects which have arisen in the silicon wafer fabrication and annealing apparatus for performing the method
08/11/2005DE10393397T5 Prozesssteuerung auf Ebene der Verbindungsstrukturen Process control at the level of interconnect structures
08/11/2005DE10393394T5 Intelligentes integriertes Lithographiesteuerungssystem auf der Grundlage des Produktaufbaus und Ausbeuterückkopplungssystem Intelligent integrated lithography control system on the basis of the product structure and yield feedback system
08/11/2005DE10393131T5 Verfahren zum Herstellen von Maskenrohlingen, Verfahren zum Herstellen von Transfermasken, Sputtertarget zum Herstellen von Maskenrohlingen A method for producing mask blanks, A method for producing transfer masks, sputtering target for fabricating mask blanks
08/11/2005DE10392658T5 Verfahren zur Herstellung eines Transfermasken-Substrats, Transfermasken-Substrat und Transfermaske A method for producing a transfer mask substrate transfer mask substrate and transfer mask
08/11/2005DE10354389B3 Verfahren zur Herstellung eines nanoskaligen Feldeffekttransistors A process for preparing a nanoscale field-effect transistor
08/11/2005DE10345461B3 Vertically structured separation of process layer by selective sequential gas phase separation involves selectively coating upper trench wall above collar lower edge with process layer, repeatedly alternately applying process fluids
08/11/2005DE10345398B3 Hard mask for anisotropic etching has through openings with greater cross-section in first mask region than in second, transition region arranged between first and second mask regions with continuously reducing opening cross-section
08/11/2005DE10324612B4 Halbleiterspeicher mit Charge-Trapping-Speicherzellen und Virtual-Ground-Architektur Semiconductor memory having charge trapping memory cells and virtual ground architecture